JPS59117157U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS59117157U
JPS59117157U JP1050383U JP1050383U JPS59117157U JP S59117157 U JPS59117157 U JP S59117157U JP 1050383 U JP1050383 U JP 1050383U JP 1050383 U JP1050383 U JP 1050383U JP S59117157 U JPS59117157 U JP S59117157U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
case
encapsulated semiconductor
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1050383U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314465Y2 (en:Method
Inventor
実 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1050383U priority Critical patent/JPS59117157U/ja
Publication of JPS59117157U publication Critical patent/JPS59117157U/ja
Application granted granted Critical
Publication of JPS6314465Y2 publication Critical patent/JPS6314465Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1050383U 1983-01-27 1983-01-27 樹脂封止型半導体装置 Granted JPS59117157U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1050383U JPS59117157U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1050383U JPS59117157U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS59117157U true JPS59117157U (ja) 1984-08-07
JPS6314465Y2 JPS6314465Y2 (en:Method) 1988-04-22

Family

ID=30141937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1050383U Granted JPS59117157U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59117157U (en:Method)

Also Published As

Publication number Publication date
JPS6314465Y2 (en:Method) 1988-04-22

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