1282417 九、發明說明·· 【發明所屬之技術領域】 本發明係屬於一種光學檢測方法，尤其是屬於一種自 動化光學檢測基板上之缺陷之光學檢測方法。 “ 【先前技術】 對於平面顯示器產業而言，為提高產品品質與降低成 本，廠商必須在生產流程完成前或完成後進行缺陷檢測， 、’月叙現產生缺之原因而加以解決。這些缺陷檢測作業❿ T電性檢測外，外觀及表面瑕疵檢測也是必要項目，而隨 著電子元件大型化和細線化的趨勢，以 愈來 求 此時，自動化光學檢測（Automatic0ptical Inspection， 1)即成為快速檢測外觀及表面瑕疵之利器。自動化光學 檢測技術不僅可用做終端產品品管，也能協助製程監控， 以早期採取補正措施。 雖然自動化光學檢測技術的發展已有一段時間，但是馨 仍有些問題需要克服。舉例而言，先前技術之自動化光 學檢測技術通常不能顯示被檢測基板的全面影像，而是以 數值輪入來製作被檢測基板的檢測區域。先前技術之所以 無法顯示被檢測基板的全面影像，主要原因在於先前技術 2松測裝置之記憶體空間有限，如果要取得被檢測基板的 全面影像，將影響後續的數位信號處理作業的速度。然而， 1282417 因為沒有基板的全面影像，所以先前技術就沒辦法確認檢 測區域是否設定正確，從而無法保證檢測之正確性。 因此’有必要提供一種除能取得被檢測基板的全面影 像外’尚能兼顧後續的數位信號處理作業的自動化光學檢 測方法’以改善先前技術之缺點。 【發明内容】 鑑於先前技術所存在之問題，本發明乃提供一種能將 被檢測基板之全面影像顯示在顯示器上，同時能加速進行 數位信號處理作業之自動化光學檢測方法。 本發明之自動化光學檢測方法係利用一光學檢測系統 自動，進行連續複數個基板之缺陷檢查作業。其中該光學 系統包含至少一感光耦合元件以及相對應之至少一影 像處理板。本發明之自動化光學檢測方法包含以下步驟： 一、 提供連續複數塊基板。 二、 藉由感光耦合元件取得連續複數塊基板之各塊 基板之全面影像。 二、藉由影像處理板進行以下步驟： ^儲存複數塊基板中之第一塊基板之全面影像。 2.儲存複數塊基板中之第二塊基板之全面影像， 日^對第一塊基板之全面影像進行數位信號處理作 4. 對第三塊基板之全面影像進行數位信號處理作 1282417 【實施方式】 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳 細說明如下。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical detecting method, and more particularly to an optical detecting method for a defect on an automated optical detecting substrate. “[Prior Art] For the flat panel display industry, in order to improve product quality and reduce costs, manufacturers must perform defect detection before or after the completion of the production process, and solve the problem of missing defects. In addition to the electrical detection of T, the appearance and surface flaw detection are also necessary items, and with the trend of large-scale and thin-line electronic components, the automatic optical inspection (Automatic0ptical Inspection, 1) becomes a rapid detection. Appearance and surface flaws. Automated optical inspection technology can be used not only as a terminal product quality control, but also to assist in process monitoring, taking early corrective measures. Although the development of automated optical inspection technology has been around for some time, there are still some problems that need to be overcome. For example, the prior art automated optical inspection technology generally cannot display a comprehensive image of the substrate to be inspected, but uses a numerical wheel to create a detection area of the substrate to be inspected. The prior art cannot display a comprehensive image of the substrate to be inspected, The main reason is the prior art 2 The memory space of the loose test device is limited. If a comprehensive image of the substrate to be inspected is to be obtained, the speed of the subsequent digital signal processing operation will be affected. However, 1282417 has no comprehensive image of the substrate, so the prior art has no way to confirm the detection area. Whether it is set correctly, the correctness of the test cannot be guaranteed. Therefore, it is necessary to provide an automated optical detection method that can take care of subsequent digital signal processing operations in addition to obtaining a comprehensive image of the substrate to be tested to improve the shortcomings of the prior art. SUMMARY OF THE INVENTION In view of the problems of the prior art, the present invention provides an automated optical detection method capable of displaying a comprehensive image of a substrate to be detected on a display while accelerating digital signal processing operations. The detecting method automatically performs a defect inspection operation of a plurality of substrates by using an optical detecting system, wherein the optical system comprises at least one photosensitive coupling element and corresponding at least one image processing board. The automated optical detecting method of the present invention comprises The following steps are as follows: 1. Providing a continuous plurality of substrates. 