JPH02143492A - Manufacture of high-density multilayered printed-wiring board - Google Patents
Manufacture of high-density multilayered printed-wiring boardInfo
- Publication number
- JPH02143492A JPH02143492A JP29711988A JP29711988A JPH02143492A JP H02143492 A JPH02143492 A JP H02143492A JP 29711988 A JP29711988 A JP 29711988A JP 29711988 A JP29711988 A JP 29711988A JP H02143492 A JPH02143492 A JP H02143492A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating layer
- resin
- printed wiring
- oxidizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000007800 oxidant agent Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 10
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 239000011342 resin composition Substances 0.000 claims abstract description 6
- 238000007772 electroless plating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims 1
- 238000005553 drilling Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004109 brown FK Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、高密度多層プリント配線板の製造方法に関し
、特に高い信頼性を有する高密度多層プリント配線板の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a high-density multilayer printed wiring board, and particularly to a method for manufacturing a highly reliable high-density multilayer printed wiring board.
（従来の技術）
近年、電子技術の進歩に伴い、大型コンピューターなど
の電子機器に対する高密度化あるいは演算機能の高速化
が進められている。その結果、プリント配線板において
も高密度化を目的として配線回路が多層に形成された多
層プリント配線板が使用されている。(Prior Art) In recent years, with the advancement of electronic technology, electronic devices such as large-sized computers have been made to have higher density and faster calculation functions. As a result, multilayer printed wiring boards, in which wiring circuits are formed in multiple layers, are being used in printed wiring boards for the purpose of increasing density.
従来、多層プリント配線板としては、例えば導体回路が
形成されたプリント配線板上に、プリプレグを絶縁層と
して積層プレスした後、ドリル削孔によって形成された
第２図に示すようなブラインドスルーホールを有するプ
リント配線板が実用化されている。Conventionally, multilayer printed wiring boards have been produced by laminating and pressing prepreg as an insulating layer on a printed wiring board on which conductor circuits are formed, and then drilling blind through holes as shown in Fig. 2. Printed wiring boards with this technology have been put into practical use.
ブラインドスルーホールは、上記ドリル削孔の他に、レ
ーザーにより形成することが可能である。The blind through hole can be formed by a laser in addition to the above-mentioned drilling.
前記レーザーによる孔あけは、ドリル削孔に比較して小
径の孔あけが可能で１．内層に設けたパッドを貫通しな
いように孔深さを一定に制御することができるばかりで
なく、加工時間の大幅な短縮が可能であり、極めて有利
な方法である。Drilling using the laser allows for the drilling of smaller diameter holes compared to drilling.1. This is an extremely advantageous method, as it not only allows the hole depth to be controlled to a constant level so as not to penetrate the pad provided in the inner layer, but also allows for a significant reduction in processing time.
しかしながら、従来の絶縁層として使用されているプリ
プレグはガラスクロスにエポキシ樹脂等の樹脂が含浸硬
化された複合材であるため、前記絶縁層をレーザーによ
って孔あけを行うと第３図に示すように孔の内壁にガラ
スクロスが突出した状態で残存し易く、信幀性に優れた
スルーホールを得ることが困難であるという問題点を有
していた。However, since the prepreg conventionally used as an insulating layer is a composite material made of glass cloth impregnated with a resin such as epoxy resin and cured, if the insulating layer is perforated with a laser, as shown in Figure 3. The problem is that the glass cloth tends to remain in a protruding state on the inner wall of the hole, making it difficult to obtain a through hole with excellent reliability.
（発明が解決しようとする問題点）
前述の如く、従来、レーザーによって孔あけして信銀性
に優れたブラインドスルーホールを有する多層プリント
配線板を製造する方法は知られていない。(Problems to be Solved by the Invention) As described above, conventionally, there is no known method for producing a multilayer printed wiring board having blind through holes with excellent reliability by drilling with a laser.
本発明は、前述の如き従来の多層プリント配線板の製造
方法の有する欠点を解消し、信顧性に優れたブラインド
スルーホールを有する多層プリント配線板の製造方法を
提供することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the drawbacks of the conventional multilayer printed wiring board manufacturing method as described above, and to provide a highly reliable manufacturing method for a multilayer printed wiring board having blind through holes. It is.
