JPS6149819B2 - - Google Patents

Info

Publication number
JPS6149819B2
JPS6149819B2 JP52086524A JP8652477A JPS6149819B2 JP S6149819 B2 JPS6149819 B2 JP S6149819B2 JP 52086524 A JP52086524 A JP 52086524A JP 8652477 A JP8652477 A JP 8652477A JP S6149819 B2 JPS6149819 B2 JP S6149819B2
Authority
JP
Japan
Prior art keywords
aperture
protective film
wiring path
bump
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52086524A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5421165A (en
Inventor
Masaharu Yorikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8652477A priority Critical patent/JPS5421165A/ja
Priority to US05/925,324 priority patent/US4263606A/en
Publication of JPS5421165A publication Critical patent/JPS5421165A/ja
Publication of JPS6149819B2 publication Critical patent/JPS6149819B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W72/07236—
    • H10W72/221—
    • H10W72/251—
    • H10W72/923—
    • H10W72/952—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP8652477A 1977-07-18 1977-07-18 Semiconductor device Granted JPS5421165A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8652477A JPS5421165A (en) 1977-07-18 1977-07-18 Semiconductor device
US05/925,324 US4263606A (en) 1977-07-18 1978-07-17 Low stress semiconductor device lead connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8652477A JPS5421165A (en) 1977-07-18 1977-07-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5421165A JPS5421165A (en) 1979-02-17
JPS6149819B2 true JPS6149819B2 (enExample) 1986-10-31

Family

ID=13889366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8652477A Granted JPS5421165A (en) 1977-07-18 1977-07-18 Semiconductor device

Country Status (2)

Country Link
US (1) US4263606A (enExample)
JP (1) JPS5421165A (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745259A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Resin sealing type semiconductor device
US5552639A (en) * 1980-09-01 1996-09-03 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5371411A (en) * 1980-09-01 1994-12-06 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US4514751A (en) * 1982-12-23 1985-04-30 International Business Machines Corporation Compressively stresses titanium metallurgy for contacting passivated semiconductor devices
DE3343367A1 (de) * 1983-11-30 1985-06-05 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit hoeckerartigen, metallischen anschlusskontakten und mehrlagenverdrahtung
JPS6178151A (ja) * 1984-09-25 1986-04-21 Nec Corp 半導体装置
US5134460A (en) * 1986-08-11 1992-07-28 International Business Machines Corporation Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
JPS6373660A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 半導体装置
US5132775A (en) * 1987-12-11 1992-07-21 Texas Instruments Incorporated Methods for and products having self-aligned conductive pillars on interconnects
US5243363A (en) * 1988-07-22 1993-09-07 Canon Kabushiki Kaisha Ink-jet recording head having bump-shaped electrode and protective layer providing structural support
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
US5182420A (en) * 1989-04-25 1993-01-26 Cray Research, Inc. Method of fabricating metallized chip carriers from wafer-shaped substrates
US5135155A (en) * 1989-08-25 1992-08-04 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5006917A (en) * 1989-08-25 1991-04-09 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5120418A (en) * 1989-08-25 1992-06-09 International Business Machines Corporation Lead frame plating apparatus for thermocompression bonding
US5242569A (en) * 1989-08-25 1993-09-07 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5148261A (en) * 1989-08-25 1992-09-15 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5150197A (en) * 1989-10-05 1992-09-22 Digital Equipment Corporation Die attach structure and method
US5206186A (en) * 1990-10-26 1993-04-27 General Electric Company Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding
US5184206A (en) * 1990-10-26 1993-02-02 General Electric Company Direct thermocompression bonding for thin electronic power chips
US5196377A (en) * 1990-12-20 1993-03-23 Cray Research, Inc. Method of fabricating silicon-based carriers
US5053851A (en) * 1991-01-14 1991-10-01 International Business Machines Corp. Metal bump for a thermal compression bond and method for making same
US5059553A (en) * 1991-01-14 1991-10-22 Ibm Corporation Metal bump for a thermal compression bond and method for making same
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente
US5283948A (en) * 1991-05-31 1994-02-08 Cray Research, Inc. Method of manufacturing interconnect bumps
US5223851A (en) * 1991-06-05 1993-06-29 Trovan Limited Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
EP0526133B1 (en) * 1991-07-26 1997-03-19 Nec Corporation Polyimide multilayer wiring substrate and method for manufacturing the same
CA2075462C (en) * 1992-01-27 1999-05-04 George Erdos Bump structure and method for bonding to a semi-conductor device
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
JP3353508B2 (ja) * 1994-12-20 2002-12-03 ソニー株式会社 プリント配線板とこれを用いた電子装置
US5973931A (en) * 1996-03-29 1999-10-26 Sony Corporation Printed wiring board and electronic device using same
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JP3149846B2 (ja) * 1998-04-17 2001-03-26 日本電気株式会社 半導体装置及びその製造方法
US6090643A (en) * 1998-08-17 2000-07-18 Teccor Electronics, L.P. Semiconductor chip-substrate attachment structure
JP4121665B2 (ja) * 1999-04-19 2008-07-23 株式会社ルネサステクノロジ 半導体基板の接合方法
JP3494940B2 (ja) * 1999-12-20 2004-02-09 シャープ株式会社 テープキャリア型半導体装置、その製造方法及びそれを用いた液晶モジュール
JP2003110016A (ja) * 2001-09-28 2003-04-11 Kobe Steel Ltd 半導体基板上への空中金属配線の形成方法
JP3731053B2 (ja) * 2002-12-18 2006-01-05 独立行政法人 宇宙航空研究開発機構 導電性融液中の拡散係数計測方法及び導電性融液中の拡散係数計測装置
US6784089B2 (en) * 2003-01-13 2004-08-31 Aptos Corporation Flat-top bumping structure and preparation method
US7109583B2 (en) * 2004-05-06 2006-09-19 Endwave Corporation Mounting with auxiliary bumps
JP2006032864A (ja) * 2004-07-21 2006-02-02 Sony Corp 多層配線構造と多層配線構造を有する半導体装置とこれらの製造方法
US8604624B2 (en) * 2008-03-19 2013-12-10 Stats Chippac Ltd. Flip chip interconnection system having solder position control mechanism
DE102009010816B4 (de) * 2009-02-27 2011-03-10 Solarworld Innovations Gmbh Verfahren zur Herstellung eines Halbleiter-Bauelements

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303071A (en) * 1964-10-27 1967-02-07 Bell Telephone Labor Inc Fabrication of a semiconductive device with closely spaced electrodes
US3629669A (en) * 1968-11-25 1971-12-21 Gen Motors Corp Passivated wire-bonded semiconductor device
US3617818A (en) * 1968-12-31 1971-11-02 Texas Instruments Inc Corrosion-resistent multimetal lead contact for semiconductor devices
NL159822B (nl) * 1969-01-02 1979-03-15 Philips Nv Halfgeleiderinrichting.
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
US3921200A (en) * 1974-04-15 1975-11-18 Motorola Inc Composite beam lead metallization
US4005455A (en) * 1974-08-21 1977-01-25 Intel Corporation Corrosive resistant semiconductor interconnect pad
JPS51147253A (en) * 1975-06-13 1976-12-17 Nec Corp Structure of electrode terminal
JPS5851425B2 (ja) * 1975-08-22 1983-11-16 株式会社日立製作所 ハンドウタイソウチ
US4045594A (en) * 1975-12-31 1977-08-30 Ibm Corporation Planar insulation of conductive patterns by chemical vapor deposition and sputtering

Also Published As

Publication number Publication date
JPS5421165A (en) 1979-02-17
US4263606A (en) 1981-04-21

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