2. Obtaining a comprehensive image of each of the plurality of substrates of the plurality of substrates by the photosensitive coupling element. 2. Performing the following steps by using the image processing board: ^ storing the plurality of substrates A comprehensive image of a substrate. 2. Store a comprehensive image of the second substrate in the plurality of substrates, and perform digital signal processing on the entire image of the first substrate. 4. Perform digital processing on the entire image of the third substrate. The above-mentioned and other objects, features, and advantages of the present invention will become more apparent and understood.
請參考圖1關於本發明之自動化光學檢測方法所利用 之光學檢測系統之系統架構圖。如圖丨所示，在本發明之一 實施例中，本發明之自動化光學檢測方法所利用之光學檢 測系統10具有彼此電性連接之以下幾個主要組成單元：感 光耦合元件100、影像處理板200、顯示器3〇〇、輸送平台4〇\ 以及檢視鏡頭500。藉由上述之架構，光學檢測系統1〇可以 用來檢測連續複個基板6 〇 〇、61 〇、6 2 0、6 3 0等之缺陷。 如圖1所示，感光搞合元件1 〇 〇為複數個串列或並列4 感光耦合元件，並且影像處理板2〇〇為複數個影像處理板 其中，感光耦合元件1〇〇可用以取得被檢測基板6〇〇、6ι〇 620、630等之全面影像。被檢測基板6〇〇、61〇、62〇、63 Φ 等可以是LCD顯示器基板、PDP顯示器基板、有機電激發夫 (Organic EL)顯示器基板、彩色濾鏡基板、晶圓、玻璃遵 板或者其他種類的基板y复數個影像處理板2〇〇之每一塊最 像處理板皆具有至少—記憶體以及至少-處理器。同時Ϊ 如圖1所示，每一塊影像處理板對應連接至一個 件。藉此，影像處理板可對被檢測基板6〇〇 ；*61〇=〇、 630等之>全面影像，針對各種缺陷種類（例如微小、巨大、 明、暗等缺陷）執行各種高感度之數位信號處理作業。 奢招LI即說明本發明如何利用上述之光學檢測系統而 貫現本Μ之自純光學制方法。請參相㈣於本發明 8 1282417 之自動化光學檢測方法之步驟流程圖。 首先，在步驟S20中，本發明可藉由輸送平台400搬送 並提供被檢測基板6 0 0、610、6 2 0、6 3 0等，以準備進行連 續複數塊基板之缺陷檢測作業。 接著，在步驟S21中，本發明可藉由複數個串列或並列 之感光耦合元件100取得連續複數塊基板600、610、620、 630等之各個基板之全面影像。 在取得基板600、610、620、630等之各個基板之全面 影像之同時，本發明將執行步驟S22，如圖3所示，藉由複 數個影像處理板200進行以下的步驟： 1. 步驟S221 :儲存連續複數塊基板中之第一塊基板 (即基板600)之全面影像。 2. 步驟S222 :儲存連續複數塊基板中之第二塊基板 (即基板610)之全面影像，同時對第一塊基板600之 全面影像進行數位信號處理作業。 3. 步驟S223 :儲存連續複數塊基板中之第三塊基板 (即基板620)之全面影像，同時對第二塊基板610之 全面影像進行數位信號處理作業。 4. 步驟S224 :對第三塊基板620之全面影像進行數位 信號處理作業。 5. 步驟S225 :自動地重複上述步驟S221至S224，直 至完成連續複數塊基板600、610、620、630等所有 基板之數位信號處理作業。 如圖3所示，藉由步驟S22，本發明之自動化光學檢測 方法可利用影像處理板200交錯地儲存及處理連續複數塊 基板600、610、620、630等之全面影像。藉此，本發明可 以一方面擷取大容量的影像，一方面同時進行高速度的檢 1282417 測處理作業，如此可以縮短檢查節拍時間，而實現高速檢 查連績通過基板之目的。 在本發明之一實施例中，步驟S22之數位信號處理作業 可包含一微小數位信號處理（DSP1 )及/或一巨大數位信號 處理（DSP2)，並且本發明可進行DSP1以及Dsp2之同時區別 檢測。本發明亦可根據一檢測配方，個別設定DSpi&DSp2 之松測感應度，並且本發明亦能個別設定明暗缺陷的檢測 感應度。 > 接著’在步驟S23中，本發明將處理過後之基板6〇〇、 61 〇、620、630等之全面影像以及有關缺陷之資料如圖4所 示，傳送至顯示器3〇〇。 f接著，本發明執行步驟S24，如圖5所示，選擇性地 ，連續複數塊基板600、610、62〇、63〇等中檢測出具有缺 陷之基板以全面影像之方式顯示在顯示器3〇〇上，並標示誃 缺陷之位置及大小。 ^ 、、此外本發明尚可執行步驟S25，藉由檢視鏡頭5〇〇檢 視並確認基板±之缺陷之正輕。若操作者確認該缺陷是 ，確的’即可結束本發明之流程，而作進—步之缺陷原因 。平估作業。若刼作者認為檢測出之缺陷不正確時，本發明 可進一步執行步驟S26，重新依照一新的檢測配方進行^ 新的數位信號處理作業，直到已確認缺陷為止。 發:月已以較佳實施例揭露如上，然其並非用以 限=本發明，任何熟習此技藝者，在不脫離本發明 和耗圍内，當可作些許之更動與潤飾，因此本發 = 範圍當視後附之中請專利範圍所界定者為準。 保護 1282417 【圖式簡單說明】 圖1為依據本發明之一實施例之光學檢測系統之系統架構 圖。 圖2為依據本發明之一實施例之自動化光學檢測方法之步 驟流程圖。 圖3為依據本發明之一實施例，交錯地進行影像儲存及處 理之示意圖。 圖4為依據本發明之一實施例之顯示器顯示複數個全面影 像及其相關缺陷資料之狀態度。 圖5為依據本發明之一實施例，在全面影像上顯示缺陷位 置及大小之示意圖。 