（問題点を解決するための手段）
本発明者等は、前述の如き問題点を解決すべく種々研究
した結果、あらかじめ導体回路が形成されたプリント配
線板上に、酸化剤に対して難溶性の樹脂からなるマトリ
ックス中に酸化剤に対して可溶性の硬化処理された耐熱
性樹脂粉末が分散して存在する樹脂組成物からなる絶縁
層を形成した後、前記絶縁層にレーザー光を照射して孔
あけし、次いで前記絶縁層表面を酸化剤処理して粗面化
し、無電解めっきして導体回路を形成することを少なく
とも一回行うことを特徴とする高密度多層プリント配線
板の製造方法によって前記問題点を解決することを見出
して本発明を完成したものである。(Means for Solving the Problems) As a result of various studies to solve the above-mentioned problems, the inventors of the present invention have developed a method that is refractory to oxidizing agents on printed wiring boards on which conductor circuits have been formed in advance. After forming an insulating layer made of a resin composition in which a hardened heat-resistant resin powder soluble in an oxidizing agent is dispersed in a matrix made of a resin, the insulating layer is irradiated with laser light. By a method for manufacturing a high-density multilayer printed wiring board, the method comprises forming holes, then treating the surface of the insulating layer with an oxidizing agent to roughen the surface, and performing electroless plating to form a conductor circuit at least once. The present invention was completed by finding a solution to the above problems.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明によれば、あらかじめ導体回路が形成されたプリ
ント配線板上に、酸化剤に対して可溶性の硬化処理され
た耐熱性樹脂粉末を含有する酸化剤に対して難溶性の樹
脂組成物からなる増縁層を形成した後、前記絶縁層にレ
ーザー光を照射して孔あけすることが必要である。According to the present invention, a resin composition hardly soluble in an oxidizing agent containing a heat-resistant resin powder that has been cured and soluble in an oxidizing agent is placed on a printed wiring board on which a conductor circuit has been formed in advance. After forming the edge-enhancing layer, it is necessary to irradiate the insulating layer with laser light to form holes.
その理由は、前記絶縁層は、樹脂によって構成されてい
るため、レーザー光による孔あけにより、極めて優れた
形状のブラインドスルーホールを形成することができる
からである。The reason is that since the insulating layer is made of resin, it is possible to form a blind through hole with an extremely excellent shape by drilling with a laser beam.
本発明によれば、前記レーザー光による孔あけを行うに
際し、絶縁層上に目的とする花形状のマスクを被覆する
ことが有利である。According to the present invention, it is advantageous to cover the insulating layer with a desired flower-shaped mask when drilling with the laser beam.
また、前記絶縁層が酸化剤に対して難溶性の樹脂からな
るマトリックス中に酸化剤に対して可溶性の硬化処理さ
れた耐熱性樹脂粉末が分散して存在する樹脂組成物から
なるものであることが必要な理由は、前記絶縁層は、酸
化剤に対して難溶性の樹脂からなるマトリックス中に酸
化剤に対して可溶性の硬化処理された耐熱性樹脂粉末が
分散して存在する樹脂組成物からなるものであり、耐熱
性樹脂粉末とマトリックスの酸化剤に対する溶解性に差
異があるため、酸化剤処理することにより、絶縁層の表
面部分に存在している耐熱性樹脂粉末を優先的に溶解除
去することができ、絶８ｉ層の表面を極めて効果的に粗
化することができる。この結果、無電解めっき膜との密
着性に優れた絶縁層を形成することができる。Further, the insulating layer is made of a resin composition in which hardened heat-resistant resin powder that is soluble in oxidizing agents is dispersed in a matrix made of resin that is poorly soluble in oxidizing agents. The reason for this is that the insulating layer is made of a resin composition in which hardened heat-resistant resin powder that is soluble in oxidizing agents is dispersed in a matrix that is made of a resin that is poorly soluble in oxidizing agents. Since there is a difference in the solubility of the heat-resistant resin powder and the matrix to the oxidizing agent, by treating with the oxidizing agent, the heat-resistant resin powder existing on the surface of the insulating layer is preferentially dissolved and removed. The surface of the 8i layer can be roughened extremely effectively. As a result, an insulating layer with excellent adhesion to the electroless plated film can be formed.
