JPS57167651A - Inspecting device for surface of semiconductor wafer - Google Patents

Inspecting device for surface of semiconductor wafer

Info

Publication number
JPS57167651A
JPS57167651A JP5346981A JP5346981A JPS57167651A JP S57167651 A JPS57167651 A JP S57167651A JP 5346981 A JP5346981 A JP 5346981A JP 5346981 A JP5346981 A JP 5346981A JP S57167651 A JPS57167651 A JP S57167651A
Authority
JP
Japan
Prior art keywords
magnification lens
inspecting
semiconductor wafer
inspecting position
visual field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5346981A
Other languages
Japanese (ja)
Other versions
JPH0324064B2 (en
Inventor
Hitoshi Tanaka
Yoji Hirata
Shuji Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5346981A priority Critical patent/JPS57167651A/en
Publication of JPS57167651A publication Critical patent/JPS57167651A/en
Publication of JPH0324064B2 publication Critical patent/JPH0324064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To catch an inspecting position automatically in the visual field of a high-magnification lens by positioning the wafer according to the information of the inspecting position and inspecting the surface of the wafer by means of the high-magnification lens according to information detected by means of a low- magnification lens. CONSTITUTION:A base plate 6, on which the semiconductor wafer 1 is placed and which can be moved in the triaxial direction, is brought into the visual field of the low magnification lens system of the expanding section 12 of a pickup device 9a according to the information of the inspecting position previously determined. The pattern of the surface of the semiconductor wafer 1 is converted into electrical signals by a pickup section 13. The electrical signals from the pickup section 13 are displayed to a Braun tube 10 while being transmitted to a calculator 14, and the inspecting position is detected through the recognition of the pattern. The calculator 14 drives the base plate 6 by means of a driving device 18 so that the inspecting position is brought into the visual field of the high-magnification lens by information detected. The expanding section 12 is changed over to the high-magnification lens.
JP5346981A 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer Granted JPS57167651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5346981A JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5346981A JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS57167651A true JPS57167651A (en) 1982-10-15
JPH0324064B2 JPH0324064B2 (en) 1991-04-02

Family

ID=12943709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5346981A Granted JPS57167651A (en) 1981-04-07 1981-04-07 Inspecting device for surface of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57167651A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919344A (en) * 1982-07-23 1984-01-31 Hitachi Ltd 2-field optical device
JPS59144918A (en) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド Method and apparatus for positioning specified pattern
JPS61241605A (en) * 1985-04-19 1986-10-27 Yoshiaki Ihara Image processing device
JPS6261340A (en) * 1985-09-11 1987-03-18 Fuji Electric Co Ltd Detecting device for necessary positioning angle of wafer
JPS6276732A (en) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd Foreign material inspecting apparatus
JPS62166505U (en) * 1986-04-09 1987-10-22
JPH03108735A (en) * 1989-09-22 1991-05-08 Hitachi Ltd Method and apparatus for comparison inspection
JPH0373451U (en) * 1984-02-22 1991-07-24
JPH05226460A (en) * 1992-02-18 1993-09-03 Nec Yamagata Ltd Semiconductor chip position detecting device by processing image
EP0647828A2 (en) * 1993-10-12 1995-04-12 Hughes Aircraft Company Cofocal optical systems for thickness measurements of patterned wafers
JP2007258359A (en) * 2006-03-22 2007-10-04 Sharp Corp Process for manufacturing semiconductor device and deposition device of semiconductor device
CN102628670A (en) * 2011-02-01 2012-08-08 株式会社其恩斯 Dimension measuring apparatus, dimension measuring method, and program for dimension measuring apparatus
WO2020008838A1 (en) * 2018-07-06 2020-01-09 東レエンジニアリング株式会社 Dicing-tip inspection apparatus
JP2021034403A (en) * 2019-08-15 2021-03-01 株式会社ディスコ Processing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125640A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125640A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919344A (en) * 1982-07-23 1984-01-31 Hitachi Ltd 2-field optical device
JPS59144918A (en) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド Method and apparatus for positioning specified pattern
JPH0537476Y2 (en) * 1984-02-22 1993-09-22
JPH0373451U (en) * 1984-02-22 1991-07-24
JPS61241605A (en) * 1985-04-19 1986-10-27 Yoshiaki Ihara Image processing device
JPS6261340A (en) * 1985-09-11 1987-03-18 Fuji Electric Co Ltd Detecting device for necessary positioning angle of wafer
JPS6276732A (en) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd Foreign material inspecting apparatus
JPS62166505U (en) * 1986-04-09 1987-10-22
JPH03108735A (en) * 1989-09-22 1991-05-08 Hitachi Ltd Method and apparatus for comparison inspection
JPH05226460A (en) * 1992-02-18 1993-09-03 Nec Yamagata Ltd Semiconductor chip position detecting device by processing image
EP0647828A2 (en) * 1993-10-12 1995-04-12 Hughes Aircraft Company Cofocal optical systems for thickness measurements of patterned wafers
EP0647828A3 (en) * 1993-10-12 1996-11-13 Hughes Aircraft Co Cofocal optical systems for thickness measurements of patterned wafers.
JP2007258359A (en) * 2006-03-22 2007-10-04 Sharp Corp Process for manufacturing semiconductor device and deposition device of semiconductor device
CN102628670A (en) * 2011-02-01 2012-08-08 株式会社其恩斯 Dimension measuring apparatus, dimension measuring method, and program for dimension measuring apparatus
JP2012159409A (en) * 2011-02-01 2012-08-23 Keyence Corp Dimension measuring device, dimension measuring method, and program for dimension measuring device
CN102628670B (en) * 2011-02-01 2017-08-04 株式会社其恩斯 Dimension measuring apparatus and dimension measurement method
WO2020008838A1 (en) * 2018-07-06 2020-01-09 東レエンジニアリング株式会社 Dicing-tip inspection apparatus
JP2020008383A (en) * 2018-07-06 2020-01-16 東レエンジニアリング株式会社 Dicing chip inspection device
JP2021034403A (en) * 2019-08-15 2021-03-01 株式会社ディスコ Processing device

Also Published As

Publication number Publication date
JPH0324064B2 (en) 1991-04-02

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