JPH1135893A - シート状ホットメルト接着剤、および半導体装置 - Google Patents

シート状ホットメルト接着剤、および半導体装置

Info

Publication number
JPH1135893A
JPH1135893A JP9197914A JP19791497A JPH1135893A JP H1135893 A JPH1135893 A JP H1135893A JP 9197914 A JP9197914 A JP 9197914A JP 19791497 A JP19791497 A JP 19791497A JP H1135893 A JPH1135893 A JP H1135893A
Authority
JP
Japan
Prior art keywords
sheet
melt adhesive
hot
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9197914A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1135893A5 (enExample
Inventor
Kimio Yamakawa
君男 山川
Minoru Isshiki
実 一色
Yoshiko Otani
淑子 大谷
Katsutoshi Mine
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26478770&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH1135893(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Priority to JP9197914A priority Critical patent/JPH1135893A/ja
Priority to US09/082,889 priority patent/US6231974B1/en
Publication of JPH1135893A publication Critical patent/JPH1135893A/ja
Priority to US09/812,860 priority patent/US6498400B2/en
Publication of JPH1135893A5 publication Critical patent/JPH1135893A5/ja
Pending legal-status Critical Current

Links

Classifications

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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP9197914A 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置 Pending JPH1135893A (ja)

Priority Applications (3)

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JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置
US09/082,889 US6231974B1 (en) 1997-05-22 1998-05-21 Hot-melt adhesive sheet and semiconductor devices
US09/812,860 US6498400B2 (en) 1997-05-22 2001-03-21 Semiconductor devices

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JP9-148642 1997-05-22
JP14864297 1997-05-22
JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置

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JPH1135893A5 JPH1135893A5 (enExample) 2005-05-12

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
JP2007227950A (ja) * 2000-01-19 2007-09-06 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれを用いた半導体装置
JP2009054893A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd 発光装置
JP2010162828A (ja) * 2009-01-19 2010-07-29 Kanematsu Nnk Corp 蓄光剤入りの木材及び蓄光剤入り木材の製造方法
JP2011083895A (ja) * 2009-10-13 2011-04-28 Toray Ind Inc シート接合用熱接着フィルム
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
US10598408B2 (en) 2014-02-17 2020-03-24 Savo-Solar Oy Solar thermal absorber element
JP2021512039A (ja) * 2018-01-31 2021-05-13 サン−ゴバン グラス フランス 電気的に制御可能な装置を有する積層グレージング及びその製造方法

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US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7105360B2 (en) * 2002-03-08 2006-09-12 International Business Machines Corporation Low temperature melt-processing of organic-inorganic hybrid
US6919646B2 (en) * 2002-03-12 2005-07-19 Nec Electronics Corporation Semiconductor device with contacting electrodes
US20050121806A1 (en) * 2003-12-04 2005-06-09 White Electronic Designs Corporation Method for attaching circuit elements
JP4839041B2 (ja) * 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
US7618874B1 (en) * 2008-05-02 2009-11-17 Micron Technology, Inc. Methods of forming capacitors
US7696056B2 (en) 2008-05-02 2010-04-13 Micron Technology, Inc. Methods of forming capacitors
JPWO2013122055A1 (ja) * 2012-02-15 2015-05-11 コニカミノルタ株式会社 機能性フィルム、およびその製造方法、並びに前記機能性フィルムを含む電子デバイス
CN108292711A (zh) 2015-11-24 2018-07-17 康宁股份有限公司 具有颗粒膜引发的低厚度激光焊接件的密封装置壳体及相关方法
US10786651B2 (en) 2017-03-07 2020-09-29 Talon Medical, LLC Steerable guide catheter
WO2023083472A1 (de) * 2021-11-15 2023-05-19 Lohmann Gmbh & Co. Kg Klebeband

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US4624724A (en) 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US5670251A (en) * 1990-02-14 1997-09-23 Particle Interconnect Corporation Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces
US5538771A (en) * 1991-06-28 1996-07-23 Furukawa Electric Co., Ltd. Semiconductor wafer-securing adhesive tape
US5523137A (en) * 1991-07-24 1996-06-04 Tomoegawa Paper Co., Ltd. Adhesive paper for tape automated bonding
US5707730A (en) * 1993-12-20 1998-01-13 Tomoegawa Paper Co. Ltd. Adhesive for semiconductor device and reinforcing material using the same
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
US5710097A (en) * 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2007227950A (ja) * 2000-01-19 2007-09-06 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれを用いた半導体装置
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
JP2009054893A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd 発光装置
JP2010162828A (ja) * 2009-01-19 2010-07-29 Kanematsu Nnk Corp 蓄光剤入りの木材及び蓄光剤入り木材の製造方法
JP2011083895A (ja) * 2009-10-13 2011-04-28 Toray Ind Inc シート接合用熱接着フィルム
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
US10598408B2 (en) 2014-02-17 2020-03-24 Savo-Solar Oy Solar thermal absorber element
JP2021512039A (ja) * 2018-01-31 2021-05-13 サン−ゴバン グラス フランス 電気的に制御可能な装置を有する積層グレージング及びその製造方法

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