JPS6320380B2 - - Google Patents

Info

Publication number
JPS6320380B2
JPS6320380B2 JP56163090A JP16309081A JPS6320380B2 JP S6320380 B2 JPS6320380 B2 JP S6320380B2 JP 56163090 A JP56163090 A JP 56163090A JP 16309081 A JP16309081 A JP 16309081A JP S6320380 B2 JPS6320380 B2 JP S6320380B2
Authority
JP
Japan
Prior art keywords
shaped body
disc
orientation flat
rotation
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56163090A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5864043A (ja
Inventor
Makoto Fukuda
Juji Takeda
Hisao Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP16309081A priority Critical patent/JPS5864043A/ja
Publication of JPS5864043A publication Critical patent/JPS5864043A/ja
Publication of JPS6320380B2 publication Critical patent/JPS6320380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
JP16309081A 1981-10-13 1981-10-13 円板形状体の位置決め装置 Granted JPS5864043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16309081A JPS5864043A (ja) 1981-10-13 1981-10-13 円板形状体の位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16309081A JPS5864043A (ja) 1981-10-13 1981-10-13 円板形状体の位置決め装置

Publications (2)

Publication Number Publication Date
JPS5864043A JPS5864043A (ja) 1983-04-16
JPS6320380B2 true JPS6320380B2 (enrdf_load_stackoverflow) 1988-04-27

Family

ID=15766991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16309081A Granted JPS5864043A (ja) 1981-10-13 1981-10-13 円板形状体の位置決め装置

Country Status (1)

Country Link
JP (1) JPS5864043A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946029A (ja) * 1982-09-09 1984-03-15 Hitachi Ltd ウエハのプリアライメント装置
JPS59117120A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd ウエハのプリアライメント装置
JPS59147444A (ja) * 1983-02-14 1984-08-23 Hitachi Ltd 板状物体の位置合わせ方法およびその装置
EP0129731A1 (en) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Wafer handling system
JPS6085536A (ja) * 1983-10-17 1985-05-15 Hitachi Ltd ウエハ位置決め装置
GB2157078B (en) * 1984-03-30 1987-09-30 Perkin Elmer Corp Wafer alignment apparatus
JPS6245039A (ja) * 1985-08-23 1987-02-27 Canon Inc 円形板状物体の角度位置決め装置
EP0556865B1 (en) * 1986-04-28 1998-11-18 Varian Associates, Inc. Wafer transfer system
JPS62274739A (ja) * 1986-05-16 1987-11-28 バリアン・アソシエイツ・インコ−ポレイテッド ウエファ方向づけ装置および方法
JP2537921B2 (ja) * 1987-11-13 1996-09-25 松下電子工業株式会社 ウエハの位置決め方法
JP2642216B2 (ja) * 1989-05-23 1997-08-20 サイベック システムズ 半導体物品の予備位置決め方法及び装置
KR102773324B1 (ko) * 2019-01-08 2025-02-27 탑실 글로벌웨이퍼즈 에이에스 마킹 스캐너
JP7291663B2 (ja) * 2020-04-24 2023-06-15 Ｔｏｗａ株式会社 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527050B2 (enrdf_load_stackoverflow) * 1972-06-22 1977-02-26
JPS54585A (en) * 1977-06-02 1979-01-05 Terumetsuku Kk Automatic angle setting device

Also Published As

Publication number Publication date
JPS5864043A (ja) 1983-04-16

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