JPS5698872A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5698872A JPS5698872A JP42180A JP42180A JPS5698872A JP S5698872 A JPS5698872 A JP S5698872A JP 42180 A JP42180 A JP 42180A JP 42180 A JP42180 A JP 42180A JP S5698872 A JPS5698872 A JP S5698872A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- source
- platinum
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 229910021339 platinum silicide Inorganic materials 0.000 abstract 3
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 239000007858 starting material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP42180A JPS5698872A (en) | 1980-01-07 | 1980-01-07 | Preparation of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP42180A JPS5698872A (en) | 1980-01-07 | 1980-01-07 | Preparation of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5698872A true JPS5698872A (en) | 1981-08-08 |
| JPS6243551B2 JPS6243551B2 (enrdf_load_stackoverflow) | 1987-09-14 |
Family
ID=11473332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP42180A Granted JPS5698872A (en) | 1980-01-07 | 1980-01-07 | Preparation of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5698872A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178642A (ja) * | 1984-02-24 | 1985-09-12 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH08227901A (ja) * | 1995-02-20 | 1996-09-03 | Nec Corp | 半導体装置の製造方法 |
-
1980
- 1980-01-07 JP JP42180A patent/JPS5698872A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60178642A (ja) * | 1984-02-24 | 1985-09-12 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH08227901A (ja) * | 1995-02-20 | 1996-09-03 | Nec Corp | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243551B2 (enrdf_load_stackoverflow) | 1987-09-14 |
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