NL7609186A - METHOD OF MANUFACTURING MULTI-LAYER MICROWIRES. - Google Patents

METHOD OF MANUFACTURING MULTI-LAYER MICROWIRES.

Info

Publication number
NL7609186A
NL7609186A NL7609186A NL7609186A NL7609186A NL 7609186 A NL7609186 A NL 7609186A NL 7609186 A NL7609186 A NL 7609186A NL 7609186 A NL7609186 A NL 7609186A NL 7609186 A NL7609186 A NL 7609186A
Authority
NL
Netherlands
Prior art keywords
microwires
layer
manufacturing multi
manufacturing
layer microwires
Prior art date
Application number
NL7609186A
Other languages
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL7609186A publication Critical patent/NL7609186A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
NL7609186A 1975-10-28 1976-08-18 METHOD OF MANUFACTURING MULTI-LAYER MICROWIRES. NL7609186A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752548258 DE2548258A1 (en) 1975-10-28 1975-10-28 METHOD FOR MANUFACTURING MULTI-LAYER MICROWIRINGS

Publications (1)

Publication Number Publication Date
NL7609186A true NL7609186A (en) 1977-05-02

Family

ID=5960293

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7609186A NL7609186A (en) 1975-10-28 1976-08-18 METHOD OF MANUFACTURING MULTI-LAYER MICROWIRES.

Country Status (4)

Country Link
JP (1) JPS5254172A (en)
DE (1) DE2548258A1 (en)
FR (1) FR2330246A1 (en)
NL (1) NL7609186A (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109168A (en) * 1978-02-15 1979-08-27 Fujitsu Ltd Method of producing multiilayer ceramic circuit board
FR2468279A1 (en) * 1979-10-19 1981-04-30 Dujardin Editions Printed circuit board - has connections between faces through micro sized holes crossing thickness of board and linking components to tracks
JPS5864097A (en) * 1981-10-14 1983-04-16 株式会社日立製作所 Method of producing multilayer printed circuit board
DE3429236A1 (en) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
JPS62154679U (en) * 1986-03-25 1987-10-01
JPS639194A (en) * 1986-06-30 1988-01-14 株式会社日立製作所 Manufacture of multilayer printed circuit board
DE3735959A1 (en) * 1987-10-23 1989-05-03 Bbc Brown Boveri & Cie Multilayer thin-film circuit and a method for its production
US4806188A (en) * 1988-03-04 1989-02-21 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
FR2637151A1 (en) * 1988-09-29 1990-03-30 Commissariat Energie Atomique METHOD OF MAKING ELECTRICAL CONNECTIONS THROUGH A SUBSTRATE
JPH0783182B2 (en) * 1988-11-24 1995-09-06 イビデン株式会社 Method for manufacturing high-density multilayer printed wiring board
US5006182A (en) * 1989-11-17 1991-04-09 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JP3226533B2 (en) * 1990-10-01 2001-11-05 ソニー株式会社 Multilayer wiring board and method of manufacturing the same
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
US6105243A (en) * 1996-12-05 2000-08-22 International Business Machines, Corp. Method of fabricating multilayer printed circuit board
US6005198A (en) * 1997-10-07 1999-12-21 Dimensional Circuits Corporation Wiring board constructions and methods of making same
JP4802402B2 (en) * 2001-06-25 2011-10-26 凸版印刷株式会社 High-density multilayer build-up wiring board and manufacturing method thereof
JP2009054695A (en) * 2007-08-24 2009-03-12 Fujikura Ltd Circuit wiring board and manufacturing method therefor
JP2009188218A (en) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd Multilayer board
DE102021113721A1 (en) * 2021-05-27 2022-12-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD OF MANUFACTURING A CARRIER, METHOD OF MANUFACTURING AN ELECTRICAL COMPONENT, CARRIER AND ELECTRICAL COMPONENT

Also Published As

Publication number Publication date
FR2330246A1 (en) 1977-05-27
JPS5254172A (en) 1977-05-02
DE2548258A1 (en) 1977-05-05
FR2330246B1 (en) 1978-12-15

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Legal Events

Date Code Title Description
BV The patent application has lapsed