JPWO2010131291A1 - 半導体ウエハ収納容器 - Google Patents
半導体ウエハ収納容器 Download PDFInfo
- Publication number
- JPWO2010131291A1 JPWO2010131291A1 JP2011513125A JP2011513125A JPWO2010131291A1 JP WO2010131291 A1 JPWO2010131291 A1 JP WO2010131291A1 JP 2011513125 A JP2011513125 A JP 2011513125A JP 2011513125 A JP2011513125 A JP 2011513125A JP WO2010131291 A1 JPWO2010131291 A1 JP WO2010131291A1
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- opening
- storage container
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 135
- 235000012431 wafers Nutrition 0.000 claims description 211
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000012856 packing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
図4は、半導体ウエハ収納容器の正面断面図、図5は、図4におけるV−O−V断面を図示している。なお、各断面図において、断面位置より遠方に見える部分の図示は大半が省略されている。
1a 開口部
1b 奥壁
2 蓋体
5 ウエハ保持溝
5a ウエハ移動規制部
6 フロントリテーナ
10 ウエハ保護溝
10a 溝面
10b 谷部
10t 頂部
Q 仮想線
W 半導体ウエハ
Claims (5)
- 複数の半導体ウエハを出し入れするための開口部を備えた容器本体と、
上記開口部を閉塞するように上記開口部に外方から着脱自在に取り付けられる蓋体と、
上記容器本体内において上記複数の半導体ウエハを個別に独立して保持するように上記開口部の両隣に位置する上記容器本体の側壁内面部にあい対向して対をなす状態に設けられ、そこに保持された上記半導体ウエハの外縁部が上記開口部に対向して位置する上記容器本体の奥壁まで達しないように上記半導体ウエハの移動を規制するウエハ移動規制部を備えたウエハ保持溝と、
上記ウエハ保持溝に保持された上記半導体ウエハを上記開口部側から上記奥壁側に弾力的に押圧するように上記蓋体の裏面に配置されたフロントリテーナとを有する半導体ウエハ収納容器であって、
上記ウエハ保持溝に保持された上記各半導体ウエハの外縁部に対向する位置が上記開口部側から最も遠い谷部になっていて、上記半導体ウエハの厚みより広い開口幅を備えた波形の断面形状に形成され、常態では上記波形の頂部どうしを結ぶ仮想線がそこに面する上記各半導体ウエハの外縁部より奥側位置又は同位置にあるように上記容器本体の奥壁部に設けられたウエハ保護溝を備えている、ことを特徴とする半導体ウエハ収納容器。 - 請求項1の半導体ウエハ収納容器において、上記ウエハ保護溝の断面形状が略サインカーブ状に形成されている半導体ウエハ収納容器。
- 請求項1の半導体ウエハ収納容器において、上記ウエハ保護溝が、上記ウエハ保持溝に保持された上記半導体ウエハの軸線と平行方向に二列に互いの列の間に間隔をあけて配置されている半導体ウエハ収納容器。
- 請求項1の半導体ウエハ収納容器において、上記ウエハ保持溝に保持された上記半導体ウエハの軸線に対し平行な向きに見たとき、上記ウエハ保護溝が上記半導体ウエハの外縁と平行な円弧状に形成されている半導体ウエハ収納容器。
- 請求項1の半導体ウエハ収納容器において、上記ウエハ保護溝が上記容器本体と一体成形されている半導体ウエハ収納容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/002073 WO2010131291A1 (ja) | 2009-05-13 | 2009-05-13 | 半導体ウエハ収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010131291A1 true JPWO2010131291A1 (ja) | 2012-11-01 |
JP5186596B2 JP5186596B2 (ja) | 2013-04-17 |
Family
ID=43084690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011513125A Active JP5186596B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体ウエハ収納容器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8453842B2 (ja) |
JP (1) | JP5186596B2 (ja) |
KR (1) | KR101165613B1 (ja) |
CN (1) | CN102362340B (ja) |
DE (1) | DE112009004765B4 (ja) |
TW (1) | TWI463595B (ja) |
WO (1) | WO2010131291A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI541177B (zh) * | 2010-10-19 | 2016-07-11 | 安堤格里斯公司 | 具晶圓緩衝件之前開式晶圓容器 |
CN106941087B (zh) | 2011-08-12 | 2020-03-10 | 恩特格里斯公司 | 晶片载具 |
CN104255031B (zh) | 2012-02-29 | 2017-12-22 | Lg 电子株式会社 | 层间预测方法和使用层间预测方法的装置 |
TWM453240U (zh) * | 2013-01-10 | 2013-05-11 | Gudeng Prec Ind Co Ltd | 具有保護套的限制件 |
KR102098306B1 (ko) * | 2013-02-20 | 2020-04-08 | 삼성디스플레이 주식회사 | 기판 수납 장치 |
WO2014136247A1 (ja) * | 2013-03-07 | 2014-09-12 | ミライアル株式会社 | 基板収納容器 |
JP6430195B2 (ja) * | 2014-09-29 | 2018-11-28 | 株式会社Screenホールディングス | 基板収納容器 |
