JPS6140811A - 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 - Google Patents
溶融用水和シリカおよびこれを用いた溶融シリカの製造方法Info
- Publication number
- JPS6140811A JPS6140811A JP15913384A JP15913384A JPS6140811A JP S6140811 A JPS6140811 A JP S6140811A JP 15913384 A JP15913384 A JP 15913384A JP 15913384 A JP15913384 A JP 15913384A JP S6140811 A JPS6140811 A JP S6140811A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- melting
- hydrated
- silica gel
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 101
- 229960004029 silicic acid Drugs 0.000 title claims description 31
- LRCFXGAMWKDGLA-UHFFFAOYSA-N dioxosilane;hydrate Chemical compound O.O=[Si]=O LRCFXGAMWKDGLA-UHFFFAOYSA-N 0.000 title claims description 30
- 239000000377 silicon dioxide Substances 0.000 title claims description 30
- 238000002844 melting Methods 0.000 title claims description 28
- 230000008018 melting Effects 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000741 silica gel Substances 0.000 claims description 39
- 229910002027 silica gel Inorganic materials 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 30
- 239000000843 powder Substances 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000005350 fused silica glass Substances 0.000 claims description 14
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 10
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 239000002216 antistatic agent Substances 0.000 claims description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 229910052776 Thorium Inorganic materials 0.000 claims description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000003456 ion exchange resin Substances 0.000 claims description 2
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 2
- 239000002994 raw material Substances 0.000 description 17
- 229960001866 silicon dioxide Drugs 0.000 description 16
- 229910052760 oxygen Inorganic materials 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 238000005187 foaming Methods 0.000 description 9
- 239000000945 filler Substances 0.000 description 8
- 239000002737 fuel gas Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000006060 molten glass Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- ATRMIFNAYHCLJR-UHFFFAOYSA-N [O].CCC Chemical compound [O].CCC ATRMIFNAYHCLJR-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229920001429 chelating resin Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000701 coagulant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000005624 silicic acid group Chemical class 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Silicon Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15913384A JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15913384A JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6140811A true JPS6140811A (ja) | 1986-02-27 |
| JPH0127003B2 JPH0127003B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-26 |
Family
ID=15686966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15913384A Granted JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6140811A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230422A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Chem Ind Co Ltd | 高純度シリカ及びその製造方法 |
| US7265167B2 (en) | 2002-11-12 | 2007-09-04 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP2012142439A (ja) * | 2010-12-28 | 2012-07-26 | Jgc Catalysts & Chemicals Ltd | 半導体装置実装用ペ−スト |
| JP2014141382A (ja) * | 2013-01-25 | 2014-08-07 | Nikon Corp | シリカ粒子分散液の製造方法およびシリカ粒子分散液を用いた研磨方法 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125235A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-08-23 | 1976-03-01 | Ichikoh Industries Ltd | |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5659837A (en) * | 1979-09-28 | 1981-05-23 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS5693749A (en) * | 1979-12-27 | 1981-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS56116647A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Manufacturing of silica-alumina type filler for semiconductor memory element covering resin |
| JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
| JPS57212224A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPS58145613A (ja) * | 1982-02-15 | 1983-08-30 | Denki Kagaku Kogyo Kk | 溶融シリカ球状体、その製造法およびその装置 |
| JPS5954632A (ja) * | 1982-09-21 | 1984-03-29 | Mitsubishi Metal Corp | 石英ガラス粉末の製造法 |
| JPS5955722A (ja) * | 1982-09-27 | 1984-03-30 | Nichias Corp | 弗素樹脂製隔膜の製造法 |
| JPS59107937A (ja) * | 1982-12-10 | 1984-06-22 | Seiko Epson Corp | 石英ガラスの製造法 |
-
1984
- 1984-07-31 JP JP15913384A patent/JPS6140811A/ja active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125235A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-08-23 | 1976-03-01 | Ichikoh Industries Ltd | |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5659837A (en) * | 1979-09-28 | 1981-05-23 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS5693749A (en) * | 1979-12-27 | 1981-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS56116647A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Manufacturing of silica-alumina type filler for semiconductor memory element covering resin |
| JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
| JPS57212224A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPS58145613A (ja) * | 1982-02-15 | 1983-08-30 | Denki Kagaku Kogyo Kk | 溶融シリカ球状体、その製造法およびその装置 |
| JPS5954632A (ja) * | 1982-09-21 | 1984-03-29 | Mitsubishi Metal Corp | 石英ガラス粉末の製造法 |
| JPS5955722A (ja) * | 1982-09-27 | 1984-03-30 | Nichias Corp | 弗素樹脂製隔膜の製造法 |
| JPS59107937A (ja) * | 1982-12-10 | 1984-06-22 | Seiko Epson Corp | 石英ガラスの製造法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230422A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Chem Ind Co Ltd | 高純度シリカ及びその製造方法 |
| US7265167B2 (en) | 2002-11-12 | 2007-09-04 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP2012142439A (ja) * | 2010-12-28 | 2012-07-26 | Jgc Catalysts & Chemicals Ltd | 半導体装置実装用ペ−スト |
| JP2014141382A (ja) * | 2013-01-25 | 2014-08-07 | Nikon Corp | シリカ粒子分散液の製造方法およびシリカ粒子分散液を用いた研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0127003B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |