JPS59154035A - フリツプチツプ集積回路のテスト方法 - Google Patents

フリツプチツプ集積回路のテスト方法

Info

Publication number
JPS59154035A
JPS59154035A JP58028245A JP2824583A JPS59154035A JP S59154035 A JPS59154035 A JP S59154035A JP 58028245 A JP58028245 A JP 58028245A JP 2824583 A JP2824583 A JP 2824583A JP S59154035 A JPS59154035 A JP S59154035A
Authority
JP
Japan
Prior art keywords
integrated circuit
chip integrated
test
flip
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58028245A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0121620B2 (enExample
Inventor
Tetsuo Fujii
哲夫 藤井
Toshio Sonobe
園部　俊夫
Michitaka Hayashi
道孝 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP58028245A priority Critical patent/JPS59154035A/ja
Publication of JPS59154035A publication Critical patent/JPS59154035A/ja
Publication of JPH0121620B2 publication Critical patent/JPH0121620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P74/00—

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58028245A 1983-02-22 1983-02-22 フリツプチツプ集積回路のテスト方法 Granted JPS59154035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58028245A JPS59154035A (ja) 1983-02-22 1983-02-22 フリツプチツプ集積回路のテスト方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58028245A JPS59154035A (ja) 1983-02-22 1983-02-22 フリツプチツプ集積回路のテスト方法

Publications (2)

Publication Number Publication Date
JPS59154035A true JPS59154035A (ja) 1984-09-03
JPH0121620B2 JPH0121620B2 (enExample) 1989-04-21

Family

ID=12243193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58028245A Granted JPS59154035A (ja) 1983-02-22 1983-02-22 フリツプチツプ集積回路のテスト方法

Country Status (1)

Country Link
JP (1) JPS59154035A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481333A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Test board for flip-chip
US5126818A (en) * 1987-05-26 1992-06-30 Matsushita Electric Works, Ltd. Semiconductor device
JPH0682521A (ja) * 1991-12-02 1994-03-22 American Teleph & Telegr Co <Att> 電子デバイスの試験方法
US5475236A (en) * 1991-09-02 1995-12-12 Fujitsu Limited Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process
WO1997009740A1 (de) * 1995-09-08 1997-03-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zum testen eines chips
US5971253A (en) * 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
US6409073B1 (en) 1998-07-15 2002-06-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for transfering solder to a device and/or testing the device
US6972495B2 (en) 1996-12-12 2005-12-06 Tessera, Inc. Compliant package with conductive elastomeric posts
US7159292B2 (en) 2002-05-27 2007-01-09 Yamaichi Electronics Co., Ltd. Recovery processing method of an electrode
JP2007259833A (ja) * 2006-03-30 2007-10-11 Tachikawa Heiwa Nouen:Kk 木製植木鉢

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126818A (en) * 1987-05-26 1992-06-30 Matsushita Electric Works, Ltd. Semiconductor device
JPS6481333A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Test board for flip-chip
US5475236A (en) * 1991-09-02 1995-12-12 Fujitsu Limited Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process
JPH0682521A (ja) * 1991-12-02 1994-03-22 American Teleph & Telegr Co <Att> 電子デバイスの試験方法
US5971253A (en) * 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
US6204455B1 (en) 1995-07-31 2001-03-20 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
WO1997009740A1 (de) * 1995-09-08 1997-03-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zum testen eines chips
US6211571B1 (en) 1995-09-08 2001-04-03 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Method and apparatus for testing chips
US6972495B2 (en) 1996-12-12 2005-12-06 Tessera, Inc. Compliant package with conductive elastomeric posts
US6409073B1 (en) 1998-07-15 2002-06-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for transfering solder to a device and/or testing the device
US7159292B2 (en) 2002-05-27 2007-01-09 Yamaichi Electronics Co., Ltd. Recovery processing method of an electrode
JP2007259833A (ja) * 2006-03-30 2007-10-11 Tachikawa Heiwa Nouen:Kk 木製植木鉢

Also Published As

Publication number Publication date
JPH0121620B2 (enExample) 1989-04-21

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