JPS608315B2 - 錫・金電気メッキ水性浴 - Google Patents
錫・金電気メッキ水性浴Info
- Publication number
- JPS608315B2 JPS608315B2 JP51156097A JP15609776A JPS608315B2 JP S608315 B2 JPS608315 B2 JP S608315B2 JP 51156097 A JP51156097 A JP 51156097A JP 15609776 A JP15609776 A JP 15609776A JP S608315 B2 JPS608315 B2 JP S608315B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- gold
- aqueous bath
- stannic
- halide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 25
- 239000010931 gold Substances 0.000 title claims description 25
- 229910052737 gold Inorganic materials 0.000 title claims description 24
- 238000009713 electroplating Methods 0.000 title description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 24
- 150000003839 salts Chemical class 0.000 claims description 18
- 150000004820 halides Chemical class 0.000 claims description 14
- 229910001020 Au alloy Inorganic materials 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- PANJMBIFGCKWBY-UHFFFAOYSA-N iron tricyanide Chemical compound N#C[Fe](C#N)C#N PANJMBIFGCKWBY-UHFFFAOYSA-N 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 238000005275 alloying Methods 0.000 claims description 2
- 150000003842 bromide salts Chemical class 0.000 claims 1
- 150000003841 chloride salts Chemical class 0.000 claims 1
- 150000004673 fluoride salts Chemical class 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 8
- 239000003353 gold alloy Substances 0.000 description 7
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 6
- -1 halide salt Chemical class 0.000 description 6
- 150000001340 alkali metals Chemical class 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 3
- 229940081974 saccharin Drugs 0.000 description 3
- 235000019204 saccharin Nutrition 0.000 description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229940071182 stannate Drugs 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HSJKGGMUJITCBW-UHFFFAOYSA-N 3-hydroxybutanal Chemical compound CC(O)CC=O HSJKGGMUJITCBW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 241000270708 Testudinidae Species 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- ZXHCSYLXFAZWOL-UHFFFAOYSA-N 6-ethyl-6-methylcyclohexa-2,4-dien-1-amine Chemical compound CCC1(C)C=CC=CC1N ZXHCSYLXFAZWOL-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 101001000733 Rhodococcus jostii (strain RHA1) Glucose-6-phosphate isomerase 3 Proteins 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000005228 aryl sulfonate group Chemical group 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- RNFNDJAIBTYOQL-UHFFFAOYSA-N chloral hydrate Chemical compound OC(O)C(Cl)(Cl)Cl RNFNDJAIBTYOQL-UHFFFAOYSA-N 0.000 description 1
- 229960002327 chloral hydrate Drugs 0.000 description 1
- 239000000039 congener Substances 0.000 description 1
- DQRLCTAGMVGVFH-UHFFFAOYSA-N cyanide;hydrochloride Chemical compound Cl.N#[C-] DQRLCTAGMVGVFH-UHFFFAOYSA-N 0.000 description 1
- AAOVKJBEBIDNHE-UHFFFAOYSA-N diazepam Chemical compound N=1CC(=O)N(C)C2=CC=C(Cl)C=C2C=1C1=CC=CC=C1 AAOVKJBEBIDNHE-UHFFFAOYSA-N 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- KUDPGZONDFORKU-UHFFFAOYSA-N n-chloroaniline Chemical compound ClNC1=CC=CC=C1 KUDPGZONDFORKU-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US644236 | 1975-12-24 | ||
