JPS61136909A - 無水ケイ酸の水分散液組成物 - Google Patents

無水ケイ酸の水分散液組成物

Info

Publication number
JPS61136909A
JPS61136909A JP59256363A JP25636384A JPS61136909A JP S61136909 A JPS61136909 A JP S61136909A JP 59256363 A JP59256363 A JP 59256363A JP 25636384 A JP25636384 A JP 25636384A JP S61136909 A JPS61136909 A JP S61136909A
Authority
JP
Japan
Prior art keywords
silica
silicic acid
aqueous dispersion
silanol group
anhydrous silicic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59256363A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05338B2 (cg-RX-API-DMAC10.html
Inventor
Katsuhisa Kamiyama
神山　勝久
Tsuneo Kimura
木村　恒夫
Teruo Kidera
木寺　輝雄
Yukio Kajiwara
梶原　由紀夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Industries Ltd filed Critical Mitsubishi Chemical Industries Ltd
Priority to JP59256363A priority Critical patent/JPS61136909A/ja
Priority to US06/802,013 priority patent/US4664679A/en
Priority to GB08529290A priority patent/GB2168993B/en
Priority to DE19853542738 priority patent/DE3542738A1/de
Priority to FR858517963A priority patent/FR2574064B1/fr
Priority to KR1019850009113A priority patent/KR930006470B1/ko
Publication of JPS61136909A publication Critical patent/JPS61136909A/ja
Publication of JPH05338B2 publication Critical patent/JPH05338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
    • C01B33/1417—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/145—Preparation of hydroorganosols, organosols or dispersions in an organic medium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10P52/402—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Composite Materials (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Silicon Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP59256363A 1984-12-04 1984-12-04 無水ケイ酸の水分散液組成物 Granted JPS61136909A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP59256363A JPS61136909A (ja) 1984-12-04 1984-12-04 無水ケイ酸の水分散液組成物
US06/802,013 US4664679A (en) 1984-12-04 1985-11-25 Aqueous dispersion of silicic anhydride and abrasive composition comprising the dispersion
GB08529290A GB2168993B (en) 1984-12-04 1985-11-28 Aqueous dispersion of silicic anhydride and abrasive composition comprising the dispersion
DE19853542738 DE3542738A1 (de) 1984-12-04 1985-12-03 Waessrige dispersion von kieselsaeureanhydrid und schleifmittel mit einem gehalt der dispersion
FR858517963A FR2574064B1 (fr) 1984-12-04 1985-12-04 Dispersion aqueuse d'anhydride silicique et composition abrasive comprenant cette dispersion
KR1019850009113A KR930006470B1 (ko) 1984-12-04 1985-12-04 규산 무수물의 수 분산물 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59256363A JPS61136909A (ja) 1984-12-04 1984-12-04 無水ケイ酸の水分散液組成物

Publications (2)

Publication Number Publication Date
JPS61136909A true JPS61136909A (ja) 1986-06-24
JPH05338B2 JPH05338B2 (cg-RX-API-DMAC10.html) 1993-01-05

Family

ID=17291637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59256363A Granted JPS61136909A (ja) 1984-12-04 1984-12-04 無水ケイ酸の水分散液組成物

Country Status (6)

Country Link
US (1) US4664679A (cg-RX-API-DMAC10.html)
JP (1) JPS61136909A (cg-RX-API-DMAC10.html)
KR (1) KR930006470B1 (cg-RX-API-DMAC10.html)
DE (1) DE3542738A1 (cg-RX-API-DMAC10.html)
FR (1) FR2574064B1 (cg-RX-API-DMAC10.html)
GB (1) GB2168993B (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001048521A (ja) * 1999-08-13 2001-02-20 Denki Kagaku Kogyo Kk 微細球状シリカ粉末とその製造方法および用途
JP2003176122A (ja) * 2001-09-13 2003-06-24 Wacker Chemie Gmbh シリカのシラノール基含有率が低いシリカ
JP2005532895A (ja) * 2002-07-13 2005-11-04 デグサ アクチエンゲゼルシャフト ナノ構造化された疎水性粒子を基礎とする界面活性剤不含の水性懸濁液の製造法およびその使用
JP2006096641A (ja) * 2004-09-30 2006-04-13 Tokuyama Corp 改質疎水化シリカ及びその製造方法
WO2008123373A1 (ja) * 2007-03-27 2008-10-16 Fuso Chemical Co., Ltd. コロイダルシリカ及びその製造方法
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物

Families Citing this family (41)

* Cited by examiner, † Cited by third party
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US5226930A (en) * 1988-06-03 1993-07-13 Monsanto Japan, Ltd. Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same
US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
US5230833A (en) * 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
US5228886A (en) * 1990-10-09 1993-07-20 Buehler, Ltd. Mechanochemical polishing abrasive
BE1007281A3 (nl) * 1993-07-12 1995-05-09 Philips Electronics Nv Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze.
BE1007280A3 (nl) * 1993-07-12 1995-05-09 Philips Electronics Nv Werkwijze voor het polijsten van een oppervlak van een edelmetaal of een in hoofdzaak edelmetaal bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze en polijstmiddel geschikt voor toepassing in de werkwijze.
DE69611653T2 (de) 1995-11-10 2001-05-03 Tokuyama Corp., Tokuya Poliersuspensionen und Verfahren zu ihrer Herstellung
FR2761629B1 (fr) * 1997-04-07 1999-06-18 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
DE19755804A1 (de) * 1997-12-16 1999-06-24 Andreas Dr Oelschlaeger Modifizierte Wasserglasfaser
JPH11256141A (ja) * 1998-03-12 1999-09-21 Sony Corp 研磨スラリーおよび研磨方法
JP3296781B2 (ja) * 1998-04-21 2002-07-02 信越半導体株式会社 水性切削液、その製造方法、ならびにこの水性切削液を用いた切削方法
US6299659B1 (en) * 1998-08-05 2001-10-09 Showa Denko K.K. Polishing material composition and polishing method for polishing LSI devices
AU2266301A (en) * 1999-12-17 2001-06-25 Cabot Microelectronics Corporation Method of polishing or planarizing a substrate
EP1263906A1 (en) * 2000-02-02 2002-12-11 Rodel Holdings, Inc. Polishing composition
JP4053297B2 (ja) * 2001-04-11 2008-02-27 三菱マテリアル株式会社 研削材及びそれを用いた穿孔工法
US6656241B1 (en) * 2001-06-14 2003-12-02 Ppg Industries Ohio, Inc. Silica-based slurry
US6652612B2 (en) * 2001-11-15 2003-11-25 Catalysts & Chemicals Industries Co., Ltd. Silica particles for polishing and a polishing agent
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
TWI363796B (en) * 2004-06-14 2012-05-11 Kao Corp Polishing composition
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI323741B (en) * 2004-12-16 2010-04-21 K C Tech Co Ltd Abrasive particles, polishing slurry, and producing method thereof
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
WO2009104465A1 (ja) * 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5333744B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨方法および化学機械研磨用水系分散体の製造方法
JP5333742B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2009224771A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333743B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2009224767A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010016344A (ja) * 2008-02-18 2010-01-21 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010034497A (ja) * 2008-02-18 2010-02-12 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010041027A (ja) * 2008-02-18 2010-02-18 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333740B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
KR101563023B1 (ko) * 2008-02-18 2015-10-23 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
JP2010028077A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010028079A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010028078A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333739B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333741B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
KR20230142833A (ko) 2021-02-11 2023-10-11 에보닉 오퍼레이션스 게엠베하 감소된 실란올 기 밀도를 갖는 발연 실리카 분말

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DE1567454A1 (de) * 1966-03-10 1970-08-06 Degussa Verfahren zur Herstellung stabiler hochprozentiger Dispersionen von pyrogen gewonnener Kieselsaeure
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US3922393A (en) * 1974-07-02 1975-11-25 Du Pont Process for polishing silicon and germanium semiconductor materials
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DE2844052A1 (de) * 1978-10-10 1980-04-30 Degussa Waessrige dispersion einer hydrophoben kieselsaeure
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JPS56155273A (en) * 1980-04-30 1981-12-01 Sekisui Chem Co Ltd Ground material for building
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001048521A (ja) * 1999-08-13 2001-02-20 Denki Kagaku Kogyo Kk 微細球状シリカ粉末とその製造方法および用途
JP2003176122A (ja) * 2001-09-13 2003-06-24 Wacker Chemie Gmbh シリカのシラノール基含有率が低いシリカ
JP2008189545A (ja) * 2001-09-13 2008-08-21 Wacker Chemie Ag シリカのシラノール基含有率が低いシリカ
JP2005532895A (ja) * 2002-07-13 2005-11-04 デグサ アクチエンゲゼルシャフト ナノ構造化された疎水性粒子を基礎とする界面活性剤不含の水性懸濁液の製造法およびその使用
JP4755418B2 (ja) * 2002-07-13 2011-08-24 エボニック デグサ ゲーエムベーハー ナノ構造化された疎水性粒子を基礎とする界面活性剤不含の水性懸濁液の製造法およびその使用
JP2006096641A (ja) * 2004-09-30 2006-04-13 Tokuyama Corp 改質疎水化シリカ及びその製造方法
WO2008123373A1 (ja) * 2007-03-27 2008-10-16 Fuso Chemical Co., Ltd. コロイダルシリカ及びその製造方法
JPWO2008123373A1 (ja) * 2007-03-27 2010-07-15 扶桑化学工業株式会社 コロイダルシリカ及びその製造方法
JP2012211080A (ja) * 2007-03-27 2012-11-01 Fuso Chemical Co Ltd コロイダルシリカの製造方法
US9550683B2 (en) 2007-03-27 2017-01-24 Fuso Chemical Co., Ltd. Colloidal silica, and method for production thereof
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物

Also Published As

Publication number Publication date
KR930006470B1 (ko) 1993-07-16
GB2168993A (en) 1986-07-02
GB2168993B (en) 1988-09-07
GB8529290D0 (en) 1986-01-02
US4664679A (en) 1987-05-12
DE3542738A1 (de) 1986-06-05
JPH05338B2 (cg-RX-API-DMAC10.html) 1993-01-05
FR2574064B1 (fr) 1989-06-16
FR2574064A1 (fr) 1986-06-06
KR860004981A (ko) 1986-07-16

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