|
JPS60143674A
(ja)
*
|
1983-12-29 |
1985-07-29 |
Oki Electric Ind Co Ltd |
半導体素子の製造方法
|
|
US4847212A
(en)
*
|
1987-01-12 |
1989-07-11 |
Itt Gallium Arsenide Technology Center |
Self-aligned gate FET process using undercut etch mask
|
|
FR2603146B1
(fr)
*
|
1986-08-19 |
1988-11-10 |
Thomson Csf |
Source de courant de type charge active et son procede de realisation
|
|
US5021840A
(en)
*
|
1987-08-18 |
1991-06-04 |
Texas Instruments Incorporated |
Schottky or PN diode with composite sidewall
|
|
JP2685149B2
(ja)
*
|
1988-04-11 |
1997-12-03 |
住友電気工業株式会社 |
電界効果トランジスタの製造方法
|
|
JP2562840B2
(ja)
*
|
1988-08-01 |
1996-12-11 |
富士通株式会社 |
電界効果トランジスタ
|
|
US5237192A
(en)
*
|
1988-10-12 |
1993-08-17 |
Mitsubishi Denki Kabushiki Kaisha |
MESFET semiconductor device having a T-shaped gate electrode
|
|
JPH0748503B2
(ja)
*
|
1988-11-29 |
1995-05-24 |
三菱電機株式会社 |
電界効果トランジスタの製造方法
|
|
US5250453A
(en)
*
|
1989-04-12 |
1993-10-05 |
Mitsubishi Denki Kabushiki Kaisha |
Production method of a semiconductor device
|
|
JPH02271537A
(ja)
*
|
1989-04-12 |
1990-11-06 |
Mitsubishi Electric Corp |
半導体装置及びその製造方法
|
|
JP2553699B2
(ja)
*
|
1989-04-12 |
1996-11-13 |
三菱電機株式会社 |
半導体装置の製造方法
|
|
JP2786307B2
(ja)
*
|
1990-04-19 |
1998-08-13 |
三菱電機株式会社 |
電界効果トランジスタ及びその製造方法
|
|
JPH0475351A
(ja)
*
|
1990-07-17 |
1992-03-10 |
Mitsubishi Electric Corp |
化合物半導体装置の製造方法
|
|
EP0501275A3
(en)
*
|
1991-03-01 |
1992-11-19 |
Motorola, Inc. |
Method of making symmetrical and asymmetrical mesfets
|
|
US5391510A
(en)
*
|
1992-02-28 |
1995-02-21 |
International Business Machines Corporation |
Formation of self-aligned metal gate FETs using a benignant removable gate material during high temperature steps
|
|
US5599738A
(en)
*
|
1995-12-11 |
1997-02-04 |
Motorola |
Methods of fabrication of submicron features in semiconductor devices
|
|
US6362058B1
(en)
*
|
1999-12-22 |
2002-03-26 |
Texas Instruments Incorporated |
Method for controlling an implant profile in the channel of a transistor
|
|
US7514367B2
(en)
*
|
2005-06-17 |
2009-04-07 |
Macronix International Co., Ltd. |
Method for manufacturing a narrow structure on an integrated circuit
|
|
US7321130B2
(en)
*
|
2005-06-17 |
2008-01-22 |
Macronix International Co., Ltd. |
Thin film fuse phase change RAM and manufacturing method
|
|
US7786460B2
(en)
*
|
2005-11-15 |
2010-08-31 |
Macronix International Co., Ltd. |
Phase change memory device and manufacturing method
|
|
US7635855B2
(en)
|
2005-11-15 |
2009-12-22 |
Macronix International Co., Ltd. |
I-shaped phase change memory cell
|
|
US7394088B2
(en)
|
2005-11-15 |
2008-07-01 |
Macronix International Co., Ltd. |
Thermally contained/insulated phase change memory device and method (combined)
|
|
US7449710B2
(en)
|
2005-11-21 |
2008-11-11 |
Macronix International Co., Ltd. |
Vacuum jacket for phase change memory element
|
|
US7599217B2
(en)
|
2005-11-22 |
2009-10-06 |
Macronix International Co., Ltd. |
Memory cell device and manufacturing method
|
|
US7688619B2
(en)
*
|
2005-11-28 |
2010-03-30 |
Macronix International Co., Ltd. |
Phase change memory cell and manufacturing method
|
|
US7459717B2
(en)
|
2005-11-28 |
2008-12-02 |
Macronix International Co., Ltd. |
Phase change memory cell and manufacturing method
|
|
US7531825B2
(en)
|
2005-12-27 |
2009-05-12 |
Macronix International Co., Ltd. |
Method for forming self-aligned thermal isolation cell for a variable resistance memory array
|
|
US8062833B2
(en)
|
2005-12-30 |
2011-11-22 |
Macronix International Co., Ltd. |
Chalcogenide layer etching method
|
|
US7741636B2
(en)
*
|
2006-01-09 |
2010-06-22 |
Macronix International Co., Ltd. |
Programmable resistive RAM and manufacturing method
|
|
US7560337B2
(en)
|
2006-01-09 |
2009-07-14 |
Macronix International Co., Ltd. |
Programmable resistive RAM and manufacturing method
|
|
US20070166971A1
(en)
*
|
2006-01-17 |
2007-07-19 |
Atmel Corporation |
Manufacturing of silicon structures smaller than optical resolution limits
|
|
US7785920B2
(en)
|
2006-07-12 |
2010-08-31 |
Macronix International Co., Ltd. |
Method for making a pillar-type phase change memory element
|
|
US7504653B2
(en)
|
2006-10-04 |
2009-03-17 |
Macronix International Co., Ltd. |
Memory cell device with circumferentially-extending memory element
|
|
US7863655B2
(en)
|
2006-10-24 |
2011-01-04 |
Macronix International Co., Ltd. |
Phase change memory cells with dual access devices
|
|
CN101536153B
(zh)
*
|
2006-11-06 |
2011-07-20 |
Nxp股份有限公司 |
制造fet栅极的方法
|
|
US7476587B2
(en)
|
2006-12-06 |
2009-01-13 |
Macronix International Co., Ltd. |
Method for making a self-converged memory material element for memory cell
|
|
US7903447B2
(en)
|
2006-12-13 |
2011-03-08 |
Macronix International Co., Ltd. |
Method, apparatus and computer program product for read before programming process on programmable resistive memory cell
|
|
US7718989B2
(en)
|
2006-12-28 |
2010-05-18 |
Macronix International Co., Ltd. |
Resistor random access memory cell device
|
|
US7619311B2
(en)
|
2007-02-02 |
2009-11-17 |
Macronix International Co., Ltd. |
Memory cell device with coplanar electrode surface and method
|
|
US7956344B2
(en)
|
2007-02-27 |
2011-06-07 |
Macronix International Co., Ltd. |
Memory cell with memory element contacting ring-shaped upper end of bottom electrode
|
|
US7786461B2
(en)
|
2007-04-03 |
2010-08-31 |
Macronix International Co., Ltd. |
Memory structure with reduced-size memory element between memory material portions
|
|
US7569844B2
(en)
|
2007-04-17 |
2009-08-04 |
Macronix International Co., Ltd. |
Memory cell sidewall contacting side electrode
|
|
US7777215B2
(en)
|
2007-07-20 |
2010-08-17 |
Macronix International Co., Ltd. |
Resistive memory structure with buffer layer
|
|
US7729161B2
(en)
*
|
2007-08-02 |
2010-06-01 |
Macronix International Co., Ltd. |
Phase change memory with dual word lines and source lines and method of operating same
|
|
US7919766B2
(en)
|
2007-10-22 |
2011-04-05 |
Macronix International Co., Ltd. |
Method for making self aligning pillar memory cell device
|
|
US7879643B2
(en)
|
2008-01-18 |
2011-02-01 |
Macronix International Co., Ltd. |
Memory cell with memory element contacting an inverted T-shaped bottom electrode
|
|
US7879645B2
(en)
|
2008-01-28 |
2011-02-01 |
Macronix International Co., Ltd. |
Fill-in etching free pore device
|
|
US8158965B2
(en)
|
2008-02-05 |
2012-04-17 |
Macronix International Co., Ltd. |
Heating center PCRAM structure and methods for making
|
|
US8084842B2
(en)
|
2008-03-25 |
2011-12-27 |
Macronix International Co., Ltd. |
Thermally stabilized electrode structure
|
|
US8030634B2
(en)
|
2008-03-31 |
2011-10-04 |
Macronix International Co., Ltd. |
Memory array with diode driver and method for fabricating the same
