FR2574064B1 - Dispersion aqueuse d'anhydride silicique et composition abrasive comprenant cette dispersion - Google Patents
Dispersion aqueuse d'anhydride silicique et composition abrasive comprenant cette dispersionInfo
- Publication number
- FR2574064B1 FR2574064B1 FR858517963A FR8517963A FR2574064B1 FR 2574064 B1 FR2574064 B1 FR 2574064B1 FR 858517963 A FR858517963 A FR 858517963A FR 8517963 A FR8517963 A FR 8517963A FR 2574064 B1 FR2574064 B1 FR 2574064B1
- Authority
- FR
- France
- Prior art keywords
- dispersion
- abrasive composition
- aqueous silicon
- silicon anhydride
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006185 dispersion Substances 0.000 title 2
- -1 SILICON ANHYDRIDE Chemical class 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
- C01B33/1417—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/145—Preparation of hydroorganosols, organosols or dispersions in an organic medium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59256363A JPS61136909A (ja) | 1984-12-04 | 1984-12-04 | 無水ケイ酸の水分散液組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2574064A1 FR2574064A1 (fr) | 1986-06-06 |
FR2574064B1 true FR2574064B1 (fr) | 1989-06-16 |
Family
ID=17291637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR858517963A Expired FR2574064B1 (fr) | 1984-12-04 | 1985-12-04 | Dispersion aqueuse d'anhydride silicique et composition abrasive comprenant cette dispersion |
Country Status (6)
Country | Link |
---|---|
US (1) | US4664679A (fr) |
JP (1) | JPS61136909A (fr) |
KR (1) | KR930006470B1 (fr) |
DE (1) | DE3542738A1 (fr) |
FR (1) | FR2574064B1 (fr) |
GB (1) | GB2168993B (fr) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5226930A (en) * | 1988-06-03 | 1993-07-13 | Monsanto Japan, Ltd. | Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same |
US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
US5230833A (en) * | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
US5228886A (en) * | 1990-10-09 | 1993-07-20 | Buehler, Ltd. | Mechanochemical polishing abrasive |
BE1007281A3 (nl) * | 1993-07-12 | 1995-05-09 | Philips Electronics Nv | Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze. |
BE1007280A3 (nl) * | 1993-07-12 | 1995-05-09 | Philips Electronics Nv | Werkwijze voor het polijsten van een oppervlak van een edelmetaal of een in hoofdzaak edelmetaal bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze en polijstmiddel geschikt voor toepassing in de werkwijze. |
DE69611653T2 (de) | 1995-11-10 | 2001-05-03 | Tokuyama Corp | Poliersuspensionen und Verfahren zu ihrer Herstellung |
FR2761629B1 (fr) * | 1997-04-07 | 1999-06-18 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope |
DE19755804A1 (de) * | 1997-12-16 | 1999-06-24 | Andreas Dr Oelschlaeger | Modifizierte Wasserglasfaser |
JPH11256141A (ja) * | 1998-03-12 | 1999-09-21 | Sony Corp | 研磨スラリーおよび研磨方法 |
JP3296781B2 (ja) * | 1998-04-21 | 2002-07-02 | 信越半導体株式会社 | 水性切削液、その製造方法、ならびにこの水性切削液を用いた切削方法 |
US6299659B1 (en) * | 1998-08-05 | 2001-10-09 | Showa Denko K.K. | Polishing material composition and polishing method for polishing LSI devices |
JP4112125B2 (ja) * | 1999-08-13 | 2008-07-02 | 電気化学工業株式会社 | 微細球状シリカ粉末の製造方法 |
JP4237439B2 (ja) * | 1999-12-17 | 2009-03-11 | キャボット マイクロエレクトロニクス コーポレイション | 基体の研磨又は平坦化方法 |
JP2003522424A (ja) * | 2000-02-02 | 2003-07-22 | ロデール ホールディングス インコーポレイテッド | 研磨組成物 |
JP4053297B2 (ja) * | 2001-04-11 | 2008-02-27 | 三菱マテリアル株式会社 | 研削材及びそれを用いた穿孔工法 |
US6656241B1 (en) * | 2001-06-14 | 2003-12-02 | Ppg Industries Ohio, Inc. | Silica-based slurry |
DE10145162A1 (de) * | 2001-09-13 | 2003-04-10 | Wacker Chemie Gmbh | Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen |
US6652612B2 (en) * | 2001-11-15 | 2003-11-25 | Catalysts & Chemicals Industries Co., Ltd. | Silica particles for polishing and a polishing agent |
DE10231757A1 (de) * | 2002-07-13 | 2004-01-22 | Creavis Gesellschaft Für Technologie Und Innovation Mbh | Verfahren zur Herstellung einer tensidfreien Suspension auf wässriger basis von nanostrukturierten, hydrophoben Partikeln und deren Verwendung |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
TWI363796B (en) | 2004-06-14 | 2012-05-11 | Kao Corp | Polishing composition |
JP4615952B2 (ja) * | 2004-09-30 | 2011-01-19 | 株式会社トクヤマ | 改質疎水化シリカ及びその製造方法 |
US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