| US05/644,236 US4013523A (en) | 1975-12-24 | 1975-12-24 | Tin-gold electroplating bath and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5281032A JPS5281032A (en) | 1977-07-07 |
| JPS608315B2 true JPS608315B2 (ja) | 1985-03-01 |
Family
ID=24584032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51156097A Expired JPS608315B2 (ja) | 1975-12-24 | 1976-12-24 | 錫・金電気メッキ水性浴 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4013523A (en, 2012) |
| JP (1) | JPS608315B2 (en, 2012) |
| BE (1) | BE849410A (en, 2012) |
| CA (1) | CA1075191A (en, 2012) |
| CH (1) | CH603826A5 (en, 2012) |
| DE (1) | DE2658003C3 (en, 2012) |
| ES (1) | ES454476A1 (en, 2012) |
| FR (1) | FR2336496A1 (en, 2012) |
| GB (1) | GB1567200A (en, 2012) |
| IT (1) | IT1066698B (en, 2012) |
| NL (1) | NL164331C (en, 2012) |
| SE (1) | SE417728B (en, 2012) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3012999C2 (de) * | 1980-04-03 | 1984-02-16 | Degussa Ag, 6000 Frankfurt | Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen |
| US4470886A (en) * | 1983-01-04 | 1984-09-11 | Omi International Corporation | Gold alloy electroplating bath and process |
| DE3347594A1 (de) * | 1983-01-04 | 1984-07-12 | Omi International Corp., Warren, Mich. | Bad zur galvanischen abscheidung einer verschleissfesten goldlegierung und verfahren zur abscheidung einer verschleissfesten goldlegierung unter verwendung dieses bades |
| DE3509367C1 (de) * | 1985-03-15 | 1986-08-14 | Degussa Ag, 6000 Frankfurt | Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen |
| ATE90116T1 (de) * | 1988-09-05 | 1993-06-15 | Cockerill Sambre Sa | Verfahren zur elektroplattierung zon zinn. |
| CH680370A5 (en, 2012) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
| DE4406419C1 (de) * | 1994-02-28 | 1995-04-13 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen |
| DE4406434C1 (de) * | 1994-02-28 | 1995-08-10 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Gold-Zinn-Legierungen |
| US6544397B2 (en) * | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
| USRE45842E1 (en) * | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
| US6248228B1 (en) | 1999-03-19 | 2001-06-19 | Technic, Inc. And Specialty Chemical System, Inc. | Metal alloy halide electroplating baths |
| JP4392640B2 (ja) * | 2000-10-11 | 2010-01-06 | 石原薬品株式会社 | 非シアン系の金−スズ合金メッキ浴 |
| US20060237324A1 (en) * | 2003-05-21 | 2006-10-26 | Fred Hayward | Pulse plating process for deposition of gold-tin alloy |
| JP2007537358A (ja) * | 2004-05-11 | 2007-12-20 | テクニック・インコーポレイテッド | 金−スズ共晶合金のための電気めっき用溶液 |
| WO2006078549A1 (en) * | 2005-01-21 | 2006-07-27 | Technic, Inc. | Pulse plating process for deposition of gold-tin alloy |
| DE102005006982A1 (de) * | 2005-02-15 | 2006-08-17 | Basf Ag | Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse |
| US10260159B2 (en) * | 2013-07-05 | 2019-04-16 | The Boeing Company | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold |
| US11686007B2 (en) * | 2017-12-18 | 2023-06-27 | New Mexico Tech University Research Park Corporation | Tin-indium alloy electroplating solution |
| WO2020009096A1 (ja) * | 2018-07-03 | 2020-01-09 | 株式会社Ｊｃｕ | ３価クロムメッキ液およびこれを用いたクロムメッキ方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1905105A (en) * | 1930-02-20 | 1933-04-25 | Directors Of The University Of | Electrodeposition of tin-gold alloys |
