JPWO2012157584A1 - 半導体装置とその製造方法 - Google Patents
半導体装置とその製造方法 Download PDFInfo
- Publication number
- JPWO2012157584A1 JPWO2012157584A1 JP2013515137A JP2013515137A JPWO2012157584A1 JP WO2012157584 A1 JPWO2012157584 A1 JP WO2012157584A1 JP 2013515137 A JP2013515137 A JP 2013515137A JP 2013515137 A JP2013515137 A JP 2013515137A JP WO2012157584 A1 JPWO2012157584 A1 JP WO2012157584A1
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- insulating substrate
- semiconductor device
- base member
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4009—Loop shape
- H01L2224/40095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/842—Applying energy for connecting
- H01L2224/84201—Compression bonding
- H01L2224/84205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/842—Applying energy for connecting
- H01L2224/8421—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/84214—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/8434—Bonding interfaces of the connector
- H01L2224/84345—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
図8(A)は、同図(B)におけるA−A矢視線に沿って示す縦断面図であって、セラミック等の絶縁基板1は、両面に導体パターン2a,2bが接合形成されたDBC(Direct Bonding Copper)基板である。また、絶縁基板1の表面側の銅回路として形成された導体パターン2aには、半田接合によって半導体チップ3がマウントされている。絶縁基板1の裏面側には、導体パターン2aと同様の厚さで接合された導体パターン2bが放熱用ベース部材4に接合され、半導体チップ3の発熱を外部に放出している。また、放熱用ベース部材4は樹脂ケース5の底面を構成しており、そこに大小2枚の絶縁基板1が接合され、樹脂ケース5内に充填されたゲル状の封止材6によって半導体チップ3や内部接続端子7、アルミワイヤ8を保護している。
パワー半導体モジュールなどを対象とした半導体装置内部では、放熱用ベース部材4に接合される導体パターン2bの形状は、通常、この図9に示すように正方形、あるいは長方形となっている。また、一般に半導体チップと金属端子、金属同士、或いは金属端子と絶縁基板上に固着された金属パターンとの配線等がなされる場合でも、互いに接続される各々の部品形状はモジュール外形に合わせる形で、正方形、あるいは長方形のものが採用されていた。そのため、半田付けやろう付けなどで、半導体チップと金属端子、或いは熱膨張係数が異なる金属同士が接続される場合、温度サイクルなどの信頼性試験においてそれぞれの部品相互で熱膨張係数が異なり、角張ったコーナー部においてその接合面に沿って生じる応力が集中するために、半田層やろう材層に割れ目、裂け目等の亀裂(クラック)が進行しやすい。
熱膨張係数が異なる金属部材を接続した場合に、その環境温度が上昇と下降を繰り返すとき、それぞれの金属部材が異なる割合で伸縮するために、それらの間を接合する半田層、あるいはろう材層等には繰り返し応力が加えられて、そこに亀裂が生じやすい。
同図において、X軸は部材の長さ方向、Y軸は部材の厚さ方向を示している。ここで、金属部材11,12は互いに異なる熱膨張係数α1,α2(α1<α2)を有し、縦弾性係数がそれぞれE1,E2であるものとする。また、固着層13はせん断弾性係数をGcとする半田層であって、その厚みをhとする。
ここで、係数AはGc/h・{1/(E2・t2)+1/(E1・t1)}である。
この(1)式によれば、第1、第2の金属部材11,12の厚さt1,t2および第2の金属部材12の長さLが大きいほど、固着層13には大きなせん断歪み率Δγで応力が加わって、そこから亀裂が入りやすくなる。
放熱用ベース部材4と接合される絶縁基板1a,1bの裏面には、それぞれ4個、あるいは10個に分割された導体層2cからなる導体パターンが設けられている。しかも、いずれの導体層2cもコーナー部に丸みを有する矩形のパターン形状をなしている。これにより、個別の導体層2cを放熱用ベース部材4に固着するための半田の固着層13は、その大きさを小さくできる。
このパワー半導体装置は、放熱用ベース部材4と接合される裏面側の導体パターン2bから、その複数に区分された領域毎に放熱用ベース部材4側へ突起する接合部20を備えている。この場合でも、個別の接合部20を放熱用ベース部材4に固着するための半田の固着層13は、その大きさを小さくできる。
ここでは、内部接続端子73は、その各接合部73a,73bに複数の円形突起部7fが形成されている。同様に、外部引出端子9a,9bでも、その接合部91にそれぞれ2個の円形突起部9fが形成されている。
ここには、図2に示す第1の実施の形態の変形例、および図4に示す第2の実施の形態の変形例として、それぞれ絶縁基板1a,1bを放熱用ベース部材4に接合する導体パターン2bの2通りの形状を示している。このうち、図7(A)に示す導体パターン2bは、コーナー部近傍での曲率半径rを有する矩形の接合部として構成され、かつ接合部の各辺には、凹形をなす複数の湾曲部(bend)bが形成されている。この曲率半径rは、実験的に、1mmから10mmの範囲にとるのがよい。
2a,2b 導体パターン
2c 導体層
3 半導体チップ
4 放熱用ベース部材
5 樹脂ケース
6 封止材
7,70,73 内部接続端子
7f,9f 円形突起部
8 アルミワイヤ
9a,9b 外部引出端子
11 第1の金属部材
12 第2の金属部材
13,13a,13b 固着層
20,71,72,73a,73b,91 接合部
90 外部接続導体
図8(A)は、同図(B)におけるA−A矢視線に沿って示す縦断面図であって、セラミック等の絶縁基板1は、両面に導体パターン2a,2bが接合形成されたDBC(Direct Bonding Copper)(東芝マテリアル株式会社の登録商標)基板である。また、絶縁基板1の表面側の銅回路として形成された導体パターン2aには、半田接合によって半導体チップ3がマウントされている。絶縁基板1の裏面側には、導体パターン2aと同様の厚さで接合された導体パターン2bが放熱用ベース部材4に接合され、半導体チップ3の発熱を外部に放出している。また、放熱用ベース部材4は樹脂ケース5の底面を構成しており、そこに大小2枚の絶縁基板1が接合され、樹脂ケース5内に充填されたゲル状の封止材6によって半導体チップ3や内部接続端子7、アルミワイヤ8を保護している。
Claims (9)
- 表裏面に導体パターンを接合形成してなる絶縁基板上にパワー半導体チップをマウントするとともに前記絶縁基板を放熱用ベース部材と接続して、前記パワー半導体チップの発熱を外部に放出可能とする接続構造を有する半導体装置において、
前記放熱用ベース部材と接合された裏面側の前記導体パターンは、その接合部の形状が矩形であって、かつコーナー部近傍で所定の曲率半径を有していることを特徴とする半導体装置。 - 前記パワー半導体チップがマウントされた表面側の前記導体パターンに対して一端が接合される金属端子は、その接合部が円形状に構成されていることを特徴とする請求の範囲第1項記載の半導体装置。
- 前記放熱用ベース部材と接合される前記絶縁基板の裏面には、複数個に分割された導体層からなる導体パターンが設けられていることを特徴とする請求の範囲第1項記載の半導体装置。
- 前記放熱用ベース部材と接合された裏面側の前記導体パターンは、複数に区分された領域毎に前記放熱用ベース部材側に突起する接合部を備えていることを特徴とする請求の範囲第1項記載の半導体装置。
- 前記放熱用ベース部材と接合された裏面側の前記導体パターンは、前記絶縁基板との接合面周縁部での前記導体パターンの厚みが当該接合部中心に比較して薄く形成されていることを特徴とする請求の範囲第1項記載の半導体装置。
- 前記金属端子は、前記パワー半導体チップがマウントされている前記絶縁基板から引き出される外部引出端子であって、
前記外部引出端子の接合部は、表面側の前記導体パターンに対して複数の突起部が設けられていることを特徴とする請求の範囲第2項記載の半導体装置。 - 前記金属端子は、前記パワー半導体チップの表面電極と前記導体パターンとを互いに接続する内部接続端子であって、
前記内部接続端子の各接合部には、複数の突起部が設けられていることを特徴とする請求の範囲第2項記載の半導体装置。 - 絶縁基板上にパワー半導体チップをマウントするとともに前記絶縁基板を放熱用ベース部材と接続して、前記パワー半導体チップの発熱を外部に放出可能とする接続構造を有する半導体装置の製造方法において、
前記絶縁基板の表裏面に導体パターンを接合するとともに、前記絶縁基板の裏面においてはその接合部の形状が矩形であって、かつコーナー部近傍で所定の曲率半径を有する導体パターンを接合する工程と、
前記放熱用ベース部材と前記導体パターンとの間に、前記導体パターンと同じ平面形状で所定の厚みを有するシート状半田を設置して加熱する工程と、
前記シート状半田を固化して、前記導体パターンを前記放熱用ベース部材に接続する半田固着層を生成する工程と、
を備えたことを特徴とする半導体装置の製造方法。 - 絶縁基板上にパワー半導体チップをマウントするとともに前記絶縁基板を放熱用ベース部材と接続して、前記パワー半導体チップの発熱を外部に放出可能とする接続構造を有する半導体装置の製造方法において、
前記絶縁基板の表裏面に導体パターンを接合するとともに、前記絶縁基板の裏面においてはその接合部の形状が矩形であって、かつコーナー部近傍で所定の曲率半径を有する導体パターンを接合する工程と、