【主要元件符號說明】 10 光學檢測系統 100 感光耦合元件 200 影像處理板 300 顯示器 400 輸送平台 500 檢視鏡頭 600、610、620、630 被檢測基板Please refer to FIG. 1 for a system architecture diagram of an optical inspection system utilized by the automated optical inspection method of the present invention. As shown in FIG. 1 , in an embodiment of the present invention, the optical detection system 10 used in the automated optical detection method of the present invention has the following main constituent units electrically connected to each other: a photosensitive coupling element 100 and an image processing board. 200, display 3 〇〇, transport platform 4 〇 \ and inspection lens 500. With the above structure, the optical detecting system 1 can be used to detect defects of a plurality of substrates 6 〇 , 61 〇, 6 2 0, 630, and the like. As shown in FIG. 1 , the photosensitive engaging element 1 is a plurality of serial or parallel 4 photosensitive coupling elements, and the image processing board 2 is a plurality of image processing boards, wherein the photosensitive coupling element 1 can be used to obtain A comprehensive image of the substrates 6〇〇, 6ι〇 620, 630, and the like is detected. The substrate to be tested 6〇〇, 61〇, 62〇, 63 Φ, etc. may be an LCD display substrate, a PDP display substrate, an organic EL display substrate, a color filter substrate, a wafer, a glass plate or the like. Types of Substrate y Each of the plurality of image processing boards 2 has most of the processing boards having at least a memory and at least a processor. At the same time, as shown in Figure 1, each image processing board is connected to one piece. Thereby, the image processing board can perform various high-sensitivity on various types of defects (for example, small, huge, bright, dark, etc.) on the detected substrate 6*;*61〇=〇, 630, etc. Digital signal processing jobs. The luxury trick LI illustrates how the present invention utilizes the optical inspection system described above to achieve the self-pure optical manufacturing method of the present invention. Please refer to (4) the flow chart of the steps of the automated optical detection method of the invention 8 1282417. First, in step S20, the present invention can transport and provide the substrates to be inspected 60, 610, 610, 630, etc. by the transport platform 400 to prepare for the defect detection operation of the continuous plurality of substrates. Next, in step S21, the present invention can obtain a comprehensive image of each of the continuous plurality of substrates 600, 610, 620, 630 and the like by a plurality of tandem or parallel photosensitive coupling elements 100. While obtaining a comprehensive image of each of the substrates 600, 610, 620, 630, etc., the present invention will perform step S22. As shown in FIG. 3, the following steps are performed by the plurality of image processing boards 200: 1. Step S221 : storing a comprehensive image of the first substrate (ie, substrate 600) in a continuous plurality of substrates. 2. Step S222: storing a comprehensive image of the second substrate (ie, the substrate 610) in the continuous plurality of substrates, and performing digital signal processing on the full image of the first substrate 600. 3. Step S223: storing a comprehensive image of the third substrate (ie, the substrate 620) in the continuous plurality of substrates, and performing digital signal processing on the full image of the second substrate 610. 4. Step S224: Perform a digital signal processing operation on the full image of the third substrate 620. 