| US3598706A (en) * | 1967-12-11 | 1971-08-10 | Trifari Krussman And Fishel In | Acid gold plating baths |
| CH494284A (fr) * | 1968-11-28 | 1970-07-31 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé |
-
1975
- 1975-12-24 US US05/644,236 patent/US4013523A/en not_active Expired - Lifetime
-
1976
- 1976-12-14 CA CA267,802A patent/CA1075191A/en not_active Expired
- 1976-12-14 BE BE173266A patent/BE849410A/xx not_active IP Right Cessation
- 1976-12-15 FR FR7637803A patent/FR2336496A1/fr active Granted
- 1976-12-16 CH CH1583076A patent/CH603826A5/xx not_active IP Right Cessation
- 1976-12-16 NL NL7613972.A patent/NL164331C/xx not_active IP Right Cessation
- 1976-12-17 SE SE7614214A patent/SE417728B/xx unknown
- 1976-12-21 DE DE2658003A patent/DE2658003C3/de not_active Expired
- 1976-12-22 IT IT52736/76A patent/IT1066698B/it active
- 1976-12-22 GB GB53549/76A patent/GB1567200A/en not_active Expired
- 1976-12-22 ES ES454476A patent/ES454476A1/es not_active Expired
- 1976-12-24 JP JP51156097A patent/JPS608315B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| IT1066698B (it) | 1985-03-12 |
| FR2336496B1 (en, 2012) | 1981-07-24 |
| ES454476A1 (es) | 1977-12-01 |
| DE2658003A1 (de) | 1977-07-07 |
| JPS5281032A (en) | 1977-07-07 |
| BE849410A (fr) | 1977-06-14 |
| US4013523A (en) | 1977-03-22 |
| SE7614214L (sv) | 1977-06-25 |
| GB1567200A (en) | 1980-05-14 |
| CH603826A5 (en, 2012) | 1978-08-31 |
| SE417728B (sv) | 1981-04-06 |
| CA1075191A (en) | 1980-04-08 |
| FR2336496A1 (fr) | 1977-07-22 |
| NL7613972A (nl) | 1977-06-28 |
| NL164331C (nl) | 1980-12-15 |
| DE2658003C3 (de) | 1982-01-21 |
| NL164331B (nl) | 1980-07-15 |
| DE2658003B2 (de) | 1980-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS608315B2 (ja) | 錫・金電気メッキ水性浴 | |
| US3966564A (en) | Method of electrodepositing an alloy of tin, cobalt and a third metal and electrolyte therefor | |
| US2926124A (en) | Tin nickel alloy plating process and composition | |
| JP3302949B2 (ja) | 黒色ルテニウムめっき液 | |
| GB1583666A (en) | Brighteners for silver electroplating bath | |
| US4297177A (en) | Method and composition for electrodepositing palladium/nickel alloys | |
| EP0079768B1 (en) | Electrodeposition of chromium and its alloys | |
| JP3458843B2 (ja) | Ｎｉ−Ｗ−Ｐ合金の連続めっき方法 | |
| JPS6229514B2 (en, 2012) | ||
| US4159926A (en) | Nickel plating | |
| JPS6131195B2 (en, 2012) | ||
| US4265715A (en) | Silver electrodeposition process | |
| NL8105601A (nl) | Samenstellingen en werkwijzen voor het elektrolytisch afzetten van palladium en palladiumlegeringen. | |
| JPH10317183A (ja) | 非シアンの電気金めっき浴 | |
| JPS5887291A (ja) | クロム電気メツキ液 | |
| NL8001999A (nl) | Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede. | |
| JP4355987B2 (ja) | スズ−亜鉛合金を電着するための水溶液 | |
| US4422908A (en) | Zinc plating | |
| JP3462338B2 (ja) | 半光沢銀めっき用の光沢度調整剤 | |
| JP3224454B2 (ja) | ノンシアン銀めっき浴及びその銀めっき方法 | |
| NO137760B (no) | Fremgangsm}te til fremstilling av en galvanisk utfelling av en jernlegering som inneholder nikkel eller nikkel og kobolt, og vandig pletteringsoppl¦sning for utf¦relse av fremgangsm}ten. | |
| US6248228B1 (en) | Metal alloy halide electroplating baths | |
| IE841268L (en) | Bath for the galvanic deposition of gold alloys. | |
| US4401527A (en) | Process for the electrodeposition of palladium | |
| US3287236A (en) | Electrodeposition of copper and solutions therefor |