前記導体パターンと前記放熱用ベース部材との間をろう付けによって接着する工程と、
を備えたことを特徴とする半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013515137A JP5729468B2 (ja) | 2011-05-13 | 2012-05-11 | 半導体装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011108719 | 2011-05-13 | ||
JP2011108719 | 2011-05-13 | ||
JP2013515137A JP5729468B2 (ja) | 2011-05-13 | 2012-05-11 | 半導体装置 |
PCT/JP2012/062215 WO2012157584A1 (ja) | 2011-05-13 | 2012-05-11 | 半導体装置とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012157584A1 true JPWO2012157584A1 (ja) | 2014-07-31 |
JP5729468B2 JP5729468B2 (ja) | 2015-06-03 |
Family
ID=47176902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013515137A Expired - Fee Related JP5729468B2 (ja) | 2011-05-13 | 2012-05-11 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8957508B2 (ja) |
EP (1) | EP2709149A4 (ja) |
JP (1) | JP5729468B2 (ja) |
CN (1) | CN103477428B (ja) |
WO (1) | WO2012157584A1 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5633581B2 (ja) * | 2011-01-07 | 2014-12-03 | 富士電機株式会社 | 半導体装置およびその製造方法 |
CN103477429B (zh) * | 2011-05-13 | 2017-04-12 | 富士电机株式会社 | 半导体器件及其制造方法 |
DE102012105110A1 (de) * | 2012-06-13 | 2013-12-19 | Osram Opto Semiconductors Gmbh | Montageträger und Verfahren zur Montage eines Montageträgers auf einem Anschlussträger |
JP6210818B2 (ja) * | 2013-09-30 | 2017-10-11 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP6192561B2 (ja) * | 2014-02-17 | 2017-09-06 | 三菱電機株式会社 | 電力用半導体装置 |
JP6395530B2 (ja) * | 2014-09-11 | 2018-09-26 | 三菱電機株式会社 | 半導体装置 |
JP6305302B2 (ja) * | 2014-10-02 | 2018-04-04 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
CN105990265B (zh) * | 2015-02-26 | 2019-04-05 | 台达电子工业股份有限公司 | 功率转换电路的封装模块及其制造方法 |
JP6500162B2 (ja) * | 2015-03-23 | 2019-04-10 | 広東美的制冷設備有限公司Gd Midea Air−Conditioning Equipment Co.,Ltd. | インテリジェントパワーモジュール及びその製造方法 |
CN107683406B (zh) * | 2015-07-07 | 2020-08-07 | 日立汽车系统株式会社 | 半导体器件、力学量测量装置和半导体器件的制造方法 |
US20170084521A1 (en) * | 2015-09-18 | 2017-03-23 | Industrial Technology Research Institute | Semiconductor package structure |
JP6584928B2 (ja) * | 2015-11-16 | 2019-10-02 | 住友電工デバイス・イノベーション株式会社 | 電子装置 |
JP6714831B2 (ja) * | 2016-03-17 | 2020-07-01 | 富士電機株式会社 | 半導体用基板 |
JP6743439B2 (ja) * | 2016-03-18 | 2020-08-19 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP6724449B2 (ja) * | 2016-03-18 | 2020-07-15 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP6621714B2 (ja) * | 2016-07-01 | 2019-12-18 | 三菱電機株式会社 | 半導体装置 |
