JPS55125640A - Automatic chip selection apparatus - Google Patents

Automatic chip selection apparatus

Info

Publication number
JPS55125640A
JPS55125640A JP3374479A JP3374479A JPS55125640A JP S55125640 A JPS55125640 A JP S55125640A JP 3374479 A JP3374479 A JP 3374479A JP 3374479 A JP3374479 A JP 3374479A JP S55125640 A JPS55125640 A JP S55125640A
Authority
JP
Japan
Prior art keywords
chip
camera
command
detect
sent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3374479A
Other languages
Japanese (ja)
Other versions
JPS6161255B2 (en
Inventor
Masayuki Naruse
Shige Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3374479A priority Critical patent/JPS55125640A/en
Publication of JPS55125640A publication Critical patent/JPS55125640A/en
Publication of JPS6161255B2 publication Critical patent/JPS6161255B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To remove rejected chip without contact with the adjacent one retaining then at the center by detecting the rejection mark after a quick, automatic positioning thereof with the image output region of the camera reduced to its minimum. CONSTITUTION:A jig on which a semiconductor chip is laid in a matrix array is placed on x, y and theta bases 11. With the command 30, a rough positioning 10 is made to pick up the optical image of the chip into the camera 50. The scanning zone is set to effect photoelectric conversion of the signel only limited to minimum area of the chip to be inspected. The binary signal thus obtained is sent to a changeover circuit 70 to detect the position as shown by 80. After the removal of noises or the like, the quadrilateral thus obtatined is compared with the reference information 81 to correct the base 11 by computing the position errors. Then, the scanning zone is set 40 to allow the camera 50 to produce the output to the quadrilateral area small than the end side of the chip and the binary signal is sent to the circuit 70 to detect 90 the rejection marks in sequence. During the inspection, with the command 30, the chip 3 is ejected from the sheet 1 through a mechanism control section 100 and removed 102 by a suction nozzle.
JP3374479A 1979-03-22 1979-03-22 Automatic chip selection apparatus Granted JPS55125640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3374479A JPS55125640A (en) 1979-03-22 1979-03-22 Automatic chip selection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3374479A JPS55125640A (en) 1979-03-22 1979-03-22 Automatic chip selection apparatus

Publications (2)

Publication Number Publication Date
JPS55125640A true JPS55125640A (en) 1980-09-27
JPS6161255B2 JPS6161255B2 (en) 1986-12-24

Family

ID=12394915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3374479A Granted JPS55125640A (en) 1979-03-22 1979-03-22 Automatic chip selection apparatus

Country Status (1)

Country Link
JP (1) JPS55125640A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167651A (en) * 1981-04-07 1982-10-15 Mitsubishi Electric Corp Inspecting device for surface of semiconductor wafer
JPS58200550A (en) * 1982-05-18 1983-11-22 Marine Instr Co Ltd Method and apparatus for extracting integrated circuit chip
JP2011044609A (en) * 2009-08-21 2011-03-03 Shin Etsu Handotai Co Ltd Visual inspection apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167651A (en) * 1981-04-07 1982-10-15 Mitsubishi Electric Corp Inspecting device for surface of semiconductor wafer
JPH0324064B2 (en) * 1981-04-07 1991-04-02 Mitsubishi Electric Corp
JPS58200550A (en) * 1982-05-18 1983-11-22 Marine Instr Co Ltd Method and apparatus for extracting integrated circuit chip
JP2011044609A (en) * 2009-08-21 2011-03-03 Shin Etsu Handotai Co Ltd Visual inspection apparatus

Also Published As

Publication number Publication date
JPS6161255B2 (en) 1986-12-24

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