JPS6157347B2 - - Google Patents

Info

Publication number
JPS6157347B2
JPS6157347B2 JP57021332A JP2133282A JPS6157347B2 JP S6157347 B2 JPS6157347 B2 JP S6157347B2 JP 57021332 A JP57021332 A JP 57021332A JP 2133282 A JP2133282 A JP 2133282A JP S6157347 B2 JPS6157347 B2 JP S6157347B2
Authority
JP
Japan
Prior art keywords
fused silica
weight
average particle
resin
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57021332A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58138740A (ja
Inventor
Ryoichi Ide
Kenji Ootaguro
Akira Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP2133282A priority Critical patent/JPS58138740A/ja
Publication of JPS58138740A publication Critical patent/JPS58138740A/ja
Publication of JPS6157347B2 publication Critical patent/JPS6157347B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP2133282A 1982-02-15 1982-02-15 樹脂組成物 Granted JPS58138740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2133282A JPS58138740A (ja) 1982-02-15 1982-02-15 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2133282A JPS58138740A (ja) 1982-02-15 1982-02-15 樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58138740A JPS58138740A (ja) 1983-08-17
JPS6157347B2 true JPS6157347B2 (en, 2012) 1986-12-06

Family

ID=12052175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2133282A Granted JPS58138740A (ja) 1982-02-15 1982-02-15 樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58138740A (en, 2012)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219242A (ja) * 1982-06-15 1983-12-20 Toshiba Ceramics Co Ltd Ｉｃプラスチツクパツケ−ジ用フイラ−材
JPS6026505B2 (ja) * 1982-09-30 1985-06-24 新日本製鐵株式会社 無機充填樹脂組成物の製造方法
JPS59187038A (ja) * 1983-04-08 1984-10-24 Toshiba Ceramics Co Ltd Ｉｃプラスチツクパツケ−ジ用充填剤
GB8320086D0 (en) * 1983-07-26 1983-08-24 Ciba Geigy Ag Spherical fused silica
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物
JPS6164754A (ja) * 1984-09-05 1986-04-03 Nippon Steel Corp 無機充填樹脂組成物の製造方法
JPS6164756A (ja) * 1984-09-05 1986-04-03 Nippon Steel Corp 無機充填熱硬化性樹脂組成物
JPS6164755A (ja) * 1984-09-05 1986-04-03 Nippon Steel Corp バリが発生しない封止材用シリカ充填樹脂組成物
JPS61190556A (ja) * 1985-02-12 1986-08-25 Rishiyou Kogyo Kk 電子部品封止用樹脂組成物
JP2593843B2 (ja) * 1985-02-19 1997-03-26 日東電工株式会社 半導体装置
JPS61254619A (ja) * 1985-05-07 1986-11-12 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS61258863A (ja) * 1985-05-13 1986-11-17 Shin Etsu Chem Co Ltd 硬化性樹脂組成物
JP2622110B2 (ja) * 1986-07-07 1997-06-18 日東電工株式会社 半導体装置
JPS63128020A (ja) * 1986-11-18 1988-05-31 Hitachi Ltd 樹脂封止型半導体装置
JP2572761B2 (ja) * 1986-12-23 1997-01-16 日東電工株式会社 半導体装置
JPS6422967A (en) * 1987-07-17 1989-01-25 Shinetsu Chemical Co Curable liquid silicone rubber composition
JPS6462362A (en) * 1987-09-03 1989-03-08 Seitetsu Kagaku Co Ltd Filler and polymer composition containing same
JPH0696445B2 (ja) * 1988-08-25 1994-11-30 日本化学工業株式会社 微細溶融球状シリカおよびその製造法
JPH062569B2 (ja) * 1990-12-31 1994-01-12 住友精化株式会社 シリカ微粉末
JP2702401B2 (ja) * 1994-05-09 1998-01-21 株式会社日立製作所 樹脂封止型半導体装置とその製法
CN1230483C (zh) 1998-08-13 2005-12-07 日立化成工业株式会社 电路构件连接用的粘结剂,电路板及其制造方法
MY135619A (en) * 2002-11-12 2008-05-30 Nitto Denko Corp Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP6564517B1 (ja) 2018-12-17 2019-08-21 株式会社アドマテックス 電子材料用フィラー及びその製造方法、電子材料用樹脂組成物の製造方法、高周波用基板、並びに電子材料用スラリー
JP6595137B1 (ja) 2019-02-27 2019-10-23 株式会社アドマテックス 金属酸化物粒子材料の製造方法
CN113614036A (zh) 2019-03-26 2021-11-05 电化株式会社 球状二氧化硅粉末
WO2021215519A1 (ja) 2020-04-24 2021-10-28 デンカ株式会社 球状シリカ粉末
JPWO2022065349A1 (en, 2012) 2020-09-25 2022-03-31
JPWO2022137949A1 (en, 2012) 2020-12-24 2022-06-30
KR20240018601A (ko) 2021-07-14 2024-02-13 덴카 주식회사 산화물 복합 입자 및 그 제조 방법, 그리고 수지 조성물
EP4371937A4 (en) 2021-07-14 2024-12-04 Denka Company Limited Oxide composite particles, method for producing same, and resin composition
WO2023112281A1 (ja) 2021-12-16 2023-06-22 株式会社アドマテックス 電子材料用フィラー及びその製造方法、電子材料用スラリー、並びに電子材料用樹脂組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496038A (en, 2012) * 1972-05-09 1974-01-19
JPS52138564A (en) * 1975-12-24 1977-11-18 Suwa Seikosha Kk Protective coating layer on plastic goods
JPS6040188B2 (ja) * 1976-06-08 1985-09-10 旭硝子株式会社 電子部品の封止方法
US4087401A (en) * 1976-07-12 1978-05-02 Stayner Vance A Silica flour containing reinforced resin compositions and articles formed thereof
JPS5443021A (en) * 1977-09-12 1979-04-05 Minolta Camera Co Ltd F/stop digital value display device of cameras
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS5819136B2 (ja) * 1979-03-06 1983-04-16 日東電工株式会社 半導体封止用エポキシ樹脂組成物
SU977080A1 (ru) * 1979-03-07 1982-11-30 Предприятие П/Я А-7697 Стан мокрого волочени проволоки без скольжени
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS56130953U (en, 2012) * 1980-03-07 1981-10-05
JPS575421A (en) * 1980-06-13 1982-01-12 Fujitsu Ltd Analog delay circuit
JPS5829858A (ja) * 1981-08-13 1983-02-22 Nitto Electric Ind Co Ltd 電子部品封止用樹脂組成物

Also Published As

Publication number Publication date
JPS58138740A (ja) 1983-08-17

Similar Documents

Publication Publication Date Title
JPS6157347B2 (en, 2012)
US6207296B1 (en) Inorganic filler, epoxy resin composition, and semiconductor device
JPH0375570B2 (en, 2012)
JPH11302506A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2649632B2 (ja) 樹脂封止型半導体装置
JPH059270A (ja) 樹脂組成物およびその製造方法
JPS6296568A (ja) 半導体封止用樹脂組成物
JP3445707B2 (ja) シリカ質フィラー及びその製法
JP2000063636A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPS6296567A (ja) 半導体封止用エポキシ樹脂組成物
JP2000319633A (ja) エポキシ樹脂系封止材料用シリカ系充填材
JPS6296538A (ja) 無機充填材及び樹脂組成物
JP2576713B2 (ja) エポキシ樹脂組成物及び半導体装置
JPH0479379B2 (en, 2012)
JPH03211A (ja) 半導体封止用エポキシ樹脂成形材料の製造方法
JP2649054B2 (ja) 粒子状無機質複合体及びその製造方法
JPS63108021A (ja) 樹脂封止型半導体装置
JP2925088B2 (ja) 微細溶融球状シリカ及びこれを用いた封止用樹脂組成物
JPS6296569A (ja) 半導体封止用樹脂組成物
JP2789088B2 (ja) 粒子状無機質複合体の製造方法
JPS63297436A (ja) Ｉｃ用封止材樹脂組成物
JPH11349825A (ja) 封止用樹脂組成物および半導体装置
JP2000186214A (ja) 封止用樹脂組成物および半導体装置
JPH11323151A (ja) 封止用樹脂組成物
JPS63248712A (ja) 無機質充填剤及びその製法