CN101461063B - 基板检查及修正装置、以及基板评估系统 - Google Patents
基板检查及修正装置、以及基板评估系统 Download PDFInfo
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- CN101461063B CN101461063B CN200680054826XA CN200680054826A CN101461063B CN 101461063 B CN101461063 B CN 101461063B CN 200680054826X A CN200680054826X A CN 200680054826XA CN 200680054826 A CN200680054826 A CN 200680054826A CN 101461063 B CN101461063 B CN 101461063B
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- 239000000758 substrate Substances 0.000 title claims abstract description 180
- 238000007689 inspection Methods 0.000 title claims abstract description 72
- 238000011156 evaluation Methods 0.000 title claims description 11
- 230000008439 repair process Effects 0.000 title abstract 5
- 230000007547 defect Effects 0.000 claims abstract description 98
- 230000002950 deficient Effects 0.000 claims abstract description 45
- 238000012937 correction Methods 0.000 claims description 42
- 238000001514 detection method Methods 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000010894 electron beam technology Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000012790 confirmation Methods 0.000 claims description 7
- 239000000523 sample Substances 0.000 claims description 7
- 230000003760 hair shine Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 13
- 238000012545 processing Methods 0.000 description 19
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 230000032258 transport Effects 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 230000005281 excited state Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/315220 WO2008015738A1 (fr) | 2006-08-01 | 2006-08-01 | Dispositif d'inspection et de réparation de substrat et système d'évaluation de substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101461063A CN101461063A (zh) | 2009-06-17 |
CN101461063B true CN101461063B (zh) | 2011-12-28 |
Family
ID=38996926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680054826XA Expired - Fee Related CN101461063B (zh) | 2006-08-01 | 2006-08-01 | 基板检查及修正装置、以及基板评估系统 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2008015738A1 (fr) |
KR (1) | KR101051730B1 (fr) |
CN (1) | CN101461063B (fr) |
WO (1) | WO2008015738A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106324872A (zh) * | 2015-07-02 | 2017-01-11 | 灿美工程股份有限公司 | 检查装置及被处理物检查方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101566739B (zh) * | 2008-04-25 | 2011-07-20 | 北京京东方光电科技有限公司 | 阵列电路维修系统及维修方法 |
JP5408540B2 (ja) * | 2009-10-28 | 2014-02-05 | 株式会社島津製作所 | Tftアレイの検査方法及びtftアレイ検査装置 |
JP5590043B2 (ja) * | 2009-12-10 | 2014-09-17 | 株式会社島津製作所 | Tft基板検査装置およびtft基板検査方法 |
KR101250126B1 (ko) * | 2010-07-14 | 2013-04-03 | (주)쎄미시스코 | 복수의 기판들을 검사하는 방법 및 시스템 |
US8995747B2 (en) | 2010-07-29 | 2015-03-31 | Sharp Laboratories Of America, Inc. | Methods, systems and apparatus for defect detection and classification |
CN102829858B (zh) * | 2011-06-15 | 2014-09-10 | 上海天马微电子有限公司 | 光传感器阵列面板的缺陷检测修复装置及其方法 |
CN103018162B (zh) * | 2011-09-22 | 2016-07-06 | 致茂电子股份有限公司 | 一种处理用于测试的影像数据的系统及方法 |
JP2013257208A (ja) * | 2012-06-12 | 2013-12-26 | Sharp Corp | 欠陥原因工程分析装置および欠陥原因工程分析方法 |
KR101398692B1 (ko) * | 2012-09-11 | 2014-05-27 | 삼성디스플레이 주식회사 | 표시 장치의 수리 장치 및 그 방법 |
CN104765691B (zh) * | 2015-04-23 | 2017-05-24 | 武汉精测电子技术股份有限公司 | 液晶模组的修正代码判断方法 |
CN107567199B (zh) * | 2016-06-30 | 2020-01-07 | Oht株式会社 | 非接触型电路图案检查修复装置 |
JP6476234B2 (ja) * | 2016-06-30 | 2019-02-27 | オー・エイチ・ティー株式会社 | 非接触型回路パターン検査修復装置 |
CN106112161A (zh) * | 2016-07-17 | 2016-11-16 | 安徽卓越电气有限公司 | 一种壁挂式充电桩基板修正工艺 |
CN106338252B (zh) * | 2016-09-28 | 2019-05-03 | 铜陵市铜创电子科技有限公司 | 一种金属化薄膜缺陷的在线检测-裁切方法 |
CN107389689B (zh) * | 2017-07-26 | 2020-05-22 | 武汉精测电子集团股份有限公司 | 一种用于缺陷检测的aoi管理系统及管理方法 |
CN109799630B (zh) * | 2019-03-07 | 2021-09-03 | Tcl华星光电技术有限公司 | 玻璃基板重测重修系统及其方法 |
CN110082974B (zh) * | 2019-04-08 | 2021-11-02 | Tcl华星光电技术有限公司 | 阵列基板修补系统及其方法 |
JP7051244B2 (ja) * | 2019-04-19 | 2022-04-11 | Ckd株式会社 | メンテナンス支援システム |
CN111427176B (zh) * | 2020-04-28 | 2022-12-23 | 深圳市华星光电半导体显示技术有限公司 | 面板的检测系统及检测方法 |
CN114594623B (zh) * | 2022-04-20 | 2024-04-12 | 合肥京东方显示技术有限公司 | 液晶面板的修复装置和修复方法 |
CN114818604B (zh) * | 2022-06-29 | 2022-10-11 | 飞腾信息技术有限公司 | 一种用于修正数字版图上短路缺陷的方法以及装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5801965A (en) * | 1993-12-28 | 1998-09-01 | Hitachi, Ltd. | Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices |
CN1343320A (zh) * | 1999-03-08 | 2002-04-03 | 松下电器产业株式会社 | 液晶显示装置及其检查方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682801A (ja) * | 1992-08-31 | 1994-03-25 | Ntn Corp | 欠陥検査修正装置 |
JP3397549B2 (ja) * | 1995-11-21 | 2003-04-14 | 株式会社東芝 | 液晶表示装置 |
JP4090567B2 (ja) * | 1998-05-11 | 2008-05-28 | 株式会社日立製作所 | ウエハ検査加工装置およびウエハ検査加工方法 |
TWI264043B (en) * | 2002-10-01 | 2006-10-11 | Tokyo Electron Ltd | Method and system for analyzing data from a plasma process |
JP4418272B2 (ja) * | 2004-03-24 | 2010-02-17 | オリンパス株式会社 | 欠陥分類辞書教示装置 |
-
2006
- 2006-08-01 KR KR1020087028131A patent/KR101051730B1/ko not_active IP Right Cessation
- 2006-08-01 CN CN200680054826XA patent/CN101461063B/zh not_active Expired - Fee Related
- 2006-08-01 WO PCT/JP2006/315220 patent/WO2008015738A1/fr active Application Filing
- 2006-08-01 JP JP2008527612A patent/JPWO2008015738A1/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5801965A (en) * | 1993-12-28 | 1998-09-01 | Hitachi, Ltd. | Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices |
CN1343320A (zh) * | 1999-03-08 | 2002-04-03 | 松下电器产业株式会社 | 液晶显示装置及其检查方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106324872A (zh) * | 2015-07-02 | 2017-01-11 | 灿美工程股份有限公司 | 检查装置及被处理物检查方法 |
CN106324872B (zh) * | 2015-07-02 | 2021-08-10 | 灿美工程股份有限公司 | 检查装置及被处理物检查方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2008015738A1 (fr) | 2008-02-07 |
JPWO2008015738A1 (ja) | 2009-12-17 |
KR101051730B1 (ko) | 2011-07-25 |
KR20090006205A (ko) | 2009-01-14 |
CN101461063A (zh) | 2009-06-17 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20120801 |