TWI345063B - - Google Patents
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- Publication number
- TWI345063B TWI345063B TW096132855A TW96132855A TWI345063B TW I345063 B TWI345063 B TW I345063B TW 096132855 A TW096132855 A TW 096132855A TW 96132855 A TW96132855 A TW 96132855A TW I345063 B TWI345063 B TW I345063B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- tested
- component
- holding
- tray
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 210
- 230000007246 mechanism Effects 0.000 claims description 75
- 238000001179 sorption measurement Methods 0.000 claims description 38
- 238000012545 processing Methods 0.000 claims description 31
- 238000003860 storage Methods 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 2
- 230000009466 transformation Effects 0.000 claims description 2
- 238000012937 correction Methods 0.000 claims 1
- 235000015170 shellfish Nutrition 0.000 claims 1
- 238000011068 loading method Methods 0.000 description 28
- 238000005470 impregnation Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 9
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000015654 memory Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000013102 re-test Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 102100032306 Aurora kinase B Human genes 0.000 description 1
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 101000798007 Homo sapiens RAC-gamma serine/threonine-protein kinase Proteins 0.000 description 1
- 102100032314 RAC-gamma serine/threonine-protein kinase Human genes 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000011426 transformation method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319870 WO2008041334A1 (en) | 2006-10-04 | 2006-10-04 | Electronic component testing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200821599A TW200821599A (en) | 2008-05-16 |
| TWI345063B true TWI345063B (enrdf_load_stackoverflow) | 2011-07-11 |
Family
ID=39268202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096132855A TW200821599A (en) | 2006-10-04 | 2007-09-04 | Electronic component testing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2008041334A1 (enrdf_load_stackoverflow) |
| KR (2) | KR20100017827A (enrdf_load_stackoverflow) |
| CN (1) | CN101258415B (enrdf_load_stackoverflow) |
| TW (1) | TW200821599A (enrdf_load_stackoverflow) |
| WO (1) | WO2008041334A1 (enrdf_load_stackoverflow) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
| JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
| JP2013137285A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
| KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
| TW201715243A (zh) * | 2015-07-31 | 2017-05-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
| CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
| KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
| JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
| JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のｉｃハンドラ装置 |
| KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| WO2004108366A1 (ja) * | 2003-06-06 | 2004-12-16 | Advantest Corporation | 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法 |
-
2006
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja active Application Filing
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR100942527B1 (ko) | 2010-02-12 |
| TW200821599A (en) | 2008-05-16 |
| KR20100017827A (ko) | 2010-02-16 |
| KR20080057206A (ko) | 2008-06-24 |
| CN101258415A (zh) | 2008-09-03 |
| JPWO2008041334A1 (ja) | 2010-02-04 |
| WO2008041334A1 (en) | 2008-04-10 |
| CN101258415B (zh) | 2011-01-19 |
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