KR20100017827A - 전자부품 시험장치 - Google Patents
전자부품 시험장치 Download PDFInfo
- Publication number
- KR20100017827A KR20100017827A KR1020097026216A KR20097026216A KR20100017827A KR 20100017827 A KR20100017827 A KR 20100017827A KR 1020097026216 A KR1020097026216 A KR 1020097026216A KR 20097026216 A KR20097026216 A KR 20097026216A KR 20100017827 A KR20100017827 A KR 20100017827A
- Authority
- KR
- South Korea
- Prior art keywords
- test
- electronic component
- tray
- under test
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 359
- 238000012546 transfer Methods 0.000 abstract description 12
- 239000011295 pitch Substances 0.000 description 90
- 230000007246 mechanism Effects 0.000 description 63
- 238000000034 method Methods 0.000 description 27
- 238000006243 chemical reaction Methods 0.000 description 21
- 238000001179 sorption measurement Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 238000003860 storage Methods 0.000 description 10
- 230000004308 accommodation Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 230000035939 shock Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000008642 heat stress Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 102100032306 Aurora kinase B Human genes 0.000 description 1
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 101000798007 Homo sapiens RAC-gamma serine/threonine-protein kinase Proteins 0.000 description 1
- 102100032314 RAC-gamma serine/threonine-protein kinase Human genes 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319870 WO2008041334A1 (en) | 2006-10-04 | 2006-10-04 | Electronic component testing apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077024582A Division KR100942527B1 (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100017827A true KR20100017827A (ko) | 2010-02-16 |
Family
ID=39268202
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097026216A Withdrawn KR20100017827A (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
| KR1020077024582A Active KR100942527B1 (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077024582A Active KR100942527B1 (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2008041334A1 (enrdf_load_stackoverflow) |
| KR (2) | KR20100017827A (enrdf_load_stackoverflow) |
| CN (1) | CN101258415B (enrdf_load_stackoverflow) |
| TW (1) | TW200821599A (enrdf_load_stackoverflow) |
| WO (1) | WO2008041334A1 (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150041682A (ko) * | 2013-10-08 | 2015-04-17 | (주)테크윙 | 테스트핸들러 |
| KR20190082173A (ko) * | 2019-06-20 | 2019-07-09 | (주)테크윙 | 테스트핸들러 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
| JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
| JP2013137285A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
| KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
| CN106405369A (zh) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | 电子部件输送装置以及电子部件检查装置 |
| CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
| KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
| JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
| JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
| KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| AU2003242260A1 (en) * | 2003-06-06 | 2005-01-04 | Advantest Corporation | Transport device, electronic component handling device, and transporting method for electronic component handling device |
-
2006
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja active Application Filing
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150041682A (ko) * | 2013-10-08 | 2015-04-17 | (주)테크윙 | 테스트핸들러 |
| KR20190082173A (ko) * | 2019-06-20 | 2019-07-09 | (주)테크윙 | 테스트핸들러 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI345063B (enrdf_load_stackoverflow) | 2011-07-11 |
| WO2008041334A1 (en) | 2008-04-10 |
| TW200821599A (en) | 2008-05-16 |
| KR100942527B1 (ko) | 2010-02-12 |
| CN101258415B (zh) | 2011-01-19 |
| JPWO2008041334A1 (ja) | 2010-02-04 |
| KR20080057206A (ko) | 2008-06-24 |
| CN101258415A (zh) | 2008-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20091216 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |