JPS6149838B2 - - Google Patents

Info

Publication number
JPS6149838B2
JPS6149838B2 JP53157817A JP15781778A JPS6149838B2 JP S6149838 B2 JPS6149838 B2 JP S6149838B2 JP 53157817 A JP53157817 A JP 53157817A JP 15781778 A JP15781778 A JP 15781778A JP S6149838 B2 JPS6149838 B2 JP S6149838B2
Authority
JP
Japan
Prior art keywords
circuit components
circuit
solder
circuit board
leadless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53157817A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5582487A (en
Inventor
Mitsuo Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP15781778A priority Critical patent/JPS5582487A/ja
Priority to DE19792950450 priority patent/DE2950450A1/de
Priority to GB7943132A priority patent/GB2037489B/en
Priority to IT42915/79A priority patent/IT1193457B/it
Priority to CA000342057A priority patent/CA1140680A/en
Priority to NL7909108A priority patent/NL7909108A/nl
Publication of JPS5582487A publication Critical patent/JPS5582487A/ja
Publication of JPS6149838B2 publication Critical patent/JPS6149838B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP15781778A 1978-12-18 1978-12-18 Electronic circuit device Granted JPS5582487A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP15781778A JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device
DE19792950450 DE2950450A1 (de) 1978-12-18 1979-12-14 Auf gedruckter schaltungsplatte befestigte elektronische schaltungsanordnung
GB7943132A GB2037489B (en) 1978-12-18 1979-12-14 Circuit components interconnected by solder layers
IT42915/79A IT1193457B (it) 1978-12-18 1979-12-17 Complesso circuitale elettronico montato su di un pannello a circuito stampato
CA000342057A CA1140680A (en) 1978-12-18 1979-12-17 Electronic circuit arrangement mounted on printed circuit board
NL7909108A NL7909108A (nl) 1978-12-18 1979-12-18 Op een bord met gedrukte bedrading gemonteerde electronische schakeling.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15781778A JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device

Publications (2)

Publication Number Publication Date
JPS5582487A JPS5582487A (en) 1980-06-21
JPS6149838B2 true JPS6149838B2 (US07922777-20110412-C00004.png) 1986-10-31

Family

ID=15657940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15781778A Granted JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device

Country Status (6)

Country Link
JP (1) JPS5582487A (US07922777-20110412-C00004.png)
CA (1) CA1140680A (US07922777-20110412-C00004.png)
DE (1) DE2950450A1 (US07922777-20110412-C00004.png)
GB (1) GB2037489B (US07922777-20110412-C00004.png)
IT (1) IT1193457B (US07922777-20110412-C00004.png)
NL (1) NL7909108A (US07922777-20110412-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3910097A1 (en) 2020-05-12 2021-11-17 Kabushiki Kaisha Toyota Jidoshokki Ring of spinning machine and manufacturing method for the ring

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724775U (US07922777-20110412-C00004.png) * 1980-07-17 1982-02-08
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
JPS61210601A (ja) * 1985-03-14 1986-09-18 進工業株式会社 チツプ抵抗器
FR2584887A1 (fr) * 1985-07-12 1987-01-16 Thomson Semi Conducteurs Boitier bipole pour composant en surface et conditionnement de boitiers selon l'invention
US4801904A (en) * 1986-01-14 1989-01-31 Murata Manufacturing Co., Ltd. Chip-like LC filter
DE3619212A1 (de) * 1986-06-07 1987-12-10 Philips Patentverwaltung Passives elektrisches bauelement
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4755785A (en) * 1987-01-29 1988-07-05 Bel Fuse Inc. Surface mounted fuse assembly
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3910097A1 (en) 2020-05-12 2021-11-17 Kabushiki Kaisha Toyota Jidoshokki Ring of spinning machine and manufacturing method for the ring

Also Published As

Publication number Publication date
JPS5582487A (en) 1980-06-21
DE2950450A1 (de) 1980-07-03
GB2037489A (en) 1980-07-09
CA1140680A (en) 1983-02-01
IT1193457B (it) 1988-06-22
IT7942915A0 (it) 1979-12-17
GB2037489B (en) 1983-05-05
NL7909108A (nl) 1980-06-20

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