JP6515886B2 (ja) * | 2016-07-08 | 2019-05-22 | 株式会社豊田自動織機 | 半導体モジュール |
JP6602480B2 (ja) * | 2016-07-26 | 2019-11-06 | 三菱電機株式会社 | 半導体装置 |
WO2018025571A1 (ja) * | 2016-08-05 | 2018-02-08 | 三菱電機株式会社 | パワー半導体装置 |
JP6673100B2 (ja) * | 2016-08-24 | 2020-03-25 | トヨタ自動車株式会社 | 半導体装置 |
JP6870249B2 (ja) * | 2016-09-14 | 2021-05-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
DE112016007432B4 (de) * | 2016-11-11 | 2023-06-22 | Mitsubishi Electric Corporation | Halbleitervorrichtung, Invertereinheit und Automobil |
JP2018182198A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社東芝 | 半導体装置 |
WO2019116457A1 (ja) * | 2017-12-13 | 2019-06-20 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
JP7005373B2 (ja) * | 2018-02-09 | 2022-01-21 | 三菱電機株式会社 | パワーモジュールおよび電力変換装置 |
CN109530838B (zh) * | 2018-12-13 | 2021-05-04 | 武汉凌云光电科技有限责任公司 | 一种激光焊接功率半导体芯片的方法 |
JP2020141023A (ja) * | 2019-02-27 | 2020-09-03 | 株式会社 日立パワーデバイス | 半導体装置 |
JP7274954B2 (ja) * | 2019-06-20 | 2023-05-17 | 新電元工業株式会社 | 半導体装置 |
EP3761357A1 (en) * | 2019-07-04 | 2021-01-06 | Infineon Technologies Austria AG | Semiconductor device |
JP7424026B2 (ja) | 2019-12-13 | 2024-01-30 | 三菱マテリアル株式会社 | 絶縁回路基板 |
KR20220036534A (ko) * | 2020-09-16 | 2022-03-23 | 에스케이하이닉스 주식회사 | 관통 전극을 포함하는 반도체 칩, 및 이 반도체 칩을 포함하는 반도체 패키지 |
CN114975128A (zh) * | 2021-02-25 | 2022-08-30 | 珠海零边界集成电路有限公司 | 一种智能功率模块及其制备方法 |
DE102022201187A1 (de) | 2022-02-04 | 2023-08-10 | Zf Friedrichshafen Ag | Leistungsmodul mit einer thermisch optimierten Verbindungssschicht |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ID19376A (id) * | 1995-06-12 | 1998-07-09 | Matsushita Electric Ind Co Ltd | Paket unit semikonduktor, metode pemaketan unit semikonduktor, dan bahan pengkapsul untuk penggunaan dalam pemaketan unit semikonduktor (pecahan dari p-961658) |
JPH0982844A (ja) | 1995-09-20 | 1997-03-28 | Mitsubishi Electric Corp | 半導体モジュール基板及びその製造方法 |
JP2001308226A (ja) * | 2000-04-24 | 2001-11-02 | Nec Corp | 半導体装置 |
JP4969738B2 (ja) * | 2001-06-28 | 2012-07-04 | 株式会社東芝 | セラミックス回路基板およびそれを用いた半導体モジュール |
US6844621B2 (en) | 2002-08-13 | 2005-01-18 | Fuji Electric Co., Ltd. | Semiconductor device and method of relaxing thermal stress |
JP4124040B2 (ja) | 2002-08-13 | 2008-07-23 | 富士電機デバイステクノロジー株式会社 | 半導体装置 |