なお、本発明によれば、前記導体回路が形成されたプリ
ント配線板上に絶縁性に優れた樹脂層を形成した後、前
記絶縁層を形成することにより、さらに絶縁信軌性を向
上させることができる。In addition, according to the present invention, the insulation conductivity can be further improved by forming the insulating layer after forming a resin layer with excellent insulating properties on the printed wiring board on which the conductive circuit is formed. Can be done.
本発明によれば、前記絶縁層を形成する方法としては、
例えばローラーコート法、デイツプコート法、スプレー
コート法、スピナーコート法、カーテンコート法、スク
リーン印刷法などの各種の手段を適用することができる
。According to the present invention, the method for forming the insulating layer includes:
For example, various methods such as a roller coating method, a dip coating method, a spray coating method, a spinner coating method, a curtain coating method, and a screen printing method can be applied.
本発明において用いられる絶縁層を形成する樹脂として
は、アクリル樹脂、フェノール樹脂、エポキシ樹脂、エ
ポキシ変成ポリイミド樹脂、ポリイミド樹脂の中から選
ばれる何れかすくなくとも一種を使用することが有利で
ある。As the resin forming the insulating layer used in the present invention, it is advantageous to use at least one selected from acrylic resin, phenol resin, epoxy resin, epoxy-modified polyimide resin, and polyimide resin.
また本発明において用いられる耐熱性樹脂粉末としては
、エポキシ樹脂、フェノール樹脂、ベンゾグアナミン樹
脂、ポリイミド樹脂の中から選ばれる何れかすくなくと
も一種を使用することが有利である。Further, as the heat-resistant resin powder used in the present invention, it is advantageous to use at least one selected from epoxy resins, phenol resins, benzoguanamine resins, and polyimide resins.
本発明によれば、レーザー光は配線板の内層回路に対し
反射率の高い波長のレーザー光が適しており、例えばＣ
Ｏ，レーザーが適している。According to the present invention, a laser beam having a wavelength with a high reflectance for the inner layer circuit of the wiring board is suitable, for example, C
O. Laser is suitable.
本発明によれば、前記絶縁層表面を酸化剤処理して粗面
化し、無電解めっきして導体回路が形成される。According to the present invention, the surface of the insulating layer is treated with an oxidizing agent to roughen the surface, and electroless plating is performed to form a conductor circuit.
本発明において用いられる酸化剤としては、クロム酸、
クロム酸塩、過マンガン酸、オゾン等の酸化性薬液、塩
酸、硫酸、硝酸、ぶつ化水素酸等の酸などを使用するこ
とができる。The oxidizing agent used in the present invention includes chromic acid,
Oxidizing chemicals such as chromate, permanganic acid, and ozone, and acids such as hydrochloric acid, sulfuric acid, nitric acid, and hydrobutic acid can be used.
上述の如き処理を繰り返し行うことにより、さらに多層
の導体回路を有する多層配線板を製造することができる
。By repeating the above-described process, a multilayer wiring board having even more layers of conductor circuits can be manufactured.
以下、本発明を実施例によりさらに詳細に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.
（実施例１）
（１） フェノールノボラック型エポキシ樹脂（油化
シェル類、商品名：Ｅ−１５４）６０重量部ビスフェノ
ールＡ型エポキシ樹脂（油化シェル類、商品名：Ｅ−１
００１）４０重量部、イミダゾール硬化剤（四国化成製
、商品名ＩＰ４ＭＨｚ）４重量部、エポキシ樹脂微粉末
（東し製、商品名：トレバールＢＰ−Ｂ）５０重量部か
らなるものを三木ロールで混練し、ＭＥＫを適量添加し
て絶縁層用フェスを得た。(Example 1) (1) 60 parts by weight of phenol novolac type epoxy resin (oiled shells, trade name: E-154) Bisphenol A type epoxy resin (oiled shells, trade name: E-1)
001) 40 parts by weight of imidazole curing agent (manufactured by Shikoku Kasei, trade name: IP4MHz), and 50 parts by weight of epoxy resin fine powder (manufactured by Toshi, trade name: Treval BP-B) were kneaded using a Miki roll. Then, an appropriate amount of MEK was added to obtain a face for an insulating layer.