|
|
US7825398B2
(en)
|
2008-04-07 |
2010-11-02 |
Macronix International Co., Ltd. |
Memory cell having improved mechanical stability
|
|
US7791057B2
(en)
|
2008-04-22 |
2010-09-07 |
Macronix International Co., Ltd. |
Memory cell having a buried phase change region and method for fabricating the same
|
|
US8077505B2
(en)
|
2008-05-07 |
2011-12-13 |
Macronix International Co., Ltd. |
Bipolar switching of phase change device
|
|
US7701750B2
(en)
*
|
2008-05-08 |
2010-04-20 |
Macronix International Co., Ltd. |
Phase change device having two or more substantial amorphous regions in high resistance state
|
|
US8415651B2
(en)
|
2008-06-12 |
2013-04-09 |
Macronix International Co., Ltd. |
Phase change memory cell having top and bottom sidewall contacts
|
|
US8134857B2
(en)
|
2008-06-27 |
2012-03-13 |
Macronix International Co., Ltd. |
Methods for high speed reading operation of phase change memory and device employing same
|
|
US7932506B2
(en)
|
2008-07-22 |
2011-04-26 |
Macronix International Co., Ltd. |
Fully self-aligned pore-type memory cell having diode access device
|
|
US7903457B2
(en)
*
|
2008-08-19 |
2011-03-08 |
Macronix International Co., Ltd. |
Multiple phase change materials in an integrated circuit for system on a chip application
|
|
US7719913B2
(en)
|
2008-09-12 |
2010-05-18 |
Macronix International Co., Ltd. |
Sensing circuit for PCRAM applications
|
|
US8324605B2
(en)
|
2008-10-02 |
2012-12-04 |
Macronix International Co., Ltd. |
Dielectric mesh isolated phase change structure for phase change memory
|
|
US7897954B2
(en)
|
2008-10-10 |
2011-03-01 |
Macronix International Co., Ltd. |
Dielectric-sandwiched pillar memory device
|
|
US8036014B2
(en)
*
|
2008-11-06 |
2011-10-11 |
Macronix International Co., Ltd. |
Phase change memory program method without over-reset
|
|
US8907316B2
(en)
|
2008-11-07 |
2014-12-09 |
Macronix International Co., Ltd. |
Memory cell access device having a pn-junction with polycrystalline and single crystal semiconductor regions
|
|
US8664689B2
(en)
|
2008-11-07 |
2014-03-04 |
Macronix International Co., Ltd. |
Memory cell access device having a pn-junction with polycrystalline plug and single-crystal semiconductor regions
|
|
US7869270B2
(en)
*
|
2008-12-29 |
2011-01-11 |
Macronix International Co., Ltd. |
Set algorithm for phase change memory cell
|
|
US8089137B2
(en)
|
2009-01-07 |
2012-01-03 |
Macronix International Co., Ltd. |
Integrated circuit memory with single crystal silicon on silicide driver and manufacturing method
|
|
US8107283B2
(en)
|
2009-01-12 |
2012-01-31 |
Macronix International Co., Ltd. |
Method for setting PCRAM devices
|
|
US8030635B2
(en)
|
2009-01-13 |
2011-10-04 |
Macronix International Co., Ltd. |
Polysilicon plug bipolar transistor for phase change memory
|
|
US8064247B2
(en)
*
|
2009-01-14 |
2011-11-22 |
Macronix International Co., Ltd. |
Rewritable memory device based on segregation/re-absorption
|
|
US8933536B2
(en)
|
2009-01-22 |
2015-01-13 |
Macronix International Co., Ltd. |
Polysilicon pillar bipolar transistor with self-aligned memory element
|
|
US8084760B2
(en)
|
2009-04-20 |
2011-12-27 |
Macronix International Co., Ltd. |
Ring-shaped electrode and manufacturing method for same
|
|
US8173987B2
(en)
|
2009-04-27 |
2012-05-08 |
Macronix International Co., Ltd. |