JP4100685B2 (ja) * | 2003-08-20 | 2008-06-11 | 富士電機デバイステクノロジー株式会社 | 半導体装置 |
JP2006245436A (ja) * | 2005-03-04 | 2006-09-14 | Hitachi Metals Ltd | 窒化珪素配線基板およびこれを用いた半導体モジュール |
DE102006014609B4 (de) * | 2006-03-29 | 2021-03-18 | Infineon Technologies Ag | Halbleiterbauelementeträger |
JP4945319B2 (ja) * | 2007-05-25 | 2012-06-06 | 昭和電工株式会社 | 半導体装置 |
JP5268786B2 (ja) | 2009-06-04 | 2013-08-21 | 三菱電機株式会社 | 半導体モジュール |
-
2012
- 2012-05-11 JP JP2013515137A patent/JP5729468B2/ja not_active Expired - Fee Related
- 2012-05-11 US US14/110,841 patent/US8957508B2/en not_active Expired - Fee Related
- 2012-05-11 WO PCT/JP2012/062215 patent/WO2012157584A1/ja active Application Filing
- 2012-05-11 EP EP12786707.5A patent/EP2709149A4/en not_active Withdrawn
- 2012-05-11 CN CN201280018242.2A patent/CN103477428B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2709149A4 (en) | 2015-08-05 |
CN103477428A (zh) | 2013-12-25 |
WO2012157584A1 (ja) | 2012-11-22 |
US8957508B2 (en) | 2015-02-17 |
EP2709149A1 (en) | 2014-03-19 |
US20140048918A1 (en) | 2014-02-20 |
CN103477428B (zh) | 2016-10-19 |
JP5729468B2 (ja) | 2015-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5729468B2 (ja) | 半導体装置 | |
WO2012157583A1 (ja) | 半導体装置とその製造方法 | |
JP6433590B2 (ja) | 電力用半導体装置の製造方法および電力用半導体装置 | |
JP2009295959A (ja) | 半導体装置及びその製造方法 | |
JP6423685B2 (ja) | 電子部品、モジュール及びカメラ | |
JP6200759B2 (ja) | 半導体装置およびその製造方法 | |
JP2009059821A (ja) | 半導体装置 | |
JP2012064855A (ja) | 半導体装置 | |
JP2017135183A (ja) | 半導体装置 | |
JP4722514B2 (ja) | 半導体装置および該半導体装置用絶縁基板 | |
JP4645276B2 (ja) | 半導体装置 | |
JP4057407B2 (ja) | 半導体パワーモジュール | |
JP2000277557A (ja) | 半導体装置 | |
JP5145168B2 (ja) | 半導体装置 | |
JP5217013B2 (ja) | 電力変換装置およびその製造方法 | |
JP6304085B2 (ja) | 半導体装置及び半導体装置の製造方法 | |
JP2016134547A (ja) | 半導体装置 | |
JP5674537B2 (ja) | 電気部品モジュール | |
JP2013149739A (ja) | 電子機器モジュール | |
JP6179003B2 (ja) | 半導体装置 | |
JP2006229030A (ja) | リードフレームおよびこれを用いた半導体装置 | |
WO2014045711A1 (ja) | 半導体モジュール | |
JP2005158835A (ja) | 半導体装置 | |
JP2012222200A (ja) | 電子装置 | |
JP2013102252A (ja) | 半導体パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140916 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141114 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150310 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150323 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5729468 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |