1273232 九、發明說明： 【發明所屬之技術領域】 本發明係屬於一種光學檢測系統及方法，尤其是屬於 一種可對一基板同時進行複數個缺陷檢測作業之自動化光 學檢測系統及方法。 【先前技術】 對於平面顯示器產業而言，為提高產品品質與降低成 本’廠商必須在生產流程完成前或完成後進行缺陷檢測， 以期發現產生缺陷之原因而加以解決。這些缺陷檢測作業 除電性檢測外，外觀及表面瑕疵檢測也是必要項目，而隨 著電子元件大型化和細線化的趨勢，以及生產線速度需求 愈來愈快，人工目視檢測已無法符合品質與速度的要求。 此日寸’自動化光學檢測（Automat ic Opt i cal Inspect ion， A〇I)即成為快速檢測外觀及表面瑕疵之利器。自動化光學 檢測技術不僅可用做終端產品品管，也能協助製程監控， 以早期採取補正措施。 然而’先前技術之A0I檢測裝置及方法大部分是屬於 即時檢測之自動化檢測裝置及方法，而不能顯示被檢測基 板之全面影像。因為沒有基板的全面影像，所以先前技術 若遇到被檢測之基板上的成膜圖案尺寸不同時，就沒辦法 進行檢測。即使先前技術嘗試以數值輸入之方式來=作成 膜圖案尺寸不同的基板之檢測區域，但因為無法取得基板 1273232 的全面影像，所以先前技術無法確認檢測區域是否設定正 確，從而無法保證檢測之正確性。 再者，先前技術之AOI檢測裝置及方法通常只能就比 杈法、微分法、差分法其中的一種來進行缺陷檢測，而不 能同時進行多種檢測。雖然有些先前技術之A〇I檢測裝置 及方法可以進行微小缺陷以及巨大缺陷的檢測作業，但這 些先前技術都只是執行-種檢測作業，再算出檢測出的缺 陷晝素，而將具較少缺陷畫素者區分為微小缺陷，具較多 缺陷晝素者區分為巨大缺陷。這種方法只是單純地區分缺_ 陷的大小’而無法個別設定微小缺陷以及巨大缺陷的檢測 感應度，也無法保證檢測之正確性。 因此，有必要提供一種光學檢測裝置及方法，以有效 地檢測具有不同尺寸大小之成膜圖案之基板；同時，亦有 必要提供-種光學檢測裝置及方法，以同時進行複數個不 同的缺陷檢測作業，以增加檢測之正確性。 【發明内容】 釔於先别才支術無法對基板進行才复數個檢測作業之問 遞，本發明乃提供一種fg | fg] @γ ' 作業之光學檢測系統及時進仃讀個缺陷檢測 =光要包含：—影像取得單元、 =入=4^、—中央處理單元、"·^腦數值控制單元、 此電性連接。 各個早疋並猎由—VME匯流排而彼 6 1273232 在本發明之一實施例中，基板可以是LCD顯示器基板、 PDP顯示器基板、有機電激發光（〇rganic el)顯示器基板、 彩色濾鏡基板、晶圓、玻璃基板或者其他種類的基板。 在本發明之一貫施例中，電腦數值控制單元包含一 軸平台，以將被檢測之基板搬送至影像取得單元；以及一 檢視鏡頭，用以檢視並確認基板上之缺陷是否正確。 在本發明之一實施例中，影像取得單元較佳者則複數 個串列或並列之感光耦合元件（CCD)。影像取得單元所取得 之全面景;^像經由影像處理單元進行缺陷檢測作業後，可透 過VME匯流排連同有關缺陷之資訊傳送並顯示在影像顯示 單元上。同時，相關之資訊亦可透過VME匯流排傳送至中央 處理單元，以供藉由網路傳送至缺陷情報管理系統以進行 資料管理、外部通信及統計處理等作業。 本發明之光學檢測方法主要包含以下步驟： •首先，藉由光學檢測系統之輸送機構提供被檢測之基 板； 其次’藉由影像取得單元取得基板之全面影像； 接著，藉由影像處理單元儲存該全面影像； 接著，藉由影像處理單元對該全面影像進行複數個缺 陷檢測作業；以及 、 一最後，將檢測過後之全面影像以及有關缺陷之資料顯 示在影像顯示單元上。 、’ 在本發明之一實施例中，本發明之複數個缺陷檢測作 業包含以下各種情形： ★為在全面影像上設定一檢測區域，並且針對檢測區 域同日$進行複數個兩種以上不同種類之缺陷檢測作業。 1273232 對福批王面衫像上設定複數個檢測區域，並且分別針 陷測區域同時進行複數個兩種以上不同種類之缺 f為在全面影像上設定複數個檢測區域，並且分別 ^數個檢測區域同時進行複數個同一種類之缺陷檢測作 舉例而言，本發明可針對檢測區域同時進行個別獨立 紫H缺陷檢測作業、巨大缺陷檢測作業、明缺陷檢測作 系及/或暗缺陷檢測作業。 牛。在本發明之一實施例中，本發明之光學檢測方法進— 步可對具有不同尺寸大小成膜圖案之基板同時進行複數個 缺陷檢測作業。 、在本發明之一實施例中，本發明之光學檢測方法所能 檢測之基板包含：LCD顯示器基板、PDP顯示器基板、有機 電激發光（Organic EL)顯示器基板、彩色濾鏡基板、晶圓、 玻璃基板或其他類似種類之基板。 在本發明之一貫施例中，當檢測出缺陷時，本發明可 在全面影像上標示該缺陷之位置及大小，並利用檢視鏡頭 才双視並確g忍缺陷之正確性。 【實施方式】 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳 細說明如下。 ° 請參考圖1關於依據本發明之一實施例之光學檢測系 統之系統架構圖。如圖1所示，在本發明之一實施例中，本 1273232 發明之光學檢測系統ίο具有以下幾個主要組成單元：、影 像取得單元200、影像顯示單元300、申央處理單元4〇〇、ζ 腦數值控制單元500、輸入/輸出介面6〇〇β以上各個組成單 元並错由一 VME匯流排而彼此電性連接。 100進行缺陷檢測作業後，可透過VME匯 全面影像及有關缺陷之資訊傳送並顯 如圖1所示，在本發明之一實施例中，電腦數值控制單 之ΧΥ軸平台510可提供被檢測之基板8〇〇至影像取得 單元200。基板8〇〇可以是LCD顯示器基板、pDp顯示器基板、 有機電激發光(Organic EL)顯示器基板、彩色濾鏡基板、 晶圓、玻璃基板或者其他種類的基板。影像取得單元2〇〇 者則複數個串列或並列之感光耦合元件（CCD)。影像取 得單TO200所取得之基板8〇〇之全面影像經由影像處理單元 ，可透過V Μ E匯流排7 〇 〇將檢測後之BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical detection system and method, and more particularly to an automated optical inspection system and method for simultaneously performing a plurality of defect detection operations on a substrate. [Prior Art] For the flat panel display industry, in order to improve product quality and reduce costs, manufacturers must perform defect inspection before or after the completion of the production process in order to find out the cause of the defect. In addition to the electrical detection of these defect detection operations, appearance and surface flaw detection are also necessary items. With the trend of large-scale and thin-line electronic components and the increasing speed of production line speed, manual visual inspection has failed to meet quality and speed. Claim. This day's Autom ic Opt i cal Inspection (A〇I) is a tool for quickly detecting the appearance and surface flaws. Automated optical inspection technology can be used not only for end product quality control, but also for process monitoring, taking early corrective measures. However, most of the prior art A0I detecting devices and methods belong to the automatic detecting device and method for instant detection, and cannot display a comprehensive image of the detected substrate. Since there is no comprehensive image of the substrate, the prior art has no way to detect if the film formation pattern on the substrate to be inspected is different in size. Even if the prior art attempts to create a detection area of a substrate having a different film pattern size by numerical input, since the full image of the substrate 1273232 cannot be obtained, the prior art cannot confirm whether the detection area is set correctly, and thus the correctness of the detection cannot be ensured. . Furthermore, the prior art AOI detecting apparatus and method generally can only perform defect detection in one of the 杈 method, the differential method, and the difference method, and cannot perform multiple types of detection at the same time. Although some prior art A〇I detecting devices and methods can perform micro-defective and large-defect testing operations, these prior art techniques only perform performing-type testing operations, and then calculate the detected defective pixels, which will have fewer defects. The pixels are divided into small defects, and those with more defects are divided into huge defects. This method simply divides the size of the _ trap and does not individually set the detection sensitivity of the micro-defects and the large defects, and does not guarantee the correctness of the detection. Therefore, it is necessary to provide an optical detecting device and method for efficiently detecting a substrate having film forming patterns of different sizes; and at the same time, it is also necessary to provide an optical detecting device and method for simultaneously performing a plurality of different defect detecting. Homework to increase the correctness of the test. [Summary of the Invention] The present invention provides an optical inspection system for fg | fg] @ γ ' operation in time to read a defect detection = light. It should include: - image acquisition unit, = input = 4^, - central processing unit, "·^ brain numerical control unit, this electrical connection. In an embodiment of the invention, the substrate may be an LCD display substrate, a PDP display substrate, an organic electroluminescence display substrate, a color filter substrate, and a color filter substrate. , wafers, glass substrates or other types of substrates. In a consistent embodiment of the present invention, the computer numerical control unit includes a shaft platform for transporting the substrate to be detected to the image acquisition unit, and an inspection lens for inspecting and confirming that the defects on the substrate are correct. In one embodiment of the invention, the image acquisition unit preferably has a plurality of tandem or parallel photosensitive coupling elements (CCDs). After the defect detection operation is performed by the image acquisition unit, the image can be transmitted through the VME bus and the information about the defect and displayed on the image display unit. At the same time, relevant information can also be transmitted to the central processing unit via the VME bus for transmission to the defect intelligence management system via the network for data management, external communication and statistical processing. The optical detection method of the present invention mainly comprises the following steps: firstly, the substrate to be detected is provided by a transport mechanism of the optical detection system; secondly, a comprehensive image of the substrate is obtained by the image acquisition unit; and then the image processing unit stores the a comprehensive image; then, the image processing unit performs a plurality of defect detection operations on the comprehensive image; and, finally, displays the detected comprehensive image and the related defect information on the image display unit. In one embodiment of the present invention, the plurality of defect detecting operations of the present invention include the following various situations: ★ setting a detection area on a full-scale image, and performing a plurality of two or more different types for the detection area on the same day $ Defect detection operation. 1273232 Set a plurality of detection areas on the image of the Fu-Bao Sweater, and simultaneously perform a plurality of different types of different types of defects in the needle-trapping area to set a plurality of detection areas on the comprehensive image, and respectively detect a plurality of detections The region simultaneously performs a plurality of defect detections of the same type. For example, the present invention can simultaneously perform an individual independent purple H defect detection operation, a large defect detection operation, a clear defect detection system, and/or a dark defect detection operation for the detection area. Cattle. In an embodiment of the present invention, the optical detecting method of the present invention can perform a plurality of defect detecting operations simultaneously on a substrate having film forming patterns of different sizes. In an embodiment of the present invention, the substrate that can be detected by the optical detecting method of the present invention comprises: an LCD display substrate, a PDP display substrate, an organic electroluminescent (Organic EL) display substrate, a color filter substrate, a wafer, A glass substrate or other similar type of substrate. In the conventional embodiment of the present invention, when a defect is detected, the present invention can mark the position and size of the defect on the comprehensive image, and use the inspection lens to double-view and confirm the correctness of the defect. The above and other objects, features, and advantages of the present invention will become more fully understood from Please refer to Fig. 1 for a system architecture diagram of an optical inspection system in accordance with an embodiment of the present invention. As shown in FIG. 1 , in an embodiment of the present invention, the optical detection system of the 1273232 invention has the following main components: an image acquisition unit 200, an image display unit 300, and a central processing unit. The brain value control unit 500 and the input/output interfaces 6 〇〇β and above are electrically connected to each other by a VME bus bar. After the defect detection operation is performed, the information of the full image and the related defect can be transmitted through the VME and displayed as shown in FIG. 1. In an embodiment of the present invention, the computer numerical control single axis platform 510 can provide the detected The substrate 8 is transferred to the image acquisition unit 200. The substrate 8A may be an LCD display substrate, a pDp display substrate, an organic EL display substrate, a color filter substrate, a wafer, a glass substrate, or other kinds of substrates. The image acquisition unit 2 is a plurality of tandem or parallel photosensitive coupling elements (CCDs). The image is taken as a full image of the substrate 8 obtained by the single TO200 via the image processing unit, and can be transmitted through the V Μ E bus bar 7 〇 〇
风㊇示现僅能一次檢測一基板， 以進行連續複數個基板的搬送作 10亦可進行連續複數個基板之自動 事實上ΧΥ軸平台51〇可 業，並且#墨烙说丨么从Wind 8 shows that only one substrate can be detected at a time for carrying out the continuous transfer of a plurality of substrates. 10 It is also possible to carry out the automatic operation of a plurality of substrates. In fact, the axis platform 51 is available, and #墨烙说丨