（２）次いで、ガラスエポキシ両面銅張積層板の表面銅
箔を常法によりフォトエツチングして得られた印刷配線
板上に、・前記絶縁層用にフェスをロールコータ−で全
面に塗布した後、１００ ’Ｃで１時間さらに１５０°
Ｃで５時間乾燥硬化して絶縁層を形成した。(2) Next, on the printed wiring board obtained by photo-etching the surface copper foil of the glass epoxy double-sided copper-clad laminate using a conventional method, ・ After coating the entire surface with a roll coater for the insulating layer, , further 150° at 100'C for 1 hour.
An insulating layer was formed by drying and curing with C for 5 hours.
（３） この基板にＣＯｚ レーザーを照射して、基
板内部の配線層に設けたパッドを露出させた。(3) This substrate was irradiated with a COz laser to expose the pads provided on the wiring layer inside the substrate.
（４）次いでクロム酸に１０分間浸漬して、樹脂表面を
粗面化し、中和後水洗した。(4) Next, the resin surface was roughened by immersing it in chromic acid for 10 minutes, and after neutralization, it was washed with water.
（５）常法により、スルーホールを形成した。(5) Through holes were formed by a conventional method.
（６）市販のスズツバラジウムコロイド触媒に浸漬して
活性化した後、下記に示す組成の無電解銅めっき液に１
５時間浸漬して約３５μｍの銅めっきを施し多層プリン
ト配線板を製造した。(6) After immersing and activating a commercially available tin-valadium colloidal catalyst, immerse it in an electroless copper plating solution with the composition shown below.
After dipping for 5 hours, copper plating of approximately 35 μm was applied to produce a multilayer printed wiring board.
硫酸銅（ＣｕＳＯａ・５ｔｌｚＯ） ０．０６
モル／ｌホルマリン（３７χ） ０．３０
モル／乏苛性ソーダ（ＮａＯＨ） ０．３５
モル／１ＥＤＴＡ Ｏ，１２モル
／ｌ添加剤 少々
めっき温度ニア０〜７２°ＣｐＨ１２，４（発明の効果
）
以上述べたように、本発明方法によれば、信顛性に優れ
たスルーホールをレーザー光によって形成することがで
き、高い信輔性を有する高密度多層プリント配線板を容
易に供給でき、産業上寄与する効果は極めて大きい。Copper sulfate (CuSOa・5tlzO) 0.06
Mol/l formalin (37χ) 0.30
Mol/poor caustic soda (NaOH) 0.35
mol/1 EDTA O, 12 mol/l Additive Plating temperature near 0 to 72°C pH 12.4 (Effects of the invention) As described above, according to the method of the present invention, through holes with excellent reliability can be formed by laser. It is possible to easily provide a high-density multilayer printed wiring board that can be formed using light and has high reliability, and the industrial effect is extremely large.
第１図は本発明の多層プリント配線板の製造工程を示す
縦断面図、第２図は、従来のドリル削孔によって形成さ
れたブラインドスルーホールを示す縦断面図、第３図は
、従来のプリプレグを絶縁層として使用し、レーザーに
よって孔あけを行った後の状態を示す縦断面図である。
１、ブラインドスルーホール、
２、導体回路、
３、絶縁層、
４、突出したガラスクロス。
以上FIG. 1 is a vertical cross-sectional view showing the manufacturing process of the multilayer printed wiring board of the present invention, FIG. 2 is a vertical cross-sectional view showing a blind through hole formed by conventional drilling, and FIG. FIG. 2 is a longitudinal cross-sectional view showing a state after drilling holes using a laser using prepreg as an insulating layer. 1. Blind through hole, 2. Conductor circuit, 3. Insulating layer, 4. Protruding glass cloth. that's all
Claims (1)
に、酸化剤に対して難溶性の樹脂からなるマトリックス
中に酸化剤に対して可溶性の硬化処理された耐熱性樹脂
粉末が分散して存在する樹脂組成物からなる絶縁層を形
成した後、前記絶縁層にレーザー光を照射して孔あけし
、次いで前記絶縁層表面を酸化剤処理して粗面化し、無
電解めっきして導体回路を形成することを少なくとも一
回行うことを特徴とする高密度多層プリント配線板の製
造方法1. A resin composition in which hardened heat-resistant resin powder that is soluble in oxidizing agents is dispersed in a matrix made of resin that is poorly soluble in oxidizing agents on a printed wiring board on which conductor circuits have been formed in advance. After forming an insulating layer made of material, the insulating layer is irradiated with a laser beam to make holes, and then the surface of the insulating layer is treated with an oxidizing agent to roughen it, and electroless plating is performed to form a conductor circuit. A method for manufacturing a high-density multilayer printed wiring board, characterized by performing the following at least once:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63297119A JPH0783182B2 (en) | 1988-11-24 | 1988-11-24 | Method for manufacturing high-density multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63297119A JPH0783182B2 (en) | 1988-11-24 | 1988-11-24 | Method for manufacturing high-density multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02143492A true JPH02143492A (en) | 1990-06-01 |
