FR2336496A1 - Procede et bains de revetement electrolytique d'etain-or - Google Patents
Procede et bains de revetement electrolytique d'etain-orInfo
- Publication number
- FR2336496A1 FR2336496A1 FR7637803A FR7637803A FR2336496A1 FR 2336496 A1 FR2336496 A1 FR 2336496A1 FR 7637803 A FR7637803 A FR 7637803A FR 7637803 A FR7637803 A FR 7637803A FR 2336496 A1 FR2336496 A1 FR 2336496A1
- Authority
- FR
- France
- Prior art keywords
- baths
- gold coating
- electrolytic tin
- electrolytic
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/644,236 US4013523A (en) | 1975-12-24 | 1975-12-24 | Tin-gold electroplating bath and process |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2336496A1 true FR2336496A1 (fr) | 1977-07-22 |
FR2336496B1 FR2336496B1 (fr) | 1981-07-24 |
Family
ID=24584032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7637803A Granted FR2336496A1 (fr) | 1975-12-24 | 1976-12-15 | Procede et bains de revetement electrolytique d'etain-or |
Country Status (12)
Country | Link |
---|---|
US (1) | US4013523A (fr) |
JP (1) | JPS608315B2 (fr) |
BE (1) | BE849410A (fr) |
CA (1) | CA1075191A (fr) |
CH (1) | CH603826A5 (fr) |
DE (1) | DE2658003C3 (fr) |
ES (1) | ES454476A1 (fr) |
FR (1) | FR2336496A1 (fr) |
GB (1) | GB1567200A (fr) |
IT (1) | IT1066698B (fr) |
NL (1) | NL164331C (fr) |
SE (1) | SE417728B (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3012999C2 (de) * | 1980-04-03 | 1984-02-16 | Degussa Ag, 6000 Frankfurt | Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen |
DE3347594A1 (de) * | 1983-01-04 | 1984-07-12 | Omi International Corp., Warren, Mich. | Bad zur galvanischen abscheidung einer verschleissfesten goldlegierung und verfahren zur abscheidung einer verschleissfesten goldlegierung unter verwendung dieses bades |
US4470886A (en) * | 1983-01-04 | 1984-09-11 | Omi International Corporation | Gold alloy electroplating bath and process |
DE3509367C1 (de) * | 1985-03-15 | 1986-08-14 | Degussa Ag, 6000 Frankfurt | Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen |
EP0357839B1 (fr) * | 1988-09-05 | 1993-06-02 | Cockerill-Sambre S.A. | Procédé d'électro-déposition d'étain |
CH680370A5 (fr) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
DE4406419C1 (de) * | 1994-02-28 | 1995-04-13 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen |
DE4406434C1 (de) * | 1994-02-28 | 1995-08-10 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Gold-Zinn-Legierungen |
US6544397B2 (en) * | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45842E1 (en) * | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
US6248228B1 (en) | 1999-03-19 | 2001-06-19 | Technic, Inc. And Specialty Chemical System, Inc. | Metal alloy halide electroplating baths |
JP4392640B2 (ja) * | 2000-10-11 | 2010-01-06 | 石原薬品株式会社 | 非シアン系の金−スズ合金メッキ浴 |
US20060237324A1 (en) * | 2003-05-21 | 2006-10-26 | Fred Hayward | Pulse plating process for deposition of gold-tin alloy |
US7431817B2 (en) * | 2004-05-11 | 2008-10-07 | Technic, Inc. | Electroplating solution for gold-tin eutectic alloy |
WO2006078549A1 (fr) * | 2005-01-21 | 2006-07-27 | Technic, Inc. | Procede de placage par impulsions pour depot d'un alliage or/etain |
DE102005006982A1 (de) * | 2005-02-15 | 2006-08-17 | Basf Ag | Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse |
US10260159B2 (en) * | 2013-07-05 | 2019-04-16 | The Boeing Company | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold |
WO2019125951A1 (fr) * | 2017-12-18 | 2019-06-27 | New Mexico Tech University Research Park Corporation | Solution d'électroplacage d'alliage étain-indium |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1905105A (en) * | 1930-02-20 | 1933-04-25 | Directors Of The University Of | Electrodeposition of tin-gold alloys |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3598706A (en) * | 1967-12-11 | 1971-08-10 | Trifari Krussman And Fishel In | Acid gold plating baths |
CH494284A (fr) * | 1968-11-28 | 1970-07-31 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé |
-
1975
- 1975-12-24 US US05/644,236 patent/US4013523A/en not_active Expired - Lifetime
-
1976
- 1976-12-14 CA CA267,802A patent/CA1075191A/fr not_active Expired
- 1976-12-14 BE BE173266A patent/BE849410A/fr not_active IP Right Cessation
- 1976-12-15 FR FR7637803A patent/FR2336496A1/fr active Granted
- 1976-12-16 CH CH1583076A patent/CH603826A5/xx not_active IP Right Cessation
- 1976-12-16 NL NL7613972.A patent/NL164331C/xx not_active IP Right Cessation
- 1976-12-17 SE SE7614214A patent/SE417728B/xx unknown
- 1976-12-21 DE DE2658003A patent/DE2658003C3/de not_active Expired
- 1976-12-22 IT IT52736/76A patent/IT1066698B/it active
- 1976-12-22 GB GB53549/76A patent/GB1567200A/en not_active Expired
- 1976-12-22 ES ES454476A patent/ES454476A1/es not_active Expired
- 1976-12-24 JP JP51156097A patent/JPS608315B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1905105A (en) * | 1930-02-20 | 1933-04-25 | Directors Of The University Of | Electrodeposition of tin-gold alloys |
Also Published As
Publication number | Publication date |
---|---|
NL7613972A (nl) | 1977-06-28 |
NL164331C (nl) | 1980-12-15 |
GB1567200A (en) | 1980-05-14 |
JPS5281032A (en) | 1977-07-07 |
CH603826A5 (fr) | 1978-08-31 |
SE417728B (sv) | 1981-04-06 |
SE7614214L (sv) | 1977-06-25 |
NL164331B (nl) | 1980-07-15 |
CA1075191A (fr) | 1980-04-08 |
ES454476A1 (es) | 1977-12-01 |
JPS608315B2 (ja) | 1985-03-01 |
DE2658003C3 (de) | 1982-01-21 |
IT1066698B (it) | 1985-03-12 |
FR2336496B1 (fr) | 1981-07-24 |
US4013523A (en) | 1977-03-22 |
DE2658003A1 (de) | 1977-07-07 |
BE849410A (fr) | 1977-06-14 |
DE2658003B2 (de) | 1980-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property | ||
ST | Notification of lapse |