CN101461063B - 基板检查及修正装置、以及基板评估系统 - Google Patents

基板检查及修正装置、以及基板评估系统 Download PDF

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Publication number
CN101461063B
CN101461063B CN200680054826XA CN200680054826A CN101461063B CN 101461063 B CN101461063 B CN 101461063B CN 200680054826X A CN200680054826X A CN 200680054826XA CN 200680054826 A CN200680054826 A CN 200680054826A CN 101461063 B CN101461063 B CN 101461063B
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CN
China
Prior art keywords
substrate
data
defect
inspection
correction
Prior art date
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Expired - Fee Related
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CN200680054826XA
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English (en)
Chinese (zh)
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CN101461063A (zh
Inventor
中谷敦夫
筱原真
黑田晋一
今井大辅
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Shimadzu Corp
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Shimadzu Corp
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Publication of CN101461063A publication Critical patent/CN101461063A/zh
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136259Repairing; Defects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513Liquid crystal panels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
CN200680054826XA 2006-08-01 2006-08-01 基板检查及修正装置、以及基板评估系统 Expired - Fee Related CN101461063B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/315220 WO2008015738A1 (fr) 2006-08-01 2006-08-01 Dispositif d'inspection et de réparation de substrat et système d'évaluation de substrat

Publications (2)

Publication Number Publication Date
CN101461063A CN101461063A (zh) 2009-06-17
CN101461063B true CN101461063B (zh) 2011-12-28

Family

ID=38996926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680054826XA Expired - Fee Related CN101461063B (zh) 2006-08-01 2006-08-01 基板检查及修正装置、以及基板评估系统

Country Status (4)

Country Link
JP (1) JPWO2008015738A1 (fr)
KR (1) KR101051730B1 (fr)
CN (1) CN101461063B (fr)
WO (1) WO2008015738A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106324872A (zh) * 2015-07-02 2017-01-11 灿美工程股份有限公司 检查装置及被处理物检查方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566739B (zh) * 2008-04-25 2011-07-20 北京京东方光电科技有限公司 阵列电路维修系统及维修方法
JP5408540B2 (ja) * 2009-10-28 2014-02-05 株式会社島津製作所 Tftアレイの検査方法及びtftアレイ検査装置
JP5590043B2 (ja) * 2009-12-10 2014-09-17 株式会社島津製作所 Tft基板検査装置およびtft基板検査方法
KR101250126B1 (ko) * 2010-07-14 2013-04-03 (주)쎄미시스코 복수의 기판들을 검사하는 방법 및 시스템
US8995747B2 (en) 2010-07-29 2015-03-31 Sharp Laboratories Of America, Inc. Methods, systems and apparatus for defect detection and classification
CN102829858B (zh) * 2011-06-15 2014-09-10 上海天马微电子有限公司 光传感器阵列面板的缺陷检测修复装置及其方法
CN103018162B (zh) * 2011-09-22 2016-07-06 致茂电子股份有限公司 一种处理用于测试的影像数据的系统及方法
JP2013257208A (ja) * 2012-06-12 2013-12-26 Sharp Corp 欠陥原因工程分析装置および欠陥原因工程分析方法
KR101398692B1 (ko) * 2012-09-11 2014-05-27 삼성디스플레이 주식회사 표시 장치의 수리 장치 및 그 방법
CN104765691B (zh) * 2015-04-23 2017-05-24 武汉精测电子技术股份有限公司 液晶模组的修正代码判断方法
CN107567199B (zh) * 2016-06-30 2020-01-07 Oht株式会社 非接触型电路图案检查修复装置
JP6476234B2 (ja) * 2016-06-30 2019-02-27 オー・エイチ・ティー株式会社 非接触型回路パターン検査修復装置
CN106112161A (zh) * 2016-07-17 2016-11-16 安徽卓越电气有限公司 一种壁挂式充电桩基板修正工艺
CN106338252B (zh) * 2016-09-28 2019-05-03 铜陵市铜创电子科技有限公司 一种金属化薄膜缺陷的在线检测-裁切方法
CN107389689B (zh) * 2017-07-26 2020-05-22 武汉精测电子集团股份有限公司 一种用于缺陷检测的aoi管理系统及管理方法
CN109799630B (zh) * 2019-03-07 2021-09-03 Tcl华星光电技术有限公司 玻璃基板重测重修系统及其方法
CN110082974B (zh) * 2019-04-08 2021-11-02 Tcl华星光电技术有限公司 阵列基板修补系统及其方法
JP7051244B2 (ja) * 2019-04-19 2022-04-11 Ckd株式会社 メンテナンス支援システム
CN111427176B (zh) * 2020-04-28 2022-12-23 深圳市华星光电半导体显示技术有限公司 面板的检测系统及检测方法
CN114594623B (zh) * 2022-04-20 2024-04-12 合肥京东方显示技术有限公司 液晶面板的修复装置和修复方法
CN114818604B (zh) * 2022-06-29 2022-10-11 飞腾信息技术有限公司 一种用于修正数字版图上短路缺陷的方法以及装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801965A (en) * 1993-12-28 1998-09-01 Hitachi, Ltd. Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices
CN1343320A (zh) * 1999-03-08 2002-04-03 松下电器产业株式会社 液晶显示装置及其检查方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682801A (ja) * 1992-08-31 1994-03-25 Ntn Corp 欠陥検査修正装置
JP3397549B2 (ja) * 1995-11-21 2003-04-14 株式会社東芝 液晶表示装置
JP4090567B2 (ja) * 1998-05-11 2008-05-28 株式会社日立製作所 ウエハ検査加工装置およびウエハ検査加工方法
TWI264043B (en) * 2002-10-01 2006-10-11 Tokyo Electron Ltd Method and system for analyzing data from a plasma process
JP4418272B2 (ja) * 2004-03-24 2010-02-17 オリンパス株式会社 欠陥分類辞書教示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801965A (en) * 1993-12-28 1998-09-01 Hitachi, Ltd. Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices
CN1343320A (zh) * 1999-03-08 2002-04-03 松下电器产业株式会社 液晶显示装置及其检查方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106324872A (zh) * 2015-07-02 2017-01-11 灿美工程股份有限公司 检查装置及被处理物检查方法
CN106324872B (zh) * 2015-07-02 2021-08-10 灿美工程股份有限公司 检查装置及被处理物检查方法

Also Published As

Publication number Publication date
WO2008015738A1 (fr) 2008-02-07
JPWO2008015738A1 (ja) 2009-12-17
KR101051730B1 (ko) 2011-07-25
KR20090006205A (ko) 2009-01-14
CN101461063A (zh) 2009-06-17

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Granted publication date: 20111228

Termination date: 20120801