测糸統10外，尚提供一 上之缺陷之光學檢測方 9 1273232 法，可對成膜圖案相同或不同之基板同時進行複數個缺陷 檢測作業。以下請參考圖2關於本發明之光學檢測方法之步 驟流程圖。 首先，在步驟S21及S22中，本發明可藉由XY軸平台510 選擇性地搬送並提供成膜圖案尺寸相同或成膜圖案尺寸不 同之基板800，以準備進行基板800之缺陷檢測作業。如圖3 所示，本發明所檢測之基板800可具有複數個尺寸相同之成 膜圖案802或複數個尺寸不同之成膜圖案804。 接著，在步驟S23中，本發明可藉由影像取得單元 200 (例如複數個串列或並列之感光耦合元件）取得基板800 之全面影像。 在取得基板800之全面影像後，本發明接著執行步驟 S24，藉由影像處理單元100上之記憶體儲存所取得之全面 影像。然後，在步驟S25中，執行複數個缺陷檢測作業。 在本發明之一實施例中，步驟S25所進行之複數個缺陷 檢測作業進一步包含以下各個步驟選項： 一、 首先執行步驟S251，在全面影像上設定複數個檢 測區域，接著執行步驟S252，針對該檢測區域同時進行複 數個相同種類之缺陷檢測作業。例如，如圖4所示，首先執 行步驟S251，在全面影像40上設定兩個檢測區域41及42， 接著執行步驟S252，針對檢測區域41及42同時進行兩個微 小缺陷檢測作業。 二、 首先執行步驟S251，在全面影像上設定複數個檢 測區域，接著執行步驟S254，針對該檢測區域同時進行複 數個不同種類之缺陷檢測作業。例如，如圖5所示，首先執 行步驟S251，在全面影像50上設定兩個檢測區域51及52， 1273232 接著執行步驟S252，針對檢測區域51及52同時個別進行微 小缺陷檢測作業以及巨大缺陷檢測作業。 、一 首先執行步驟S 2 5 3，在全面影像上設定一特定測 ，域’接著執行步驟S254，針對該特定檢測區域同時進行 複數個不同種類之缺陷檢測作業。例如，如圖6所示，首先 ，行步驟S253，在全面影像60上設定一個檢測區域61，接 著執行步驟S254，針對檢測區域61同時個別進行微小缺陷 檢測作業以及巨大缺陷檢測作業。 在本發明之一實施例中，步驟S25所進行之複數個檢測 作業之種類除上述之微小缺陷檢測作業以及巨大缺陷檢測 作業外’尚包括明缺陷檢測作業以及暗缺陷檢測作業。同 時’、本發明可個別設定微小缺陷檢測及巨大缺陷檢測之檢 測感應度，並且本發明亦能個別設定明暗缺陷的檢測感應 度。如此’本發明可對想要進行檢測的缺陷，進行很精準 的區刀檢測，而大大地改善先前技術之光學檢測裝置只能 選擇比較法、微分法、差分法其中的一種方式來進行缺陷 檢測之缺點。 接著’在步驟S26中’本發明將所有處理過後之全面影 像以及有關缺陷之資料如圖7所示，顯示在影像顯示單元 300上同時’當檢測出基板800具有缺陷時，本發明可進 一步如圖8所示，標示出缺陷85〇之位置及大小。 、接著，本發明可執行步驟S27，藉由檢視鏡頭520檢視 並確認基板議上之缺祕G之正確性。若操作者確認該缺 陷850是正確的，即可結束本發明之流程，而作進一步之缺 =原因4估作業，例如藉由檢視鏡頭作基板綱之定位 確認及/或照明度確認等作業。若操作者認為檢測出之缺陷 1273232 850不正確時，本發明可回到步驟S25 ,重新進行檢測，並 可重複步驟S25至S27，直到已確認缺陷為止。 以 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 |為依據本發明之一實施例之光學檢測系統之系統架構 圖2為依據本發明之一 方法’步驟流程圖。 圖3為依據本發明之一 圖4為依據本發明之一 圖5為依據本發明之一 圖6為依據本發明之一 圖7為依據本發明之一 相關缺陷資料之狀態度 圖8為依據本發明之一 【主要元件符號說明】 實施例之光學檢測系統之光學檢測 J施例之基板之示意圖。 實施例之缺陷檢測作業之示意圖。 ^施例之缺陷檢測作業之示意圖。 艺施例之缺陷檢測作業之示意圖。 實施例之顯示複數個全面影像及其 〇 實施例之顯示一缺陷之示意圖。 10 光學檢測系統 100影像處理單元 200影像取得單元 300影像顯示單元 400中央處理單元 410 網路 420缺陷情報管理系統 500電腦數值控制單元 510 χγ轴平台 12 1273232 520 檢視鏡頭 600 輸入/輸出介面 700 VME匯流排 8 0 0 被檢測基板 8 5 0 缺陷 40、 50、60 全面影像 41、 42、51、52、61 檢測區域 13In addition to the measuring system 10, an optical detector 9 1273232 method for providing defects on the substrate can be simultaneously subjected to a plurality of defect detecting operations on substrates having the same or different film forming patterns. Referring now to Figure 2, a flow chart of the steps of the optical detection method of the present invention is shown. First, in steps S21 and S22, the present invention can selectively transport and provide the substrate 800 having the same film formation pattern size or film formation pattern size by the XY-axis stage 510 to prepare for the defect detection operation of the substrate 800. As shown in FIG. 3, the substrate 800 detected by the present invention may have a plurality of film formation patterns 802 having the same size or a plurality of film formation patterns 804 having different sizes. Next, in step S23, the present invention can obtain a full image of the substrate 800 by the image acquisition unit 200 (for example, a plurality of tandem or parallel photosensitive coupling elements). After obtaining the full image of the substrate 800, the present invention proceeds to step S24 to store the acquired comprehensive image by the memory on the image processing unit 100. Then, in step S25, a plurality of defect detecting jobs are executed. In an embodiment of the present invention, the plurality of defect detection operations performed in step S25 further include the following step options: 1. First, step S251 is performed to set a plurality of detection areas on the comprehensive image, and then step S252 is performed, The detection area simultaneously performs a plurality of defect detection operations of the same type. For example, as shown in Fig. 4, step S251 is first executed, two detection areas 41 and 42 are set on the full-image 40, and then step S252 is performed, and two small defect detection operations are simultaneously performed for the detection areas 41 and 42. 2. First, step S251 is executed to set a plurality of detection areas on the full-image, and then step S254 is performed, and a plurality of different types of defect detection operations are simultaneously performed for the detection area. For example, as shown in FIG. 5, step S251 is first performed, and two detection areas 51 and 52 are set on the full-image 50, and 1273232 is followed by step S252, and small defect detection operations and large defect detection are simultaneously performed for the detection areas 51 and 52. operation. First, step S 2 5 3 is executed, and a specific measurement is set on the comprehensive image. Then, step S254 is performed, and a plurality of different types of defect detection operations are simultaneously performed for the specific detection area. For example, as shown in Fig. 6, first, in step S253, a detection area 61 is set on the full-view image 60, and then step S254 is executed, and the micro-defect detection operation and the large defect detection operation are simultaneously performed for the detection area 61. In an embodiment of the present invention, the types of the plurality of detection operations performed in the step S25 include the defect detection operation and the dark defect detection operation in addition to the above-described micro defect detection operation and the large defect detection operation. At the same time, the present invention can individually set the detection sensitivity of the micro defect detection and the large defect detection, and the present invention can also individually set the detection sensitivity of the light and dark defects. Thus, the present invention can perform highly accurate zone knife detection on defects that are to be detected, and greatly improve the optical detection device of the prior art. Only one of the comparison method, the differential method, and the difference method can be selected for defect detection. The shortcomings. Then, in the step S26, the present invention displays all the processed comprehensive images and the related defects as shown in FIG. 7 and is displayed on the image display unit 300 while 'detecting that the substrate 800 has a defect, the present invention can further As shown in Fig. 8, the position and size of the defect 85 are indicated. Then, the present invention can perform step S27, and the inspection lens 520 checks and confirms the correctness of the missing G on the substrate. If the operator confirms that the defect 850 is correct, the flow of the present invention can be terminated, and further lack of the cause 4 estimation operation, for example, by the inspection lens as the substrate alignment confirmation and/or illumination confirmation. If the operator believes that the detected defect 1273232 850 is incorrect, the present invention can return to step S25, re-detect, and repeat steps S25 to S27 until the defect has been confirmed. Although the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and it is to be understood that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [System architecture of an optical detection system in accordance with an embodiment of the present invention] FIG. 2 is a flow chart of a method in accordance with one of the present invention. 3 is a view of the present invention, FIG. 4 is a view of the present invention, FIG. 5 is a view of the present invention, FIG. 6 is a view of the present invention, FIG. One of the Inventions [Description of Main Element Symbols] A schematic diagram of a substrate for optical detection of an optical inspection system of an embodiment. A schematic diagram of the defect detection operation of the embodiment. ^ Schematic diagram of the defect detection operation of the example. Schematic diagram of the defect detection operation of the art example. The embodiment shows a plurality of general images and a schematic representation of a defect in the embodiment. 10 optical detection system 100 image processing unit 200 image acquisition unit 300 image display unit 400 central processing unit 410 network 420 defect information management system 500 computer numerical control unit 510 χ γ axis platform 12 1273232 520 inspection lens 600 input / output interface 700 VME convergence Row 8 0 0 substrate to be detected 8 5 0 defects 40, 50, 60 full image 41, 42, 51, 52, 61 detection area 13