JPS628035B2 - - Google Patents
Info
- Publication number
- JPS628035B2 JPS628035B2 JP56075291A JP7529181A JPS628035B2 JP S628035 B2 JPS628035 B2 JP S628035B2 JP 56075291 A JP56075291 A JP 56075291A JP 7529181 A JP7529181 A JP 7529181A JP S628035 B2 JPS628035 B2 JP S628035B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- polyimide
- semiconductor
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/121—
-
- H10W42/25—
-
- H10W74/137—
-
- H10W74/47—
-
- H10W72/01515—
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- H10W72/075—
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- H10W72/5522—
-
- H10W72/5524—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Paints Or Removers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56075291A JPS57188853A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
| DE3126361A DE3126361C2 (de) | 1981-05-18 | 1981-07-03 | Schutzschicht für Halbleiterelemente |
| GB8120607A GB2098800B (en) | 1981-05-18 | 1981-07-03 | Resin encapsulated semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56075291A JPS57188853A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57188853A JPS57188853A (en) | 1982-11-19 |
| JPS628035B2 true JPS628035B2 (OSRAM) | 1987-02-20 |
Family
ID=13571981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56075291A Granted JPS57188853A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS57188853A (OSRAM) |
| DE (1) | DE3126361C2 (OSRAM) |
| GB (1) | GB2098800B (OSRAM) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6012744A (ja) * | 1983-07-01 | 1985-01-23 | Hitachi Ltd | 半導体装置 |
| JPS60208358A (ja) * | 1984-04-02 | 1985-10-19 | Hitachi Ltd | 複合体 |
| JPS60221426A (ja) * | 1984-04-17 | 1985-11-06 | Hitachi Chem Co Ltd | ポリイミド複合体の製造法 |
| JPS60238817A (ja) * | 1984-05-12 | 1985-11-27 | Citizen Watch Co Ltd | 液晶表示装置 |
| JPS60243120A (ja) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
| JPS60245150A (ja) * | 1984-05-21 | 1985-12-04 | Hitachi Ltd | 半導体装置 |
| JPH01110559A (ja) * | 1987-10-23 | 1989-04-27 | Hitachi Chem Co Ltd | 半導体素子保護膜用組成物 |
| JPH0682649B2 (ja) * | 1988-01-08 | 1994-10-19 | 日産化学工業株式会社 | 電気・電子デバイス用絶縁膜 |
| US5272247A (en) * | 1990-10-19 | 1993-12-21 | Hitachi, Ltd. | Polyimide precursor, cured product thereof, and processes for producing them |
| US5276414A (en) * | 1991-12-10 | 1994-01-04 | Mitsubishi Denki Kabushiki Kaisha | Moistureproof structure for module circuits |
| JPH05198786A (ja) * | 1992-01-22 | 1993-08-06 | Sharp Corp | クリアモールドccd固体撮像素子 |
| US5536584A (en) * | 1992-01-31 | 1996-07-16 | Hitachi, Ltd. | Polyimide precursor, polyimide and metalization structure using said polyimide |
| DE19741437A1 (de) * | 1997-09-19 | 1999-04-01 | Siemens Ag | Elektronisches Bauteil mit verbesserter Gehäusepreßmasse |
| DE60139463D1 (de) * | 2000-04-18 | 2009-09-17 | E Ink Corp | Prozess zur herstellung von dünnfilmtransistoren |
| US7893435B2 (en) | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
| JP5732884B2 (ja) * | 2011-02-09 | 2015-06-10 | 富士通株式会社 | 半導体装置及びその製造方法、電源装置 |
| CN105254886A (zh) * | 2015-11-02 | 2016-01-20 | 株洲时代新材料科技股份有限公司 | 聚酰胺酸树脂组合物、热塑性聚酰亚胺薄膜及其制备方法 |
| JP6790756B2 (ja) * | 2016-11-18 | 2020-11-25 | 宇部興産株式会社 | ポリイミド、ポリイミド前駆体、及びポリイミドフィルム |
| CN116478400B (zh) * | 2023-02-06 | 2024-10-18 | 中山大学 | 含四联苯衍生结构的聚酰亚胺、二胺单体及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226989B2 (OSRAM) * | 1973-05-18 | 1977-07-18 | ||
| JPS5176078A (en) * | 1974-12-23 | 1976-07-01 | Hitachi Ltd | Handaboshokumakuo hodokoshita handotaisochi |
| JPS5568659A (en) * | 1978-11-20 | 1980-05-23 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
| JPS55156343A (en) * | 1979-05-25 | 1980-12-05 | Hitachi Ltd | Manufacture of semiconductor device |
-
1981
- 1981-05-18 JP JP56075291A patent/JPS57188853A/ja active Granted
- 1981-07-03 DE DE3126361A patent/DE3126361C2/de not_active Expired
- 1981-07-03 GB GB8120607A patent/GB2098800B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2098800A (en) | 1982-11-24 |
| DE3126361C2 (de) | 1986-12-04 |
| GB2098800B (en) | 1986-03-26 |
| JPS57188853A (en) | 1982-11-19 |
| DE3126361A1 (de) | 1982-11-25 |
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