Integrated circuit 3D phase change memory array and manufacturing method
|
|
US8097871B2
(en)
|
2009-04-30 |
2012-01-17 |
Macronix International Co., Ltd. |
Low operational current phase change memory structures
|
|
US7933139B2
(en)
|
2009-05-15 |
2011-04-26 |
Macronix International Co., Ltd. |
One-transistor, one-resistor, one-capacitor phase change memory
|
|
US7968876B2
(en)
|
2009-05-22 |
2011-06-28 |
Macronix International Co., Ltd. |
Phase change memory cell having vertical channel access transistor
|
|
US8350316B2
(en)
|
2009-05-22 |
2013-01-08 |
Macronix International Co., Ltd. |
Phase change memory cells having vertical channel access transistor and memory plane
|
|
US8809829B2
(en)
|
2009-06-15 |
2014-08-19 |
Macronix International Co., Ltd. |
Phase change memory having stabilized microstructure and manufacturing method
|
|
US8406033B2
(en)
*
|
2009-06-22 |
2013-03-26 |
Macronix International Co., Ltd. |
Memory device and method for sensing and fixing margin cells
|
|
US8238149B2
(en)
*
|
2009-06-25 |
2012-08-07 |
Macronix International Co., Ltd. |
Methods and apparatus for reducing defect bits in phase change memory
|
|
US8363463B2
(en)
*
|
2009-06-25 |
2013-01-29 |
Macronix International Co., Ltd. |
Phase change memory having one or more non-constant doping profiles
|
|
US8110822B2
(en)
*
|
2009-07-15 |
2012-02-07 |
Macronix International Co., Ltd. |
Thermal protect PCRAM structure and methods for making
|
|
US8198619B2
(en)
|
2009-07-15 |
2012-06-12 |
Macronix International Co., Ltd. |
Phase change memory cell structure
|
|
US7894254B2
(en)
*
|
2009-07-15 |
2011-02-22 |
Macronix International Co., Ltd. |
Refresh circuitry for phase change memory
|
|
US20110049456A1
(en)
*
|
2009-09-03 |
2011-03-03 |
Macronix International Co., Ltd. |
Phase change structure with composite doping for phase change memory
|
|
US8064248B2
(en)
*
|
2009-09-17 |
2011-11-22 |
Macronix International Co., Ltd. |
2T2R-1T1R mix mode phase change memory array
|
|
US8178387B2
(en)
*
|
2009-10-23 |
2012-05-15 |
Macronix International Co., Ltd. |
Methods for reducing recrystallization time for a phase change material
|
|
US8729521B2
(en)
|
2010-05-12 |
2014-05-20 |
Macronix International Co., Ltd. |
Self aligned fin-type programmable memory cell
|
|
US8310864B2
(en)
|
2010-06-15 |
2012-11-13 |
Macronix International Co., Ltd. |
Self-aligned bit line under word line memory array
|
|
US8497705B2
(en)
|
2010-11-09 |
2013-07-30 |
Macronix International Co., Ltd. |
Phase change device for interconnection of programmable logic device
|
|
US8467238B2
(en)
|
2010-11-15 |
2013-06-18 |
Macronix International Co., Ltd. |
Dynamic pulse operation for phase change memory
|
|
KR101284143B1
(ko)
*
|
2011-08-03 |
2013-07-10 |
주식회사 엘에이치 |
미끄럼 방지 세라믹 도료
|
|
US8987700B2
(en)
|
2011-12-02 |
2015-03-24 |
Macronix International Co., Ltd. |
Thermally confined electrode for programmable resistance memory
|
|
US9336879B2
(en)
|
2014-01-24 |
2016-05-10 |
Macronix International Co., Ltd. |
Multiple phase change materials in an integrated circuit for system on a chip application
|
|
US9559113B2
(en)
|
2014-05-01 |
2017-01-31 |
Macronix International Co., Ltd. |
SSL/GSL gate oxide in 3D vertical channel NAND
|
|
US9672906B2
(en)
|
2015-06-19 |
2017-06-06 |
Macronix International Co., Ltd. |
Phase change memory with inter-granular switching
|