JPWO2008015738A1 - 基板検査・修正装置、および基板評価システム - Google Patents

基板検査・修正装置、および基板評価システム Download PDF

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Publication number
JPWO2008015738A1
JPWO2008015738A1 JP2008527612A JP2008527612A JPWO2008015738A1 JP WO2008015738 A1 JPWO2008015738 A1 JP WO2008015738A1 JP 2008527612 A JP2008527612 A JP 2008527612A JP 2008527612 A JP2008527612 A JP 2008527612A JP WO2008015738 A1 JPWO2008015738 A1 JP WO2008015738A1
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JP
Japan
Prior art keywords
substrate
inspection
defect
correction
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008527612A
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English (en)
Japanese (ja)
Inventor
敦夫 中谷
敦夫 中谷
真 篠原
真 篠原
晋一 黒田
晋一 黒田
大輔 今井
大輔 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of JPWO2008015738A1 publication Critical patent/JPWO2008015738A1/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
JP2008527612A 2006-08-01 2006-08-01 基板検査・修正装置、および基板評価システム Pending JPWO2008015738A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/315220 WO2008015738A1 (fr) 2006-08-01 2006-08-01 Dispositif d'inspection et de réparation de substrat et système d'évaluation de substrat

Publications (1)

Publication Number Publication Date
JPWO2008015738A1 true JPWO2008015738A1 (ja) 2009-12-17

Family

ID=38996926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008527612A Pending JPWO2008015738A1 (ja) 2006-08-01 2006-08-01 基板検査・修正装置、および基板評価システム

Country Status (4)

Country Link
JP (1) JPWO2008015738A1 (fr)
KR (1) KR101051730B1 (fr)
CN (1) CN101461063B (fr)
WO (1) WO2008015738A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566739B (zh) * 2008-04-25 2011-07-20 北京京东方光电科技有限公司 阵列电路维修系统及维修方法
JP5408540B2 (ja) * 2009-10-28 2014-02-05 株式会社島津製作所 Ｔｆｔアレイの検査方法及びｔｆｔアレイ検査装置
JP5590043B2 (ja) * 2009-12-10 2014-09-17 株式会社島津製作所 Ｔｆｔ基板検査装置およびｔｆｔ基板検査方法
KR101250126B1 (ko) * 2010-07-14 2013-04-03 (주)쎄미시스코 복수의 기판들을 검사하는 방법 및 시스템
US8995747B2 (en) 2010-07-29 2015-03-31 Sharp Laboratories Of America, Inc. Methods, systems and apparatus for defect detection and classification
CN102829858B (zh) * 2011-06-15 2014-09-10 上海天马微电子有限公司 光传感器阵列面板的缺陷检测修复装置及其方法
CN103018162B (zh) * 2011-09-22 2016-07-06 致茂电子股份有限公司 一种处理用于测试的影像数据的系统及方法
JP2013257208A (ja) * 2012-06-12 2013-12-26 Sharp Corp 欠陥原因工程分析装置および欠陥原因工程分析方法
KR101398692B1 (ko) * 2012-09-11 2014-05-27 삼성디스플레이 주식회사 표시 장치의 수리 장치 및 그 방법
CN104765691B (zh) * 2015-04-23 2017-05-24 武汉精测电子技术股份有限公司 液晶模组的修正代码判断方法
KR101682520B1 (ko) * 2015-07-02 2016-12-06 참엔지니어링(주) 검사장치 및 피처리물 검사방법
CN107567199B (zh) * 2016-06-30 2020-01-07 Oht株式会社 非接触型电路图案检查修复装置
JP6476234B2 (ja) * 2016-06-30 2019-02-27 オー・エイチ・ティー株式会社 非接触型回路パターン検査修復装置
CN106112161A (zh) * 2016-07-17 2016-11-16 安徽卓越电气有限公司 一种壁挂式充电桩基板修正工艺
CN106338252B (zh) * 2016-09-28 2019-05-03 铜陵市铜创电子科技有限公司 一种金属化薄膜缺陷的在线检测-裁切方法
CN107389689B (zh) * 2017-07-26 2020-05-22 武汉精测电子集团股份有限公司 一种用于缺陷检测的aoi管理系统及管理方法
CN109799630B (zh) * 2019-03-07 2021-09-03 Tcl华星光电技术有限公司 玻璃基板重测重修系统及其方法
CN110082974B (zh) * 2019-04-08 2021-11-02 Tcl华星光电技术有限公司 阵列基板修补系统及其方法
JP7051244B2 (ja) * 2019-04-19 2022-04-11 Ckd株式会社 メンテナンス支援システム
CN111427176B (zh) * 2020-04-28 2022-12-23 深圳市华星光电半导体显示技术有限公司 面板的检测系统及检测方法
CN114594623B (zh) * 2022-04-20 2024-04-12 合肥京东方显示技术有限公司 液晶面板的修复装置和修复方法
CN114818604B (zh) * 2022-06-29 2022-10-11 飞腾信息技术有限公司 一种用于修正数字版图上短路缺陷的方法以及装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682801A (ja) * 1992-08-31 1994-03-25 Ntn Corp 欠陥検査修正装置
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
JPH09146116A (ja) * 1995-11-21 1997-06-06 Toshiba Corp 液晶表示装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4090567B2 (ja) * 1998-05-11 2008-05-28 株式会社日立製作所 ウエハ検査加工装置およびウエハ検査加工方法
KR100397594B1 (ko) * 1999-03-08 2003-09-13 마쯔시다덴기산교 가부시키가이샤 액정 표시 장치 및 그 검사 방법
TWI264043B (en) * 2002-10-01 2006-10-11 Tokyo Electron Ltd Method and system for analyzing data from a plasma process
JP4418272B2 (ja) * 2004-03-24 2010-02-17 オリンパス株式会社 欠陥分類辞書教示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682801A (ja) * 1992-08-31 1994-03-25 Ntn Corp 欠陥検査修正装置
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
JPH09146116A (ja) * 1995-11-21 1997-06-06 Toshiba Corp 液晶表示装置及びその製造方法

Also Published As

Publication number Publication date
WO2008015738A1 (fr) 2008-02-07
CN101461063B (zh) 2011-12-28
KR101051730B1 (ko) 2011-07-25
KR20090006205A (ko) 2009-01-14
CN101461063A (zh) 2009-06-17

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