JPS5864097A - 多層印刷回路板の製造方法 - Google Patents

多層印刷回路板の製造方法

Info

Publication number
JPS5864097A
JPS5864097A JP56162861A JP16286181A JPS5864097A JP S5864097 A JPS5864097 A JP S5864097A JP 56162861 A JP56162861 A JP 56162861A JP 16286181 A JP16286181 A JP 16286181A JP S5864097 A JPS5864097 A JP S5864097A
Authority
JP
Japan
Prior art keywords
laser
multilayer printed
printed circuit
circuit board
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56162861A
Other languages
English (en)
Japanese (ja)
Other versions
JPH043676B2 (enExample
Inventor
大幸　洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56162861A priority Critical patent/JPS5864097A/ja
Publication of JPS5864097A publication Critical patent/JPS5864097A/ja
Publication of JPH043676B2 publication Critical patent/JPH043676B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP56162861A 1981-10-14 1981-10-14 多層印刷回路板の製造方法 Granted JPS5864097A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56162861A JPS5864097A (ja) 1981-10-14 1981-10-14 多層印刷回路板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56162861A JPS5864097A (ja) 1981-10-14 1981-10-14 多層印刷回路板の製造方法

Publications (2)

Publication Number Publication Date
JPS5864097A true JPS5864097A (ja) 1983-04-16
JPH043676B2 JPH043676B2 (enExample) 1992-01-23

Family

ID=15762641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56162861A Granted JPS5864097A (ja) 1981-10-14 1981-10-14 多層印刷回路板の製造方法

Country Status (1)

Country Link
JP (1) JPS5864097A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61294896A (ja) * 1985-06-24 1986-12-25 株式会社日立製作所 多層印刷回路板の製造方法
JPS62216297A (ja) * 1986-03-17 1987-09-22 富士通株式会社 多層プリント板の孔加工法
JPS639194A (ja) * 1986-06-30 1988-01-14 株式会社日立製作所 多層プリント回路基板の製造方法
JPH02153594A (ja) * 1988-12-05 1990-06-13 Ibiden Co Ltd 多層プリント配線板の製造方法
DE4002326A1 (de) * 1989-01-27 1990-08-02 Hitachi Seiko Kk Verfahren und vorrichtung zum perforieren einer gedruckten schaltungsplatte
DE4117938A1 (de) * 1990-06-01 1991-12-05 Hitachi Seiko Kk Verfahren und vorrichtung zum perforieren einer leiterplatte
WO1998034447A1 (en) * 1997-02-03 1998-08-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US6531677B2 (en) 2000-10-06 2003-03-11 Hitachi Via Mechanics, Ltd. Method and apparatus for drilling printed wiring boards

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5419441B2 (ja) * 2008-12-26 2014-02-19 富士フイルム株式会社 多層配線基板の形成方法
KR102576010B1 (ko) * 2015-08-11 2023-09-06 가부시끼가이샤 레조낙 다층 프린트 배선판의 제조 방법, 접착층 부착 금속박, 금속장 적층판, 다층 프린트 배선판

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254172A (en) * 1975-10-28 1977-05-02 Siemens Ag Method of producing microminiature multiilayer wiring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254172A (en) * 1975-10-28 1977-05-02 Siemens Ag Method of producing microminiature multiilayer wiring

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61294896A (ja) * 1985-06-24 1986-12-25 株式会社日立製作所 多層印刷回路板の製造方法
JPS62216297A (ja) * 1986-03-17 1987-09-22 富士通株式会社 多層プリント板の孔加工法
JPS639194A (ja) * 1986-06-30 1988-01-14 株式会社日立製作所 多層プリント回路基板の製造方法
JPH02153594A (ja) * 1988-12-05 1990-06-13 Ibiden Co Ltd 多層プリント配線板の製造方法
DE4002326A1 (de) * 1989-01-27 1990-08-02 Hitachi Seiko Kk Verfahren und vorrichtung zum perforieren einer gedruckten schaltungsplatte
US5010232A (en) * 1989-01-27 1991-04-23 Hitachi Seiko, Ltd. Method of and apparatus for perforating printed circuit board
DE4117938A1 (de) * 1990-06-01 1991-12-05 Hitachi Seiko Kk Verfahren und vorrichtung zum perforieren einer leiterplatte
WO1998034447A1 (en) * 1997-02-03 1998-08-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US6590165B1 (en) 1997-02-03 2003-07-08 Ibiden Co., Ltd. Printed wiring board having throughole and annular lands
US7552531B2 (en) 1997-02-03 2009-06-30 Ibiden Co., Ltd. Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit
US6531677B2 (en) 2000-10-06 2003-03-11 Hitachi Via Mechanics, Ltd. Method and apparatus for drilling printed wiring boards

Also Published As

Publication number Publication date
JPH043676B2 (enExample) 1992-01-23

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