JPWO2008041334A1 - 電子部品試験装置 - Google Patents
電子部品試験装置 Download PDFInfo
- Publication number
- JPWO2008041334A1 JPWO2008041334A1 JP2007540849A JP2007540849A JPWO2008041334A1 JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1 JP 2007540849 A JP2007540849 A JP 2007540849A JP 2007540849 A JP2007540849 A JP 2007540849A JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1
- Authority
- JP
- Japan
- Prior art keywords
- under test
- electronic device
- device under
- test
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 424
- 230000007246 mechanism Effects 0.000 claims description 88
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 239000002243 precursor Substances 0.000 claims description 36
- 238000003860 storage Methods 0.000 claims description 19
- 238000013459 approach Methods 0.000 claims description 16
- 230000003028 elevating effect Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 description 26
- 238000012546 transfer Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000002950 deficient Effects 0.000 description 6
- 230000009191 jumping Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 102100032306 Aurora kinase B Human genes 0.000 description 1
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 101000798007 Homo sapiens RAC-gamma serine/threonine-protein kinase Proteins 0.000 description 1
- 102100032314 RAC-gamma serine/threonine-protein kinase Human genes 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/319870 WO2008041334A1 (en) | 2006-10-04 | 2006-10-04 | Electronic component testing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2008041334A1 true JPWO2008041334A1 (ja) | 2010-02-04 |
Family
ID=39268202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007540849A Ceased JPWO2008041334A1 (ja) | 2006-10-04 | 2006-10-04 | 電子部品試験装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2008041334A1 (enrdf_load_stackoverflow) |
KR (2) | KR100942527B1 (enrdf_load_stackoverflow) |
CN (1) | CN101258415B (enrdf_load_stackoverflow) |
TW (1) | TW200821599A (enrdf_load_stackoverflow) |
WO (1) | WO2008041334A1 (enrdf_load_stackoverflow) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
JP2013137285A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
CN106405369A (zh) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | 电子部件输送装置以及电子部件检查装置 |
CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
WO2004109305A1 (ja) * | 2003-06-06 | 2004-12-16 | Advantest Corporation | 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
-
2006
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja active Application Filing
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
WO2004109305A1 (ja) * | 2003-06-06 | 2004-12-16 | Advantest Corporation | 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100942527B1 (ko) | 2010-02-12 |
WO2008041334A1 (en) | 2008-04-10 |
KR20080057206A (ko) | 2008-06-24 |
CN101258415A (zh) | 2008-09-03 |
KR20100017827A (ko) | 2010-02-16 |
TWI345063B (enrdf_load_stackoverflow) | 2011-07-11 |
TW200821599A (en) | 2008-05-16 |
CN101258415B (zh) | 2011-01-19 |
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