CN107735856B (zh) * | 2015-07-03 | 2021-11-30 | 未来儿株式会社 | 基板收纳容器 |
TWM553052U (zh) * | 2017-08-31 | 2017-12-11 | Chung King Enterprise Co Ltd | 晶圓運載盒及用於晶圓運載盒的下保持件 |
JP7231142B2 (ja) * | 2019-04-08 | 2023-03-01 | 信越ポリマー株式会社 | 基板収納容器 |
JP7445741B2 (ja) * | 2019-07-19 | 2024-03-07 | インテグリス・インコーポレーテッド | ウェハクッション、ウェハキャリアおよびウェハを支持する方法 |
US20220384227A1 (en) * | 2021-05-27 | 2022-12-01 | Entegris, Inc. | Semiconductor substrate carrying container with increased diameter purge ports |
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US5816410A (en) * | 1994-07-15 | 1998-10-06 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
JPH09107026A (ja) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | ウェーハ収納容器のウェーハカセット |
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
JP2000068363A (ja) | 1998-08-26 | 2000-03-03 | Kakizaki Mamufacuturing Co Ltd | 薄板収納・輸送容器 |
US5992638A (en) * | 1998-11-11 | 1999-11-30 | Empak, Inc. | Advanced wafer shipper |
US6082540A (en) * | 1999-01-06 | 2000-07-04 | Fluoroware, Inc. | Cushion system for wafer carriers |
JP4372313B2 (ja) * | 2000-06-20 | 2009-11-25 | 信越ポリマー株式会社 | 基板収納容器 |
US6951284B2 (en) * | 2001-11-14 | 2005-10-04 | Entegris, Inc. | Wafer carrier with wafer retaining system |
US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
KR100615761B1 (ko) * | 2002-09-11 | 2006-08-28 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
JP4233392B2 (ja) * | 2003-06-12 | 2009-03-04 | 信越ポリマー株式会社 | 基板収納容器 |
US7100772B2 (en) * | 2003-11-16 | 2006-09-05 | Entegris, Inc. | Wafer container with door actuated wafer restraint |
JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
JP4540529B2 (ja) * | 2005-04-18 | 2010-09-08 | 信越ポリマー株式会社 | 収納容器 |
JP4450766B2 (ja) * | 2005-04-21 | 2010-04-14 | 信越ポリマー株式会社 | 補強キャリアの製造方法 |
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JP5270668B2 (ja) * | 2008-04-25 | 2013-08-21 | 信越ポリマー株式会社 | リテーナ、及びリテーナを備えた基板収納容器 |
-
2009
- 2009-05-13 JP JP2011513125A patent/JP5186596B2/ja active Active
- 2009-05-13 DE DE112009004765.3T patent/DE112009004765B4/de active Active
- 2009-05-13 US US13/266,029 patent/US8453842B2/en active Active
- 2009-05-13 KR KR1020097019449A patent/KR101165613B1/ko active IP Right Grant
- 2009-05-13 WO PCT/JP2009/002073 patent/WO2010131291A1/ja active Application Filing
- 2009-05-13 CN CN2009801582064A patent/CN102362340B/zh active Active
-
2010
- 2010-05-12 TW TW099115118A patent/TWI463595B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201041081A (en) | 2010-11-16 |
JP5186596B2 (ja) | 2013-04-17 |
TWI463595B (zh) | 2014-12-01 |
CN102362340A (zh) | 2012-02-22 |
DE112009004765T5 (de) | 2012-10-11 |
KR101165613B1 (ko) | 2012-07-16 |
DE112009004765B4 (de) | 2018-12-13 |
KR20100133880A (ko) | 2010-12-22 |
US20120043254A1 (en) | 2012-02-23 |
US8453842B2 (en) | 2013-06-04 |
CN102362340B (zh) | 2013-12-25 |
WO2010131291A1 (ja) | 2010-11-18 |
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