JPS57147245A - Positioning method and device for chip bonding - Google Patents

Positioning method and device for chip bonding

Info

Publication number
JPS57147245A
JPS57147245A JP3161981A JP3161981A JPS57147245A JP S57147245 A JPS57147245 A JP S57147245A JP 3161981 A JP3161981 A JP 3161981A JP 3161981 A JP3161981 A JP 3161981A JP S57147245 A JPS57147245 A JP S57147245A
Authority
JP
Japan
Prior art keywords
substrate
chip
tool
monitor
positioning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3161981A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131296B2 (enrdf_load_stackoverflow
Inventor
Noboru Fujino
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP3161981A priority Critical patent/JPS57147245A/ja
Publication of JPS57147245A publication Critical patent/JPS57147245A/ja
Publication of JPH0131296B2 publication Critical patent/JPH0131296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP3161981A 1981-03-05 1981-03-05 Positioning method and device for chip bonding Granted JPS57147245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3161981A JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3161981A JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP26044988A Division JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Publications (2)

Publication Number Publication Date
JPS57147245A true JPS57147245A (en) 1982-09-11
JPH0131296B2 JPH0131296B2 (enrdf_load_stackoverflow) 1989-06-26

Family

ID=12336224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3161981A Granted JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Country Status (1)

Country Link
JP (1) JPS57147245A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (ja) * 1984-07-31 1985-06-29 Shinkawa Ltd インナ−リ−ドボンダ−
JPS6169139A (ja) * 1984-09-13 1986-04-09 Toshiba Seiki Kk ペレツトボンデイング装置における認識装置
JPS63178540A (ja) * 1987-01-20 1988-07-22 Seiko Instr & Electronics Ltd Ｉｃのマウント装置
JP2007103667A (ja) * 2005-10-04 2007-04-19 Canon Machinery Inc ダイボンダ
WO2017009980A1 (ja) * 2015-07-15 2017-01-19 ヤマハ発動機株式会社 モデルデータ作成装置、モデルデータの作成方法、搭載基準点決定装置、搭載基準点の決定方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (ja) * 1984-07-31 1985-06-29 Shinkawa Ltd インナ−リ−ドボンダ−
JPS6169139A (ja) * 1984-09-13 1986-04-09 Toshiba Seiki Kk ペレツトボンデイング装置における認識装置
JPS63178540A (ja) * 1987-01-20 1988-07-22 Seiko Instr & Electronics Ltd Ｉｃのマウント装置
JP2007103667A (ja) * 2005-10-04 2007-04-19 Canon Machinery Inc ダイボンダ
WO2017009980A1 (ja) * 2015-07-15 2017-01-19 ヤマハ発動機株式会社 モデルデータ作成装置、モデルデータの作成方法、搭載基準点決定装置、搭載基準点の決定方法
JPWO2017009980A1 (ja) * 2015-07-15 2018-02-08 ヤマハ発動機株式会社 モデルデータ作成装置、モデルデータの作成方法、搭載基準点決定装置、搭載基準点の決定方法
CN107926148A (zh) * 2015-07-15 2018-04-17 雅马哈发动机株式会社 模型数据生成装置、模型数据的生成方法、搭载基准点决定装置及搭载基准点的决定方法
US10354036B2 (en) 2015-07-15 2019-07-16 Yamaha Hatsudoki Kabushiki Kaisha Model data generation device, method of generating model data, mounting reference point determination device, and method of determining mounting reference point
CN107926148B (zh) * 2015-07-15 2019-11-26 雅马哈发动机株式会社 模型数据生成装置及方法、搭载基准点决定装置及方法

Also Published As

Publication number Publication date
JPH0131296B2 (enrdf_load_stackoverflow) 1989-06-26

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