JPS54158669A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPS54158669A
JPS54158669A JP6817678A JP6817678A JPS54158669A JP S54158669 A JPS54158669 A JP S54158669A JP 6817678 A JP6817678 A JP 6817678A JP 6817678 A JP6817678 A JP 6817678A JP S54158669 A JPS54158669 A JP S54158669A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6817678A
Other languages
Japanese (ja)
Inventor
Fumio Nishikawa
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6817678A priority Critical patent/JPS54158669A/en
Publication of JPS54158669A publication Critical patent/JPS54158669A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP6817678A 1978-06-05 1978-06-05 Printed circuit board Pending JPS54158669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6817678A JPS54158669A (en) 1978-06-05 1978-06-05 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6817678A JPS54158669A (en) 1978-06-05 1978-06-05 Printed circuit board

Publications (1)

Publication Number Publication Date
JPS54158669A true JPS54158669A (en) 1979-12-14

Family

ID=13366194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6817678A Pending JPS54158669A (en) 1978-06-05 1978-06-05 Printed circuit board

Country Status (1)

Country Link
JP (1) JPS54158669A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284370U (en) * 1988-12-20 1990-06-29
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
JP2006196865A (en) * 2004-12-15 2006-07-27 Shinko Electric Ind Co Ltd Electronic component packaging structure and its manufacturing method
US7176055B2 (en) 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
US20150021080A1 (en) * 2013-07-22 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579056A (en) * 1967-10-21 1971-05-18 Philips Corp Semiconductor circuit having active devices embedded in flexible sheet
US3615946A (en) * 1967-12-01 1971-10-26 Gen Electric Method of embedding semiconductor chip within a dielectric layer flush with surface
JPS497757A (en) * 1972-05-11 1974-01-23

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579056A (en) * 1967-10-21 1971-05-18 Philips Corp Semiconductor circuit having active devices embedded in flexible sheet
US3615946A (en) * 1967-12-01 1971-10-26 Gen Electric Method of embedding semiconductor chip within a dielectric layer flush with surface
JPS497757A (en) * 1972-05-11 1974-01-23

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284370U (en) * 1988-12-20 1990-06-29
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
US7176055B2 (en) 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
JP2006196865A (en) * 2004-12-15 2006-07-27 Shinko Electric Ind Co Ltd Electronic component packaging structure and its manufacturing method
JP4602208B2 (en) * 2004-12-15 2010-12-22 新光電気工業株式会社 Electronic component mounting structure and manufacturing method thereof
US20150021080A1 (en) * 2013-07-22 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
US9607762B2 (en) * 2013-07-22 2017-03-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

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