FR2336496A1 - Procede et bains de revetement electrolytique d'etain-or - Google Patents

Procede et bains de revetement electrolytique d'etain-or

Info

Publication number
FR2336496A1
FR2336496A1 FR7637803A FR7637803A FR2336496A1 FR 2336496 A1 FR2336496 A1 FR 2336496A1 FR 7637803 A FR7637803 A FR 7637803A FR 7637803 A FR7637803 A FR 7637803A FR 2336496 A1 FR2336496 A1 FR 2336496A1
Authority
FR
France
Prior art keywords
baths
gold coating
electrolytic tin
electrolytic
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7637803A
Other languages
English (en)
Other versions
FR2336496B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2336496A1 publication Critical patent/FR2336496A1/fr
Application granted granted Critical
Publication of FR2336496B1 publication Critical patent/FR2336496B1/fr
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7637803A 1975-12-24 1976-12-15 Procede et bains de revetement electrolytique d'etain-or Granted FR2336496A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/644,236 US4013523A (en) 1975-12-24 1975-12-24 Tin-gold electroplating bath and process

Publications (2)

Publication Number Publication Date
FR2336496A1 true FR2336496A1 (fr) 1977-07-22
FR2336496B1 FR2336496B1 (fr) 1981-07-24

Family

ID=24584032

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7637803A Granted FR2336496A1 (fr) 1975-12-24 1976-12-15 Procede et bains de revetement electrolytique d'etain-or

Country Status (12)

Country Link
US (1) US4013523A (fr)
JP (1) JPS608315B2 (fr)
BE (1) BE849410A (fr)
CA (1) CA1075191A (fr)
CH (1) CH603826A5 (fr)
DE (1) DE2658003C3 (fr)
ES (1) ES454476A1 (fr)
FR (1) FR2336496A1 (fr)
GB (1) GB1567200A (fr)
IT (1) IT1066698B (fr)
NL (1) NL164331C (fr)
SE (1) SE417728B (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012999C2 (de) * 1980-04-03 1984-02-16 Degussa Ag, 6000 Frankfurt Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen
DE3347594A1 (de) * 1983-01-04 1984-07-12 Omi International Corp., Warren, Mich. Bad zur galvanischen abscheidung einer verschleissfesten goldlegierung und verfahren zur abscheidung einer verschleissfesten goldlegierung unter verwendung dieses bades
US4470886A (en) * 1983-01-04 1984-09-11 Omi International Corporation Gold alloy electroplating bath and process
DE3509367C1 (de) * 1985-03-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen
EP0357839B1 (fr) * 1988-09-05 1993-06-02 Cockerill-Sambre S.A. Procédé d'électro-déposition d'étain
CH680370A5 (fr) * 1989-12-19 1992-08-14 H E Finishing Sa
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
DE4406434C1 (de) * 1994-02-28 1995-08-10 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Gold-Zinn-Legierungen
US6544397B2 (en) * 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) * 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6248228B1 (en) 1999-03-19 2001-06-19 Technic, Inc. And Specialty Chemical System, Inc. Metal alloy halide electroplating baths
JP4392640B2 (ja) * 2000-10-11 2010-01-06 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
US20060237324A1 (en) * 2003-05-21 2006-10-26 Fred Hayward Pulse plating process for deposition of gold-tin alloy
US7431817B2 (en) * 2004-05-11 2008-10-07 Technic, Inc. Electroplating solution for gold-tin eutectic alloy
WO2006078549A1 (fr) * 2005-01-21 2006-07-27 Technic, Inc. Procede de placage par impulsions pour depot d'un alliage or/etain
DE102005006982A1 (de) * 2005-02-15 2006-08-17 Basf Ag Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
WO2019125951A1 (fr) * 2017-12-18 2019-06-27 New Mexico Tech University Research Park Corporation Solution d'électroplacage d'alliage étain-indium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1905105A (en) * 1930-02-20 1933-04-25 Directors Of The University Of Electrodeposition of tin-gold alloys

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3598706A (en) * 1967-12-11 1971-08-10 Trifari Krussman And Fishel In Acid gold plating baths
CH494284A (fr) * 1968-11-28 1970-07-31 Sel Rex Corp Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1905105A (en) * 1930-02-20 1933-04-25 Directors Of The University Of Electrodeposition of tin-gold alloys

Also Published As

Publication number Publication date
NL7613972A (nl) 1977-06-28
NL164331C (nl) 1980-12-15
GB1567200A (en) 1980-05-14
JPS5281032A (en) 1977-07-07
CH603826A5 (fr) 1978-08-31
SE417728B (sv) 1981-04-06
SE7614214L (sv) 1977-06-25
NL164331B (nl) 1980-07-15
CA1075191A (fr) 1980-04-08
ES454476A1 (es) 1977-12-01
JPS608315B2 (ja) 1985-03-01
DE2658003C3 (de) 1982-01-21
IT1066698B (it) 1985-03-12
FR2336496B1 (fr) 1981-07-24
US4013523A (en) 1977-03-22
DE2658003A1 (de) 1977-07-07
BE849410A (fr) 1977-06-14
DE2658003B2 (de) 1980-11-27

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Legal Events

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CD Change of name or company name
TP Transmission of property
ST Notification of lapse