5. Step S225: The above steps S221 to S224 are automatically repeated until the digital signal processing operation of all the substrates of the continuous plurality of substrates 600, 610, 620, and 630 is completed. As shown in FIG. 3, by the step S22, the automated optical detecting method of the present invention can use the image processing board 200 to alternately store and process a comprehensive image of the continuous plurality of substrates 600, 610, 620, and 630. Thereby, the present invention can capture a large-capacity image on the one hand, and simultaneously perform a high-speed inspection 1282417 measurement process on the one hand, thereby shortening the inspection tact time and achieving high-speed inspection of the performance through the substrate. In an embodiment of the present invention, the digital signal processing operation of step S22 may include a small digital signal processing (DSP1) and/or a huge digital signal processing (DSP2), and the present invention can perform simultaneous differential detection of DSP1 and Dsp2. . The present invention can also individually set the sensing sensitivity of DSpi & DSp2 according to a detection recipe, and the present invention can also individually set the detection sensitivity of the light and dark defects. > Next, in step S23, the present invention transmits the processed images of the substrates 6〇〇, 61〇, 620, 630, etc., and the related defects as shown in Fig. 4 to the display 3A. f. Next, the present invention performs step S24. As shown in FIG. 5, selectively, the substrate having the defect detected in the continuous plurality of substrates 600, 610, 62, 63, etc. is displayed on the display in a comprehensive image. 〇, and mark the location and size of the defect. In addition, in the present invention, step S25 can be performed, and the inspection lens 5 〇〇 is inspected and confirmed that the defect of the substrate ± is light. If the operator confirms that the defect is YES, the process of the present invention can be ended, and the cause of the defect is made. Leveling the work. If the author believes that the detected defect is not correct, the present invention may further perform step S26 to perform a new digital signal processing operation in accordance with a new detection recipe until the defect is confirmed. The present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Anyone skilled in the art can make some changes and refinements without departing from the invention and the scope of the invention. = Scope is subject to the scope defined in the patent application. Protection 1282417 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a system architecture diagram of an optical inspection system in accordance with an embodiment of the present invention. 2 is a flow chart of the steps of an automated optical inspection method in accordance with an embodiment of the present invention. 3 is a schematic diagram of image storage and processing interleaved in accordance with an embodiment of the present invention. 4 is a diagram showing the state of display of a plurality of comprehensive images and their associated defect data in accordance with an embodiment of the present invention. Figure 5 is a diagram showing the location and size of defects on a full image in accordance with one embodiment of the present invention. [Main component symbol description] 10 Optical detection system 100 Photosensitive coupling element 200 Image processing board 300 Display 400 Conveying platform 500 Inspection lens 600, 610, 620, 630 Substrate to be inspected