| JPH0783182B2 JPH0783182B2 (en) | 1995-09-06 |
Family
ID=17842458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63297119A Expired - Lifetime JPH0783182B2 (en) | 1988-11-24 | 1988-11-24 | Method for manufacturing high-density multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783182B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232554A (en) * | 1993-01-29 | 1994-08-19 | Victor Co Of Japan Ltd | Manufacture of multilayer printed wiring board |
| JPH07176867A (en) * | 1993-12-20 | 1995-07-14 | Nec Corp | Manufacture of printed wiring board |
| EP0715490A2 (en) | 1994-12-02 | 1996-06-05 | Nippon Paint Co., Ltd. | Method of preparing multilayer wiring board |
| JP2007023756A (en) * | 2005-06-13 | 2007-02-01 | Fuji Sogo Kenzai Kk | Crime preventive grating |
| JP2007051456A (en) * | 2005-08-17 | 2007-03-01 | Fuji Sogo Kenzai Kk | Antitheft face lattice |
| JP2007133767A (en) * | 2005-11-11 | 2007-05-31 | Fuji Sogo Kenzai Kk | Burglarproof face lattice |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254172A (en) * | 1975-10-28 | 1977-05-02 | Siemens Ag | Method of producing microminiature multiilayer wiring |
| JPS5650599A (en) * | 1979-10-01 | 1981-05-07 | Nippon Telegraph & Telephone | Method of manufacturing circuit board |
| JPS60261685A (en) * | 1984-05-18 | 1985-12-24 | シーメンス、アクチエンゲゼルシヤフト | Device for forming through-contact hole to multilayer structure |
| JPS61176193A (en) * | 1985-01-31 | 1986-08-07 | 日立化成工業株式会社 | Manufacture of wiring board |
| JPS63126297A (en) * | 1986-11-14 | 1988-05-30 | イビデン株式会社 | Multilayer printed interconnection board and manufacture of the same |
-
1988
- 1988-11-24 JP JP63297119A patent/JPH0783182B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254172A (en) * | 1975-10-28 | 1977-05-02 | Siemens Ag | Method of producing microminiature multiilayer wiring |
| JPS5650599A (en) * | 1979-10-01 | 1981-05-07 | Nippon Telegraph & Telephone | Method of manufacturing circuit board |
| JPS60261685A (en) * | 1984-05-18 | 1985-12-24 | シーメンス、アクチエンゲゼルシヤフト | Device for forming through-contact hole to multilayer structure |
| JPS61176193A (en) * | 1985-01-31 | 1986-08-07 | 日立化成工業株式会社 | Manufacture of wiring board |
| JPS63126297A (en) * | 1986-11-14 | 1988-05-30 | イビデン株式会社 | Multilayer printed interconnection board and manufacture of the same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232554A (en) * | 1993-01-29 | 1994-08-19 | Victor Co Of Japan Ltd | Manufacture of multilayer printed wiring board |
| JPH07176867A (en) * | 1993-12-20 | 1995-07-14 | Nec Corp | Manufacture of printed wiring board |
| EP0715490A2 (en) | 1994-12-02 | 1996-06-05 | Nippon Paint Co., Ltd. | Method of preparing multilayer wiring board |
| JP2007023756A (en) * | 2005-06-13 | 2007-02-01 | Fuji Sogo Kenzai Kk | Crime preventive grating |
| JP2007051456A (en) * | 2005-08-17 | 2007-03-01 | Fuji Sogo Kenzai Kk | Antitheft face lattice |
| JP2007133767A (en) * | 2005-11-11 | 2007-05-31 | Fuji Sogo Kenzai Kk | Burglarproof face lattice |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0783182B2 (en) | 1995-09-06 |
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