IT7942915A0 - Circuito stampato. complesso circuitale elettronico montato su di un pannello a - Google Patents

Circuito stampato. complesso circuitale elettronico montato su di un pannello a

Info

Publication number
IT7942915A0
IT7942915A0 IT7942915A IT4291579A IT7942915A0 IT 7942915 A0 IT7942915 A0 IT 7942915A0 IT 7942915 A IT7942915 A IT 7942915A IT 4291579 A IT4291579 A IT 4291579A IT 7942915 A0 IT7942915 A0 IT 7942915A0
Authority
IT
Italy
Prior art keywords
panel
printed circuit
electronic circuit
circuit
complex mounted
Prior art date
Application number
IT7942915A
Other languages
English (en)
Other versions
IT1193457B (it
Inventor
Mitsuo Ohsawa
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of IT7942915A0 publication Critical patent/IT7942915A0/it
Application granted granted Critical
Publication of IT1193457B publication Critical patent/IT1193457B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772Conductors directly under a component but not electrically connected to the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10363Jumpers, i.e. non-printed cross-over connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/1053Mounted components directly electrically connected to each other, i.e. not via the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305Affixing by adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
IT42915/79A 1978-12-18 1979-12-17 Complesso circuitale elettronico montato su di un pannello a circuito stampato IT1193457B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15781778A JPS5582487A (en) 1978-12-18 1978-12-18 Electronic circuit device

Publications (2)

Publication Number Publication Date
IT7942915A0 true IT7942915A0 (it) 1979-12-17
IT1193457B IT1193457B (it) 1988-06-22

Family

ID=15657940

Family Applications (1)

Application Number Title Priority Date Filing Date
IT42915/79A IT1193457B (it) 1978-12-18 1979-12-17 Complesso circuitale elettronico montato su di un pannello a circuito stampato

Country Status (6)

Country Link
JP (1) JPS5582487A (it)
CA (1) CA1140680A (it)
DE (1) DE2950450A1 (it)
GB (1) GB2037489B (it)
IT (1) IT1193457B (it)
NL (1) NL7909108A (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724775U (it) * 1980-07-17 1982-02-08
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
JPS61210601A (ja) * 1985-03-14 1986-09-18 進工業株式会社 チツプ抵抗器
FR2584887A1 (fr) * 1985-07-12 1987-01-16 Thomson Semi Conducteurs Boitier bipole pour composant en surface et conditionnement de boitiers selon l'invention
US4801904A (en) * 1986-01-14 1989-01-31 Murata Manufacturing Co., Ltd. Chip-like LC filter
DE3619212A1 (de) * 1986-06-07 1987-12-10 Philips Patentverwaltung Passives elektrisches bauelement
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4755785A (en) * 1987-01-29 1988-07-05 Bel Fuse Inc. Surface mounted fuse assembly
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JP7390969B2 (ja) 2020-05-12 2023-12-04 株式会社豊田中央研究所 精紡機用リングおよびその製造方法

Also Published As

Publication number Publication date
GB2037489B (en) 1983-05-05
IT1193457B (it) 1988-06-22
CA1140680A (en) 1983-02-01
GB2037489A (en) 1980-07-09
DE2950450A1 (de) 1980-07-03
NL7909108A (nl) 1980-06-20
JPS5582487A (en) 1980-06-21
JPS6149838B2 (it) 1986-10-31

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