JPS6115582B2 - - Google Patents

Info

Publication number
JPS6115582B2
JPS6115582B2 JP7898078A JP7898078A JPS6115582B2 JP S6115582 B2 JPS6115582 B2 JP S6115582B2 JP 7898078 A JP7898078 A JP 7898078A JP 7898078 A JP7898078 A JP 7898078A JP S6115582 B2 JPS6115582 B2 JP S6115582B2
Authority
JP
Japan
Prior art keywords
thin film
aluminum
pattern
type thin
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7898078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS556844A (en
Inventor
Masaharu Yorikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Original Assignee
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHO ERU ESU AI GIJUTSU KENKYU KUMIAI filed Critical CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority to JP7898078A priority Critical patent/JPS556844A/ja
Publication of JPS556844A publication Critical patent/JPS556844A/ja
Publication of JPS6115582B2 publication Critical patent/JPS6115582B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP7898078A 1978-06-28 1978-06-28 Method of formating wiring pattern Granted JPS556844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7898078A JPS556844A (en) 1978-06-28 1978-06-28 Method of formating wiring pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7898078A JPS556844A (en) 1978-06-28 1978-06-28 Method of formating wiring pattern

Publications (2)

Publication Number Publication Date
JPS556844A JPS556844A (en) 1980-01-18
JPS6115582B2 true JPS6115582B2 (enExample) 1986-04-24

Family

ID=13677032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7898078A Granted JPS556844A (en) 1978-06-28 1978-06-28 Method of formating wiring pattern

Country Status (1)

Country Link
JP (1) JPS556844A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470589A (ja) * 1990-07-12 1992-03-05 Koufu Nippon Denki Kk フォトセンサ信号検出回路

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519873A (en) * 1978-07-28 1980-02-12 Mitsubishi Electric Corp Forming method of metallic layer pattern for semiconductor
JPS5715441A (en) * 1980-07-01 1982-01-26 Fujitsu Ltd Formation of aluminum interconnection
JPS5739538A (en) * 1980-08-20 1982-03-04 Matsushita Electric Ind Co Ltd Etching method of aluminum
JPS5749231A (en) * 1980-09-09 1982-03-23 Mitsubishi Electric Corp Forming method for electrode and wiring layer
JPS57130429A (en) * 1981-02-06 1982-08-12 Hitachi Ltd Formation of electrode wiring
JPS583253A (ja) * 1981-06-29 1983-01-10 Seiko Epson Corp 半導体基板上への金属配線形成方法
JP2552876B2 (ja) * 1987-08-25 1996-11-13 本田技研工業株式会社 車輌盗難防止装置
JPH0714712B2 (ja) * 1987-08-25 1995-02-22 本田技研工業株式会社 車輌盗難防止装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470589A (ja) * 1990-07-12 1992-03-05 Koufu Nippon Denki Kk フォトセンサ信号検出回路

Also Published As

Publication number Publication date
JPS556844A (en) 1980-01-18

Similar Documents

Publication Publication Date Title
US4496419A (en) Fine line patterning method for submicron devices
US4897365A (en) Reduced-beak planox process for the formation of integrated electronic components
JPS588579B2 (ja) ハンドウタイソウチノセイゾウホウホウ
JPS6115582B2 (enExample)
US3772102A (en) Method of transferring a desired pattern in silicon to a substrate layer
JP2765561B2 (ja) 微細空中配線の作製方法
JP2892337B2 (ja) 半導体素子の金属配線製造方法
JPH1197346A (ja) 半導体ウエハの製造
JP2902513B2 (ja) レジストパターン形成方法
JPS58194334A (ja) 薄膜の形成方法
JPH05144812A (ja) 半導体装置の製造方法
JPH079930B2 (ja) 半導体装置の製造方法
JPS6143484A (ja) 半導体装置の電極形成方法
JPS583230A (ja) 半導体装置の製造方法
JPH02134818A (ja) 配線構造体の形成法
JPH02165656A (ja) 半導体装置の製造方法
JPH0484422A (ja) 微細な金属配線の形成方法
JPH0828538B2 (ja) 超電導薄膜パタンの形成方法
JPH0697292A (ja) 半導体装置およびその製造方法
JPH0289319A (ja) 半導体装置の製造方法
JPH09181081A (ja) 半導体装置の製造方法
JPS62234333A (ja) 微細溝加工用マスクの形成方法
JPS60153146A (ja) 半導体装置のアルミニウム配線
JPS5928344A (ja) 半導体装置の製造方法
JPS60208872A (ja) 超電導コンタクトの製造方法