TWI323741B (en) * | 2004-12-16 | 2010-04-21 | K C Tech Co Ltd | Abrasive particles, polishing slurry, and producing method thereof |
KR100641348B1 (ko) * | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Cmp용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
WO2008123373A1 (fr) * | 2007-03-27 | 2008-10-16 | Fuso Chemical Co., Ltd. | Silice colloïdale et son procédé de fabrication |
JP2010028077A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2009224767A (ja) * | 2008-02-18 | 2009-10-01 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333744B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体、化学機械研磨方法および化学機械研磨用水系分散体の製造方法 |
JP5333740B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333743B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010028078A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010041027A (ja) * | 2008-02-18 | 2010-02-18 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010034497A (ja) * | 2008-02-18 | 2010-02-12 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333742B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
WO2009104465A1 (fr) * | 2008-02-18 | 2009-08-27 | Jsr株式会社 | Dispersion aqueuse pour polissage mécano-chimique et procédé de polissage mécano-chimique |
JP2010028079A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
US20110081780A1 (en) * | 2008-02-18 | 2011-04-07 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
JP5333741B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333739B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2009224771A (ja) * | 2008-02-18 | 2009-10-01 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010016344A (ja) * | 2008-02-18 | 2010-01-21 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5937403B2 (ja) * | 2012-04-02 | 2016-06-22 | デンカ株式会社 | スラリー組成物及びそれを用いた樹脂組成物 |
EP4291528A1 (fr) | 2021-02-11 | 2023-12-20 | Evonik Operations GmbH | Poudre de silice pyrogénée à densité réduite de groupes silanol |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1163784C2 (de) * | 1962-03-30 | 1973-05-03 | Degussa | Verfahren zur Oberflaechenbehandlung von hochdispersen Oxyden |
DE1567454A1 (de) * | 1966-03-10 | 1970-08-06 | Degussa | Verfahren zur Herstellung stabiler hochprozentiger Dispersionen von pyrogen gewonnener Kieselsaeure |
SU600160A1 (ru) * | 1974-05-05 | 1978-03-30 | Калушский Химико-Металлургический Комбинат | Полировальный состав |
US3922393A (en) * | 1974-07-02 | 1975-11-25 | Du Pont | Process for polishing silicon and germanium semiconductor materials |
DE7621572U1 (de) * | 1976-07-08 | 1976-10-28 | Skf Kugellagerfabriken Gmbh, 8720 Schweinfurt | Kupplungsausruecker, insbesondere fuer kraftfahrzeuge |
US4260396A (en) * | 1978-01-16 | 1981-04-07 | W. R. Grace & Co. | Compositions for polishing silicon and germanium |
DE2844052A1 (de) * | 1978-10-10 | 1980-04-30 | Degussa | Waessrige dispersion einer hydrophoben kieselsaeure |
DE2909930C2 (de) * | 1979-03-14 | 1984-05-10 | Basf Ag, 6700 Ludwigshafen | Neue kristalline SiO↓2↓-Modifikation und Verfahren zu ihrer Herstellung |
JPS56155273A (en) * | 1980-04-30 | 1981-12-01 | Sekisui Chem Co Ltd | Ground material for building |
US4329396A (en) * | 1980-05-27 | 1982-05-11 | Minnesota Mining And Manufacturing Company | Corrosion-resistant reflective or transparent-reflective sheet material |
US4588421A (en) * | 1984-10-15 | 1986-05-13 | Nalco Chemical Company | Aqueous silica compositions for polishing silicon wafers |
-
1984
- 1984-12-04 JP JP59256363A patent/JPS61136909A/ja active Granted
-
1985
- 1985-11-25 US US06/802,013 patent/US4664679A/en not_active Expired - Fee Related
- 1985-11-28 GB GB08529290A patent/GB2168993B/en not_active Expired
- 1985-12-03 DE DE19853542738 patent/DE3542738A1/de not_active Ceased
- 1985-12-04 KR KR1019850009113A patent/KR930006470B1/ko not_active IP Right Cessation
- 1985-12-04 FR FR858517963A patent/FR2574064B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4664679A (en) | 1987-05-12 |
KR860004981A (ko) | 1986-07-16 |
KR930006470B1 (ko) | 1993-07-16 |
JPS61136909A (ja) | 1986-06-24 |
DE3542738A1 (de) | 1986-06-05 |
GB8529290D0 (en) | 1986-01-02 |
GB2168993A (en) | 1986-07-02 |
FR2574064A1 (fr) | 1986-06-06 |
JPH05338B2 (fr) | 1993-01-05 |
GB2168993B (en) | 1988-09-07 |
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CD | Change of name or company name | ||
ST | Notification of lapse |