JPS5254172A - Method of producing microminiature multiilayer wiring - Google Patents

Method of producing microminiature multiilayer wiring

Info

Publication number
JPS5254172A
JPS5254172A JP12999176A JP12999176A JPS5254172A JP S5254172 A JPS5254172 A JP S5254172A JP 12999176 A JP12999176 A JP 12999176A JP 12999176 A JP12999176 A JP 12999176A JP S5254172 A JPS5254172 A JP S5254172A
Authority
JP
Japan
Prior art keywords
multiilayer
wiring
microminiature
producing
producing microminiature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12999176A
Other languages
Japanese (ja)
Inventor
Waitsue Arutsuuru
Shieeraa Kuremensu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5254172A publication Critical patent/JPS5254172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12999176A 1975-10-28 1976-10-28 Method of producing microminiature multiilayer wiring Pending JPS5254172A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752548258 DE2548258A1 (en) 1975-10-28 1975-10-28 METHOD FOR MANUFACTURING MULTI-LAYER MICROWIRINGS

Publications (1)

Publication Number Publication Date
JPS5254172A true JPS5254172A (en) 1977-05-02

Family

ID=5960293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12999176A Pending JPS5254172A (en) 1975-10-28 1976-10-28 Method of producing microminiature multiilayer wiring

Country Status (4)

Country Link
JP (1) JPS5254172A (en)
DE (1) DE2548258A1 (en)
FR (1) FR2330246A1 (en)
NL (1) NL7609186A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109168A (en) * 1978-02-15 1979-08-27 Fujitsu Ltd Method of producing multiilayer ceramic circuit board
JPS5864097A (en) * 1981-10-14 1983-04-16 株式会社日立製作所 Method of producing multilayer printed circuit board
JPS6148997A (en) * 1984-08-08 1986-03-10 クロ−ネ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツンク Sheet having conductors printed on both sides and method of producing same
JPS62154679U (en) * 1986-03-25 1987-10-01
JPS639194A (en) * 1986-06-30 1988-01-14 株式会社日立製作所 Manufacture of multilayer printed circuit board
JPH02143492A (en) * 1988-11-24 1990-06-01 Ibiden Co Ltd Manufacture of high-density multilayered printed-wiring board
JP2003008222A (en) * 2001-06-25 2003-01-10 Toppan Printing Co Ltd High-density multilayer build-up wiring board and method of manufacturing the same
JP2009054695A (en) * 2007-08-24 2009-03-12 Fujikura Ltd Circuit wiring board and manufacturing method therefor
JP2009188218A (en) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd Multilayer board

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468279A1 (en) * 1979-10-19 1981-04-30 Dujardin Editions Printed circuit board - has connections between faces through micro sized holes crossing thickness of board and linking components to tracks
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
DE3735959A1 (en) * 1987-10-23 1989-05-03 Bbc Brown Boveri & Cie Multilayer thin-film circuit and a method for its production
US4806188A (en) * 1988-03-04 1989-02-21 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
FR2637151A1 (en) * 1988-09-29 1990-03-30 Commissariat Energie Atomique METHOD OF MAKING ELECTRICAL CONNECTIONS THROUGH A SUBSTRATE
US5006182A (en) * 1989-11-17 1991-04-09 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JP3226533B2 (en) * 1990-10-01 2001-11-05 ソニー株式会社 Multilayer wiring board and method of manufacturing the same
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
US6105243A (en) * 1996-12-05 2000-08-22 International Business Machines, Corp. Method of fabricating multilayer printed circuit board
US6005198A (en) * 1997-10-07 1999-12-21 Dimensional Circuits Corporation Wiring board constructions and methods of making same
DE102021113721A1 (en) * 2021-05-27 2022-12-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD OF MANUFACTURING A CARRIER, METHOD OF MANUFACTURING AN ELECTRICAL COMPONENT, CARRIER AND ELECTRICAL COMPONENT

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109168A (en) * 1978-02-15 1979-08-27 Fujitsu Ltd Method of producing multiilayer ceramic circuit board
JPS5864097A (en) * 1981-10-14 1983-04-16 株式会社日立製作所 Method of producing multilayer printed circuit board
JPH043676B2 (en) * 1981-10-14 1992-01-23
JPS6148997A (en) * 1984-08-08 1986-03-10 クロ−ネ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツンク Sheet having conductors printed on both sides and method of producing same
JPS62154679U (en) * 1986-03-25 1987-10-01
JPS639194A (en) * 1986-06-30 1988-01-14 株式会社日立製作所 Manufacture of multilayer printed circuit board
JPH0518478B2 (en) * 1986-06-30 1993-03-12 Hitachi Ltd
JPH02143492A (en) * 1988-11-24 1990-06-01 Ibiden Co Ltd Manufacture of high-density multilayered printed-wiring board
JP2003008222A (en) * 2001-06-25 2003-01-10 Toppan Printing Co Ltd High-density multilayer build-up wiring board and method of manufacturing the same
JP2009054695A (en) * 2007-08-24 2009-03-12 Fujikura Ltd Circuit wiring board and manufacturing method therefor
JP2009188218A (en) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd Multilayer board

Also Published As

Publication number Publication date
DE2548258A1 (en) 1977-05-05
FR2330246A1 (en) 1977-05-27
NL7609186A (en) 1977-05-02
FR2330246B1 (en) 1978-12-15

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