JPWO2012157436A1 - セラミック電子部品およびその製造方法 - Google Patents
セラミック電子部品およびその製造方法 Download PDFInfo
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- JPWO2012157436A1 JPWO2012157436A1 JP2013515068A JP2013515068A JPWO2012157436A1 JP WO2012157436 A1 JPWO2012157436 A1 JP WO2012157436A1 JP 2013515068 A JP2013515068 A JP 2013515068A JP 2013515068 A JP2013515068 A JP 2013515068A JP WO2012157436 A1 JPWO2012157436 A1 JP WO2012157436A1
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- 239000000919 ceramic Substances 0.000 title claims abstract description 156
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 230000002093 peripheral effect Effects 0.000 claims abstract description 137
- 239000011247 coating layer Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims description 44
- 239000004020 conductor Substances 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 25
- 238000007650 screen-printing Methods 0.000 claims description 21
- 238000010304 firing Methods 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 229910010272 inorganic material Inorganic materials 0.000 claims description 13
- 239000011147 inorganic material Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 34
- 238000007639 printing Methods 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Abstract
Description
2 セラミック層
3 部品本体
4 内部導体膜
5 ビア導体
6 主面
7,7a,7b 外部端子電極
8 周縁部
9 中央部
10 外部端子電極の表面
11 被覆層
12 被覆層の端部
13 めっき膜
21 セラミックグリーンシート
22,25,28,35,38,41 スクリーン版
Claims (23)
- セラミックをもって構成された部品本体と、
前記部品本体の主面に沿って設けられた外部端子電極と、
を備え、
前記外部端子電極が実装基板に電気的に接続されながら、実装基板上に実装される、セラミック電子部品であって、
前記外部端子電極は、周縁部と前記周縁部によって囲まれた中央部とを備え、前記周縁部の厚みは、前記中央部の厚みよりも厚く、かつ、前記周縁部の少なくとも一部が前記部品本体に埋め込まれている、
セラミック電子部品。 - 前記外部端子電極の表面と前記部品本体の前記主面とが同一面上に位置している、請求項1に記載のセラミック電子部品。
- 前記外部端子電極の前記周縁部の少なくとも一部を覆うように前記部品本体の前記主面に沿って形成された電気絶縁性の被覆層をさらに備える、請求項1または2に記載のセラミック電子部品。
- 前記被覆層の端部は、前記部品本体の前記主面において、前記外部端子電極の前記周縁部のうち最も厚みが厚い部分と接している、請求項3に記載のセラミック電子部品。
- 前記被覆層と前記外部端子電極の表面とが同一面上に位置している、請求項3または4に記載のセラミック電子部品。
- 前記外部端子電極の表面に形成されためっき膜をさらに備える、請求項1ないし5のいずれかに記載のセラミック電子部品。
- 前記外部端子電極の前記中央部と前記周縁部とは、互いに異なる組成を有する、請求項1ないし6のいずれかに記載のセラミック電子部品。
- 前記部品本体は、積層された複数のセラミック層をもって構成され、前記部品本体の内部に配置された内部導体をさらに備える、請求項1ないし7のいずれかに記載のセラミック電子部品。
- セラミックグリーンシートを用意する工程と、
前記セラミックグリーンシートの主面に導電性ペーストを用いて外部端子電極を形成する工程と、
前記外部端子電極が形成された前記セラミックグリーンシートを焼成する工程と、
を備え、
前記外部端子電極を形成する工程は、その周縁部の厚みが、前記周縁部によって囲まれた中央部の厚みよりも厚くなるように、前記外部端子電極を形成する工程を含む、
セラミック電子部品の製造方法。 - 前記外部端子電極を形成する工程は、前記周縁部と前記中央部とをそれぞれ別に形成する工程を含む、請求項9に記載のセラミック電子部品の製造方法。
- 前記周縁部を形成する工程の後に、前記中央部を形成する工程が実施される、請求項10に記載のセラミック電子部品の製造方法。
- 前記中央部を形成する工程の後に、前記周縁部を形成する工程が実施される、請求項10に記載のセラミック電子部品の製造方法。
- 前記周縁部を形成する工程で用いられる導電性ペーストと前記中央部を形成する工程で用いられる導電性ペーストとは、互いに異なる組成を有する、請求項10ないし12のいずれかに記載のセラミック電子部品の製造方法。
- 前記周縁部を形成する工程で用いられる導電性ペーストは、前記中央部を形成する工程で用いられる導電性ペーストに比べて、無機材料の含有量がより多くされる、請求項13に記載のセラミック電子部品の製造方法。
- 前記周縁部を形成する工程で用いられる導電性ペーストは、前記中央部を形成する工程で用いられる導電性ペーストに比べて、有機溶剤の量がより少なくされる、請求項13または14に記載のセラミック電子部品の製造方法。
- 前記焼成する工程の前に、前記外部端子電極が形成された前記セラミックグリーンシートをプレスする工程をさらに備える、請求項9ないし15のいずれかに記載のセラミック電子部品の製造方法。
- 前記プレスする工程は、前記外部端子電極の前記周縁部の少なくとも一部を前記セラミックグリーンシートに埋め込む工程を含む、請求項16に記載のセラミック電子部品の製造方法。
- 前記プレスする工程は、前記外部端子電極の表面が前記セラミックグリーンシートの主面と同一面上に位置するようにプレスする工程を含む、請求項17に記載のセラミック電子部品の製造方法。
- 前記焼成する工程の前に、前記外部端子電極の前記周縁部の少なくとも一部を覆うように前記セラミックグリーンシート上に電気絶縁性の被覆層を形成する工程をさらに備える、請求項9ないし15のいずれかに記載のセラミック電子部品の製造方法。
- 前記被覆層を形成する工程は、絶縁体ペーストをスクリーン印刷により塗布する工程を含む、請求項19に記載のセラミック電子部品の製造方法。
- 前記焼成する工程の前に、前記外部端子電極の表面と前記被覆層の表面とが同一面上に位置するように、前記外部端子電極および前記被覆層が形成された前記セラミックグリーンシートをプレスする工程をさらに備える、請求項19または20に記載のセラミック電子部品の製造方法。
- 前記外部端子電極の表面にめっき膜を形成する工程をさらに備える、請求項9ないし21のいずれかに記載のセラミック電子部品の製造方法。
- 前記セラミックグリーンシートを用意する工程において、複数のセラミックグリーンシートが用意され、前記複数のセラミックグリーンシートのうちの特定のものに対して前記外部端子電極を形成する工程が実施され、さらに、前記複数のセラミックグリーンシートのうちの特定のものに内部導体を形成する工程と、前記外部端子電極が一方の主面上に位置するように、前記複数のセラミックグリーンシートを積層する工程とを備える、請求項9ないし22のいずれかに記載のセラミック電子部品の製造方法。
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