JPWO2006062091A1 - 部品実装装置及び部品実装方法 - Google Patents
部品実装装置及び部品実装方法 Download PDFInfo
- Publication number
- JPWO2006062091A1 JPWO2006062091A1 JP2006546699A JP2006546699A JPWO2006062091A1 JP WO2006062091 A1 JPWO2006062091 A1 JP WO2006062091A1 JP 2006546699 A JP2006546699 A JP 2006546699A JP 2006546699 A JP2006546699 A JP 2006546699A JP WO2006062091 A1 JPWO2006062091 A1 JP WO2006062091A1
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- height
- stage
- component
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims abstract description 288
- 238000004364 calculation method Methods 0.000 claims abstract description 115
- 239000011248 coating agent Substances 0.000 claims description 96
- 238000000576 coating method Methods 0.000 claims description 96
- 239000011344 liquid material Substances 0.000 claims description 36
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 3
- 210000003128 head Anatomy 0.000 description 326
- 238000013500 data storage Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 2
- 210000000887 face Anatomy 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/05644—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
2 ICチップ
2a 吸着面
2b 実装面
3 パッド
4 バンプ
5 基板
11 部品供給部
12 基板移動部
13 実装部
14 制御装置
16 ストッカ
17 プレート移動装置
18 プレート配置装置
19 認識カメラ
20 部品移送ヘッド装置
22 トレイ
23 プレート
25 プレート押圧体
26,28,30 モータ
27 XYロボット
29,32 X軸ロボット
33 ヘッドフレーム
34 反転ヘッド
35 吸着ノズル
40 実装ヘッド装置
41 ステージ
42 2視野系認識カメラ
45 モータ
46 X軸ロボット
47 キャリッジ
48 実装ヘッド
49 直動ガイド
51 ベース
52 ボールねじ
53 モータ
54 吸着ノズル(保持部)
56 ノズル支持部(基部)
57 モータ
58 ばね
59 エア供給源
60 流路
61 降下量センサ
64 ピストン
65 ロードセル
66 超音波発信器
67 ヒータ
70 塗布ヘッド
71 モータ
73 塗布ノズル
75,76 モータ
77 XYロボット
150 昇降装置
151 ステージ高さ算出部
次に、添付図面を参照して本発明の実施形態を詳細に説明する。
図9に本発明の第2実施形態における制御装置14を示す。本実施形態では、データ格納部101に各段の設定押込量PHSETnが記憶されている。設定押込量PHSETnは、吸着ノズル54にチップ2を保持した実装ヘッド48が第1基準高さ位置HB1から基板5又は実装済みのチップ2に向けて降下する際に、吸着ノズル54で保持したチップ2が基板5又は実装済みのチップ2に接触した後もさらに実装ヘッド48さらに降下させ、それによって初期位置P01(図3参照)から吸着ノズル54を鉛直方向上向きにノズル支持部56に対して押し込む距離の設定値である。また、実装基準高さ算出部103は、この設定押込量PHSETnと押込量センサ62で検出された吸着ノズル54の押込量の実測値である実押込量PHACnを各段の実装基準高さHnの算出に使用する。さらに、第1目標移動高さ算出部104も各段の実装ヘッド48の目標移動高さZTAGnの算出に、設定押込量PHSETnを使用する。
図12に本発明の第3実施形態における制御装置14を示す。本実施形態では、実装基準高さ算出部103は、基板5又は実装済みのチップ2へチップ2を実装する際の実装ヘッド48の実測値である実移動高さZACnを、実装基準高さHnの算出に使用する。この実移動高さZACnは降下量センサ61により検出される。また、実移動高さZACnの基準は第1基準高さ位置HB1であり、鉛直方向下向きを正とする。
図14に本発明の第2実施形態における制御装置14を示す。また、本実施形態の部品実装装置1は、図16Aから図16Dに概略的に示すように、ステージ41を昇降させる昇降装置150を備える。
図17に本発明の第5実施形態における制御装置14を示す。本実施形態では、データ格納部101に各段の設定押込量PHSETnが記憶されている。また、ステージ高さ算出部151は、この設定押込量PHSETnと押込量センサ62で検出された吸着ノズル54の押込量の実測値である実押込量PHACnを各段のステージ高さHSnの算出に使用する。さらに、第1目標移動高さ算出部104も各段の実装ヘッド48の目標移動高さZTAGnの算出に、設定押込量PHSETnを使用する。
図19に本発明の第6実施形態における制御装置14を示す。本実施形態では、ステージ高さ算出部151は、基板5又は実装済みのチップ2へチップ2を実装する際の実装ヘッド48の実測値である実移動高さZACnをステージ高さHSnの算出に使用する。この実移動高さZACnは降下量センサ61により検出される。
次に、添付図面を参照して本発明の実施形態を詳細に説明する。
図9に本発明の第2実施形態における制御装置14を示す。本実施形態では、データ格納部101に各段の設定押込量PHSETnが記憶されている。設定押込量PHSETnは、吸着ノズル54にチップ2を保持した実装ヘッド48が第1基準高さ位置HB1から基板5又は実装済みのチップ2に向けて降下する際に、吸着ノズル54で保持したチップ2が基板5又は実装済みのチップ2に接触した後もさらに実装ヘッド48さらに降下させ、それによって初期位置P01(図3参照)から吸着ノズル54を鉛直方向上向きにノズル支持部56に対して押し込む距離の設定値である。また、実装基準高さ算出部103は、この設定押込量PHSETnと押込量センサ62で検出された吸着ノズル54の押込量の実測値である実押込量PHACnを各段の実装基準高さHnの算出に使用する。さらに、第1目標移動高さ算出部104も各段の実装ヘッド48の目標移動高さZTAGnの算出に、設定押込量PHSETnを使用する。
図12に本発明の第3実施形態における制御装置14を示す。本実施形態では、実装基準高さ算出部103は、基板5又は実装済みのチップ2へチップ2を実装する際の実装ヘッド48の実測値である実移動高さZACnを、実装基準高さHnの算出に使用する。この実移動高さZACnは降下量センサ61により検出される。また、実移動高さZACnの基準は第1基準高さ位置HB1であり、鉛直方向下向きを正とする。
図14に本発明の第2実施形態における制御装置14を示す。また、本実施形態の部品実装装置1は、図16Aから図16Dに概略的に示すように、ステージ41を昇降させる昇降装置150を備える。
図17に本発明の第5実施形態における制御装置14を示す。本実施形態では、データ格納部101に各段の設定押込量PHSETnが記憶されている。また、ステージ高さ算出部151は、この設定押込量PHSETnと押込量センサ62で検出された吸着ノズル54の押込量の実測値である実押込量PHACnを各段のステージ高さHSnの算出に使用する。さらに、第1目標移動高さ算出部104も各段の実装ヘッド48の目標移動高さZTAGnの算出に、設定押込量PHSETnを使用する。
図19に本発明の第6実施形態における制御装置14を示す。本実施形態では、ステージ高さ算出部151は、基板5又は実装済みのチップ2へチップ2を実装する際の実装ヘッド48の実測値である実移動高さZACnをステージ高さHSnの算出に使用する。この実移動高さZACnは降下量センサ61により検出される。
2 ICチップ
2a 吸着面
2b 実装面
3 パッド
4 バンプ
5 基板
11 部品供給部
12 基板移動部
13 実装部
14 制御装置
16 ストッカ
17 プレート移動装置
18 プレート配置装置
19 認識カメラ
20 部品移送ヘッド装置
22 トレイ
23 プレート
25 プレート押圧体
26,28,30 モータ
27 XYロボット
29,32 X軸ロボット
33 ヘッドフレーム
34 反転ヘッド
35 吸着ノズル
40 実装ヘッド装置
41 ステージ
42 2視野系認識カメラ
45 モータ
46 X軸ロボット
47 キャリッジ
48 実装ヘッド
49 直動ガイド
51 ベース
52 ボールねじ
53 モータ
54 吸着ノズル(保持部)
56 ノズル支持部(基部)
57 モータ
58 ばね
59 エア供給源
60 流路
61 降下量センサ
64 ピストン
65 ロードセル
66 超音波発信器
67 ヒータ
70 塗布ヘッド
71 モータ
73 塗布ノズル
75,76 モータ
77 XYロボット
150 昇降装置
151 ステージ高さ算出部
Claims (15)
- 基板(5)に複数個の部品(2)を積み重ねて実装する部品実装装置であって、
高さ位置が固定され、前記基板を保持するステージ(41)と、
前記部品を解除可能に保持し、前記ステージの上方の固定された第1の基準高さ位置(HB1)から前記ステージに向けて降下し、保持した前記部品を前記基板又は実装済みの前記部品に実装する実装ヘッド(48)と、
前記第1の基準高さ位置から前記基板又は実装済みの前記部品までの距離に対応する実装基準高さ(Hn)を算出する実装基準高さ算出部(103)と、少なくとも前記実装基準高さ算出部が算出した前記実装基準高さと前記実装ヘッドに保持されている前記部品の厚み(PTn)とに基づいて第1の目標移動高さ(ZTAGn)を算出する第1の目標移動高さ算出部(104)と、前記部品を保持した前記実装ヘッドを前記第1の基準高さ位置から前記第1の目標移動高さまで降下させて前記基板又は前記実装済みの部品に保持した前記部品を実装させる制御部(14)と
を備える、部品実装装置。 - 前記実装基準高さ算出部は、前記実装済みの部品の個数が増えるほど前記第1の基準高さ位置に近づくように前記実装基準高さを設定する、請求項1に記載の部品実装装置。
- 前記実装ヘッドは、前記部品を保持する保持部(54)と、この保持部が前記第1の基準高さ位置方向に変位可能な基部(56)と、前記部品の実装時の前記保持部の前記基部に対する変位する量である実押込量(PHACn)を検出する第1のセンサ(62)を備え、
前記実装基準高さ算出部は、少なくとも前記実押込量に基づいて前記実装基準高さを算出する、請求項2に記載の部品実装装置。 - 前記実装ヘッドは、前記第1の基準高さ位置を基準とする前記部品の実装時の前記実装ヘッドの高さである実移動高さ(ZACn)を検出する第2のセンサ(61)を備え、
前記実装基準高さ算出部は、少なくとも前記実移動高さに基づいて前記実装基準高さを算出する、請求項2に記載の部品実装装置。 - 少なくとも前記実装ヘッドに保持された部品と前記基板とを認識可能な認識カメラ(42)とをさらに備え、
前記制御部は、前記認識カメラよる前記基板の認識結果を使用して、前記実装ヘッドに保持された部品の前記実装済みの部品に対する位置決めを実行する、請求項1に記載の部品実装装置。 - 少なくとも前記実装ヘッドに保持された部品と前記基板に実装済みの最下段の部品(2−1)とを認識可能な認識カメラ(42)をさらに備え、
前記制御部は、前記認識カメラによる前記最下段の部品の認識結果を使用して、前記実装ヘッドに保持された部品の前記実装済みの部品に対する位置決めを実行する、請求項1に記載の部品実装装置。 - 少なくとも前記実装ヘッドに保持された部品と前記実装済みの部品のうち最上段のものとを認識可能な認識カメラ(42)をさらに備え、
前記制御部は、前記認識カメラによる前記最上段の部品の認識結果を使用して、前記実装ヘッドに保持された部品の前記実装済みの部品に対する位置決めを実行する、請求項1に記載の部品実装装置。 - 前記ステージの上方の固定された第2の基準高さ位置(HB2)から前記ステージに向けて降下し、上記基板又は実装済みの前記部品に対して液状材を塗布するための塗布ヘッド(70)をさらに備え、
前記制御部は、少なくとも前記実装基準高さに基づいて第2の目標移動高さ(DZTAGn)を算出する第2の目標移動高さ算出部(105)をさらに備え、前記塗布ヘッドを前記第2の基準高さ位置から前記第2の目標移動高さ算出部が算出した前記第2の目標高さまで降下させて前記基板又は実装済みの前記部品に前記液状材を塗布させる、請求項1から請求項7のいずれか1項に記載の部品実装装置。 - 基板(5)に複数個の部品(2)を積み重ねて実装する部品実装装置であって、
前記基板を保持する昇降可能なステージ(41)と、
前記部品を解除可能に保持し、前記ステージの上方の第1の基準高さ位置(HB1)から前記ステージへ向けて降下し、保持した前記部品を前記基板又は実装済みの前記部品に実装する実装ヘッド(48)と、
前記第1の基準高さ位置から前記基板又は実装済みの前記部品までの距離に対応する実装基準高さ(H1)を一定に保持するように、前記第1の基準高さ位置からの前記ステージの高さであるステージ高さ(HSn)を算出するステージ高さ算出部(151)と、少なくとも前記実装基準高さと前記実装ヘッドに保持されている前記部品の厚み(PTn)とに基づいて第1の目標移動高さ(ZTAGn)を算出する第1の目標移動高さ算出部(104)とを備え、前記ステージを前記ステージ高さ算出部が算出した前記ステージ高さまで降下させた後、前記部品を保持した前記実装ヘッドを前記第1の基準高さ位置から前記第1の目標移動高さ算出部が算出した前記第1の目標移動高さまで降下させて前記基板又は前記実装済みの部品に保持した前記部品を実装させる制御部と
を備える、部品実装装置。 - 前記ステージ高さ算出部は、前記実装済みの部品の個数が増えるほど前記第1の基準高さ位置から離れるように前記ステージ高さを設定する、請求項9に記載の部品実装装置。
- 前記実装ヘッドは、前記部品を保持する保持部(54)と、この保持部が前記基準高さ位置方向に変位可能な基部(56)と、前記部品の実装時の前記保持部の前記基部に対する変位する量である実押込量(PHACn)を検出する第1のセンサ(62)を備え、
前記ステージ高さ算出部は、少なくとも前記実押込量に基づいて、前記ステージ高さを算出する、請求項10に記載の部品実装装置。 - 前記実装ヘッドは、前記第1の基準高さ位置を基準とする前記部品の実装時の前記実装ヘッドの高さである実移動高さ(ZACn)を検出する第2のセンサ(61)を備え、
前記ステージ高さ算出部は、少なくとも前記実移動高さに基づいて前記ステージ高さを算出する、請求項10に記載の部品実装装置。 - 前記ステージの上方の固定された第2の基準高さ位置(HB2)から前記ステージに向けて降下し、上記基板又は実装済みの前記部品に対して液状材を塗布するための塗布ヘッド(70)をさらに備え、
前記制御部は、少なくとも前記実装基準高さに基づいて第2の目標移動高さ(DZTAGn)を算出する第2の目標移動高さ算出部(105)をさらに備え、前記塗布ヘッドを前記第2の基準高さ位置から第2の目標移動高さ算出部が算出した前記第2の目標移動高さまで降下させて前記基板又は実装済みの前記部品に前記液状材を塗布させる、請求項9から請求項12のいずれか1項に記載の部品実装装置。 - 基板(5)に複数個の部品(2)を積み重ねて実装する部品実装方法であって、
前記基板を保持する、高さ位置が固定されたステージ(41)を設け、
前記部品を解除可能に保持し、保持した前記部品を前記基板又は実装済みの前記部品に実装する実装ヘッド(48)を設け、
前記ステージの上方の基準高さ位置(HB1)から前記基板又は実装済みの前記部品までの距離に対応する実装基準高さ(Hn)を算出し、
少なくとも前記実装基準高さと前記実装ヘッドに保持されている前記部品の厚み(PTn)とに基づいて第1の目標移動高さ(ZTAGn)を算出し、
前記部品を保持した前記実装ヘッドを前記基準高さ位置から前記目標移動高さまで降下させて前記基板又は前記実装済みの部品に保持した前記部品を実装させる、部品実装方法。 - 基板(5)に複数個の部品(2)を積み重ねて実装する部品実装方法であって、
前記基板を保持する、昇降可能なステージ(41)を設け、
前記部品を解除可能に保持し、保持した前記部品を前記基板又は実装済みの前記部品に実装する実装ヘッド(48)を設け、
前記ステージの上方の基準高さ位置(HB1)から前記基板又は実装済みの前記部品までの距離に対応する実装基準高さ(H1)を一定に保持するように、前記基準高さ位置からの前記ステージの高さであるステージ高さ(HSn)を算出し、
少なくとも前記実装基準高さと前記実装ヘッドに保持されている前記部品の厚み(PTn)とに基づいて目標移動高さ(ZTAGn)を算出し、
前記ステージを前記ステージ高さまで降下させ、
前記部品を保持した前記実装ヘッドを前記基準高さ位置から前記目標移動高さまで降下させて前記基板又は前記実装済みの部品に保持した前記部品を実装させる、部品実装方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006546699A JP5064804B2 (ja) | 2004-12-06 | 2005-12-06 | 部品実装装置及び部品実装方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004352748 | 2004-12-06 | ||
JP2004352748 | 2004-12-06 | ||
PCT/JP2005/022364 WO2006062091A1 (ja) | 2004-12-06 | 2005-12-06 | 部品実装装置及び部品実装方法 |
JP2006546699A JP5064804B2 (ja) | 2004-12-06 | 2005-12-06 | 部品実装装置及び部品実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006062091A1 true JPWO2006062091A1 (ja) | 2008-06-12 |
JP5064804B2 JP5064804B2 (ja) | 2012-10-31 |
Family
ID=36577918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006546699A Expired - Fee Related JP5064804B2 (ja) | 2004-12-06 | 2005-12-06 | 部品実装装置及び部品実装方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7748112B2 (ja) |
JP (1) | JP5064804B2 (ja) |
KR (1) | KR101153053B1 (ja) |
CN (1) | CN101073153B (ja) |
TW (1) | TW200628029A (ja) |
WO (1) | WO2006062091A1 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4692268B2 (ja) * | 2005-12-22 | 2011-06-01 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP2008109001A (ja) * | 2006-10-27 | 2008-05-08 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置及び電子部品装着方法 |
JP2008251771A (ja) * | 2007-03-30 | 2008-10-16 | Hitachi High-Tech Instruments Co Ltd | 部品実装装置 |
KR20090125151A (ko) * | 2007-04-03 | 2009-12-03 | 파나소닉 주식회사 | 부품 실장 방법 |
JP2008270278A (ja) * | 2007-04-16 | 2008-11-06 | Nec Electronics Corp | 半導体製造装置および半導体装置の製造方法 |
WO2009025016A1 (ja) * | 2007-08-17 | 2009-02-26 | Fujitsu Limited | 部品実装装置及び方法 |
CN101842000B (zh) * | 2009-03-19 | 2014-04-30 | 鸿富锦精密工业(深圳)有限公司 | 贴附装置及使用该贴附装置的贴附方法 |
JP2011014583A (ja) * | 2009-06-30 | 2011-01-20 | Tesetsuku:Kk | 電子部品用搬送装置 |
KR101047033B1 (ko) * | 2009-07-23 | 2011-07-06 | (주) 에스에스피 | 공정거리 설정이 편리한 자동화 조립장비 및 이를 이용한 공정거리 설정방법 |
JP4880055B2 (ja) * | 2010-06-04 | 2012-02-22 | 株式会社新川 | 電子部品実装装置及びその方法 |
JP5398751B2 (ja) * | 2011-01-26 | 2014-01-29 | パナソニック株式会社 | 部品実装方法および部品実装装置 |
JP5876000B2 (ja) * | 2012-06-11 | 2016-03-02 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP2014038946A (ja) * | 2012-08-16 | 2014-02-27 | Sony Corp | 実装装置、部材の配置方法及び基板の製造方法 |
KR101419461B1 (ko) * | 2012-11-28 | 2014-07-16 | 방영진 | Pcb부품삽입검출장치 |
WO2016024364A1 (ja) * | 2014-08-13 | 2016-02-18 | 株式会社新川 | 実装装置および測定方法 |
JP6603243B2 (ja) * | 2015-02-13 | 2019-11-06 | 株式会社Fuji | 実装処理ユニット、実装装置及び実装処理ユニットの制御方法 |
EP3328181B1 (en) * | 2015-07-24 | 2020-11-04 | FUJI Corporation | Component mounting machine and component mounting system |
JP6553459B2 (ja) * | 2015-09-09 | 2019-07-31 | 東芝メモリ株式会社 | 半導体装置の製造方法および実装装置 |
CN107072045A (zh) * | 2016-11-30 | 2017-08-18 | 合肥瑞硕科技有限公司 | 一种电路板专用吸取装置 |
WO2018156662A1 (en) | 2017-02-21 | 2018-08-30 | Invetech, Inc. | Dual-axis linear motion system |
US10367436B2 (en) * | 2017-02-21 | 2019-07-30 | Invetech, Inc. | Single-axis linear motion system |
JP6767333B2 (ja) * | 2017-09-28 | 2020-10-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
JP7112341B2 (ja) * | 2019-01-23 | 2022-08-03 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
JP2020150187A (ja) * | 2019-03-15 | 2020-09-17 | パナソニックIpマネジメント株式会社 | 部品搭載装置および部品搭載方法 |
US20220232747A1 (en) * | 2019-07-04 | 2022-07-21 | Fuji Corporation | Component mounting machine |
JP7450429B2 (ja) * | 2020-03-26 | 2024-03-15 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
WO2022098697A1 (en) * | 2020-11-05 | 2022-05-12 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods |
DE102021108635A1 (de) | 2021-01-29 | 2022-08-04 | Pink Gmbh Thermosysteme | Anlage und Verfahren zum Verbinden von elektronischen Baugruppen |
JP7502836B2 (ja) | 2021-01-29 | 2024-06-19 | ピンク ゲーエムベーハー テルモジステーメ | 電子アセンブリを接続するシステムおよび方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05198620A (ja) * | 1992-01-20 | 1993-08-06 | Mitsubishi Electric Corp | 半導体ボンディング装置 |
JPH07122596A (ja) * | 1993-10-28 | 1995-05-12 | Nec Kansai Ltd | アウタリードボンダ |
JPH1187431A (ja) * | 1997-09-08 | 1999-03-30 | Matsushita Electric Ind Co Ltd | バンプ付きワークの実装方法 |
JP2001189339A (ja) * | 1999-10-20 | 2001-07-10 | Fujitsu Ltd | 半導体チップ素子、半導体チップ素子実装装置及び実装方法 |
JP2003086758A (ja) * | 2001-09-10 | 2003-03-20 | Mitsubishi Electric Corp | 半導体装置の製造方法、製造装置、及び、半導体装置 |
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004087611A (ja) * | 2002-08-23 | 2004-03-18 | Toshiba Corp | 半導体装置製造方法、及び半導体装置製造装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3534583B2 (ja) * | 1997-01-07 | 2004-06-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
KR100220709B1 (ko) * | 1997-03-14 | 1999-09-15 | 윤종용 | 액상의 접착제를 리드 하부면에 도포하는 방법과 장치 및 그로부터 형성된 접착층을 갖는 리드-온-칩(loc)형 반도체 칩 패키지 |
US6483190B1 (en) | 1999-10-20 | 2002-11-19 | Fujitsu Limited | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
-
2005
- 2005-12-05 TW TW094142762A patent/TW200628029A/zh unknown
- 2005-12-06 WO PCT/JP2005/022364 patent/WO2006062091A1/ja active Application Filing
- 2005-12-06 KR KR1020077012670A patent/KR101153053B1/ko not_active IP Right Cessation
- 2005-12-06 US US11/792,235 patent/US7748112B2/en not_active Expired - Fee Related
- 2005-12-06 CN CN2005800419419A patent/CN101073153B/zh active Active
- 2005-12-06 JP JP2006546699A patent/JP5064804B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05198620A (ja) * | 1992-01-20 | 1993-08-06 | Mitsubishi Electric Corp | 半導体ボンディング装置 |
JPH07122596A (ja) * | 1993-10-28 | 1995-05-12 | Nec Kansai Ltd | アウタリードボンダ |
JPH1187431A (ja) * | 1997-09-08 | 1999-03-30 | Matsushita Electric Ind Co Ltd | バンプ付きワークの実装方法 |
JP2001189339A (ja) * | 1999-10-20 | 2001-07-10 | Fujitsu Ltd | 半導体チップ素子、半導体チップ素子実装装置及び実装方法 |
JP2003086758A (ja) * | 2001-09-10 | 2003-03-20 | Mitsubishi Electric Corp | 半導体装置の製造方法、製造装置、及び、半導体装置 |
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004087611A (ja) * | 2002-08-23 | 2004-03-18 | Toshiba Corp | 半導体装置製造方法、及び半導体装置製造装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101073153B (zh) | 2010-05-05 |
CN101073153A (zh) | 2007-11-14 |
US7748112B2 (en) | 2010-07-06 |
JP5064804B2 (ja) | 2012-10-31 |
US20080127486A1 (en) | 2008-06-05 |
TW200628029A (en) | 2006-08-01 |
KR20070085777A (ko) | 2007-08-27 |
KR101153053B1 (ko) | 2012-06-04 |
WO2006062091A1 (ja) | 2006-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5064804B2 (ja) | 部品実装装置及び部品実装方法 | |
JP6807755B2 (ja) | 実装装置及び実装装置の制御方法 | |
JP3295529B2 (ja) | Ic部品実装方法及び装置 | |
CN107079619B (zh) | 安装装置与测量方法 | |
KR101096927B1 (ko) | 다이본더의 본드헤드를 정렬시키는 방법 | |
JP2000133684A (ja) | ボンディング装置 | |
KR102394745B1 (ko) | 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치 | |
JP3574666B2 (ja) | 電子部品実装装置及び方法 | |
KR20150029086A (ko) | 반도체 장치의 z축 높이 감지방법 | |
KR20130118195A (ko) | 페이스트 도포 장치 및 페이스트 도포 방법 및 다이 본더 | |
US20220219922A1 (en) | Unloading apparatus and unloading method | |
JP6553489B2 (ja) | 部品実装機、および部品実装機のウエハ部品吸着高さ調整方法 | |
TWI529828B (zh) | 調控晶粒黏接頭移動之裝置及方法 | |
KR101162923B1 (ko) | 트레이 이송 방법, 이를 적용한 트레이 이송 장치 및 테스트 핸들러 | |
JP2002261492A (ja) | Ic部品実装方法及び装置 | |
KR102292225B1 (ko) | 다이 본딩헤드 구조 | |
JP4954652B2 (ja) | 精密部品の組み付け装置 | |
JP2023084390A (ja) | コレット傾き検知構造、コレット傾き修正構造、コレット傾き検知方法、コレット傾き修正方法、ボンディング装置、およびボンディング方法 | |
KR20190100036A (ko) | 실장 장치, 및 반도체 장치의 제조 방법 | |
JP2007019423A (ja) | 固体撮像素子のダイボンド方法及びその装置 | |
JP2014056980A (ja) | ダイボンダ及びボンディング方法 | |
JP2012094912A (ja) | バンプ付き電子部品の実装方法 | |
JP2010245236A (ja) | 基板支持方法、基板支持装置、部品実装方法および部品実装機 | |
JP2022091349A (ja) | ボンディング装置およびボンディング方法 | |
JP2011171330A (ja) | 部品実装装置および部品実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081112 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110707 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120508 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120703 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120724 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120809 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5064804 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150817 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |