JPS5698874A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5698874A
JPS5698874A JP42380A JP42380A JPS5698874A JP S5698874 A JPS5698874 A JP S5698874A JP 42380 A JP42380 A JP 42380A JP 42380 A JP42380 A JP 42380A JP S5698874 A JPS5698874 A JP S5698874A
Authority
JP
Japan
Prior art keywords
layer
electrodes
source
platinum
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP42380A
Other languages
Japanese (ja)
Other versions
JPS6243552B2 (en
Inventor
Hiroki Muta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP42380A priority Critical patent/JPS5698874A/en
Publication of JPS5698874A publication Critical patent/JPS5698874A/en
Publication of JPS6243552B2 publication Critical patent/JPS6243552B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE: To simplify the preparation process of the FETs, by making the gate, source and drain electrodes with the use of platinum silicides made in the presence of polycrystlal or amorphous Si and by making the wires that extend from the said electrodes by the same process on the same layer.
CONSTITUTION: On the P type semiconductor substrate 31, the device separation layer 32, the P+ type region 33 as the channel stopper and the N+ type layers 34a, 34b and 34c which correspond to the source and drain regions are formed, and the N type layer 35 is further formed as the active layer. Next, the part where the gate electrodes 36a and 36b of Schottky junction border on the layer 35 and the part where the ohmic electrodes 36c, 36d and 36b of source and drain regions border on the layer 34b are formed. These are made of platinum silicide consisting of polycrystal or amorphous Si. On the platinum silicide, metal such as W1 and Mo are preliminerily placed that is not platinum itself and whose alloy temperature is high enough. Thus the resistance is minimized, resulting in the high velocity of IC.
COPYRIGHT: (C)1981,JPO&Japio
JP42380A 1980-01-07 1980-01-07 Preparation of semiconductor device Granted JPS5698874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP42380A JPS5698874A (en) 1980-01-07 1980-01-07 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP42380A JPS5698874A (en) 1980-01-07 1980-01-07 Preparation of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5698874A true JPS5698874A (en) 1981-08-08
JPS6243552B2 JPS6243552B2 (en) 1987-09-14

Family

ID=11473386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP42380A Granted JPS5698874A (en) 1980-01-07 1980-01-07 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698874A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274359A (en) * 1985-04-01 1986-12-04 フエアチヤイルド セミコンダクタ コ−ポレ−シヨン Small contactless ram cell
JPH07221096A (en) * 1994-01-24 1995-08-18 Lg Semicon Co Ltd Silicide plug formation
JPH08227901A (en) * 1995-02-20 1996-09-03 Nec Corp Fabrication of semiconductor device
JP4912886B2 (en) * 2003-11-24 2012-04-11 トライクウィント セミコンダクター,インコーポレーテッド Monolithic integrated enhancement mode and depletion mode FET and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0515898Y2 (en) * 1987-01-30 1993-04-26

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274359A (en) * 1985-04-01 1986-12-04 フエアチヤイルド セミコンダクタ コ−ポレ−シヨン Small contactless ram cell
JPH07221096A (en) * 1994-01-24 1995-08-18 Lg Semicon Co Ltd Silicide plug formation
JPH08227901A (en) * 1995-02-20 1996-09-03 Nec Corp Fabrication of semiconductor device
JP2687917B2 (en) * 1995-02-20 1997-12-08 日本電気株式会社 Method for manufacturing semiconductor device
JP4912886B2 (en) * 2003-11-24 2012-04-11 トライクウィント セミコンダクター,インコーポレーテッド Monolithic integrated enhancement mode and depletion mode FET and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6243552B2 (en) 1987-09-14

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