JPS54158669A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS54158669A JPS54158669A JP6817678A JP6817678A JPS54158669A JP S54158669 A JPS54158669 A JP S54158669A JP 6817678 A JP6817678 A JP 6817678A JP 6817678 A JP6817678 A JP 6817678A JP S54158669 A JPS54158669 A JP S54158669A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6817678A JPS54158669A (en) | 1978-06-05 | 1978-06-05 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6817678A JPS54158669A (en) | 1978-06-05 | 1978-06-05 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54158669A true JPS54158669A (en) | 1979-12-14 |
Family
ID=13366194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6817678A Pending JPS54158669A (en) | 1978-06-05 | 1978-06-05 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54158669A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284370U (en) * | 1988-12-20 | 1990-06-29 | ||
JPH04158596A (en) * | 1990-10-22 | 1992-06-01 | Kokusai Electric Co Ltd | Electronic parts mounting method and electronic parts mounting board |
JP2006196865A (en) * | 2004-12-15 | 2006-07-27 | Shinko Electric Ind Co Ltd | Electronic component packaging structure and its manufacturing method |
US7176055B2 (en) | 2001-11-02 | 2007-02-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
US20150021080A1 (en) * | 2013-07-22 | 2015-01-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579056A (en) * | 1967-10-21 | 1971-05-18 | Philips Corp | Semiconductor circuit having active devices embedded in flexible sheet |
US3615946A (en) * | 1967-12-01 | 1971-10-26 | Gen Electric | Method of embedding semiconductor chip within a dielectric layer flush with surface |
JPS497757A (en) * | 1972-05-11 | 1974-01-23 |
-
1978
- 1978-06-05 JP JP6817678A patent/JPS54158669A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579056A (en) * | 1967-10-21 | 1971-05-18 | Philips Corp | Semiconductor circuit having active devices embedded in flexible sheet |
US3615946A (en) * | 1967-12-01 | 1971-10-26 | Gen Electric | Method of embedding semiconductor chip within a dielectric layer flush with surface |
JPS497757A (en) * | 1972-05-11 | 1974-01-23 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284370U (en) * | 1988-12-20 | 1990-06-29 | ||
JPH04158596A (en) * | 1990-10-22 | 1992-06-01 | Kokusai Electric Co Ltd | Electronic parts mounting method and electronic parts mounting board |
US7176055B2 (en) | 2001-11-02 | 2007-02-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
JP2006196865A (en) * | 2004-12-15 | 2006-07-27 | Shinko Electric Ind Co Ltd | Electronic component packaging structure and its manufacturing method |
JP4602208B2 (en) * | 2004-12-15 | 2010-12-22 | 新光電気工業株式会社 | Electronic component mounting structure and manufacturing method thereof |
US20150021080A1 (en) * | 2013-07-22 | 2015-01-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein |
US9607762B2 (en) * | 2013-07-22 | 2017-03-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein |
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