JPH1135893A5 - - Google Patents

Info

Publication number
JPH1135893A5
JPH1135893A5 JP1997197914A JP19791497A JPH1135893A5 JP H1135893 A5 JPH1135893 A5 JP H1135893A5 JP 1997197914 A JP1997197914 A JP 1997197914A JP 19791497 A JP19791497 A JP 19791497A JP H1135893 A5 JPH1135893 A5 JP H1135893A5
Authority
JP
Japan
Prior art keywords
hot melt
melt adhesive
silicone
particle size
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997197914A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1135893A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9197914A priority Critical patent/JPH1135893A/ja
Priority claimed from JP9197914A external-priority patent/JPH1135893A/ja
Priority to US09/082,889 priority patent/US6231974B1/en
Publication of JPH1135893A publication Critical patent/JPH1135893A/ja
Priority to US09/812,860 priority patent/US6498400B2/en
Publication of JPH1135893A5 publication Critical patent/JPH1135893A5/ja
Pending legal-status Critical Current

Links

JP9197914A 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置 Pending JPH1135893A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置
US09/082,889 US6231974B1 (en) 1997-05-22 1998-05-21 Hot-melt adhesive sheet and semiconductor devices
US09/812,860 US6498400B2 (en) 1997-05-22 2001-03-21 Semiconductor devices

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-148642 1997-05-22
JP14864297 1997-05-22
JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置

Publications (2)

Publication Number Publication Date
JPH1135893A JPH1135893A (ja) 1999-02-09
JPH1135893A5 true JPH1135893A5 (enExample) 2005-05-12

Family

ID=26478770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9197914A Pending JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置

Country Status (2)

Country Link
US (2) US6231974B1 (enExample)
JP (1) JPH1135893A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2007227950A (ja) * 2000-01-19 2007-09-06 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれを用いた半導体装置
US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7105360B2 (en) * 2002-03-08 2006-09-12 International Business Machines Corporation Low temperature melt-processing of organic-inorganic hybrid
US6919646B2 (en) * 2002-03-12 2005-07-19 Nec Electronics Corporation Semiconductor device with contacting electrodes
US20050121806A1 (en) * 2003-12-04 2005-06-09 White Electronic Designs Corporation Method for attaching circuit elements
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
JP4839041B2 (ja) * 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP2009054893A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd 発光装置
US7618874B1 (en) * 2008-05-02 2009-11-17 Micron Technology, Inc. Methods of forming capacitors
US7696056B2 (en) 2008-05-02 2010-04-13 Micron Technology, Inc. Methods of forming capacitors
JP5246781B2 (ja) * 2009-01-19 2013-07-24 兼松日産農林株式会社 蓄光剤入りの木材及び蓄光剤入り木材の製造方法
JP5600920B2 (ja) * 2009-10-13 2014-10-08 東レ株式会社 シート接合用熱接着フィルム
JP5721416B2 (ja) * 2010-12-13 2015-05-20 積水化学工業株式会社 熱伝導性接着剤
JPWO2013122055A1 (ja) * 2012-02-15 2015-05-11 コニカミノルタ株式会社 機能性フィルム、およびその製造方法、並びに前記機能性フィルムを含む電子デバイス
FI127237B (en) 2014-02-17 2018-02-15 Savo Solar Oy Aurinkolämpöabsorberielementti
CN108292711A (zh) 2015-11-24 2018-07-17 康宁股份有限公司 具有颗粒膜引发的低厚度激光焊接件的密封装置壳体及相关方法
US10786651B2 (en) 2017-03-07 2020-09-29 Talon Medical, LLC Steerable guide catheter
FR3077219B1 (fr) * 2018-01-31 2020-06-26 Saint-Gobain Glass France Vitrage feuillete a dispositif electrocommandable et fabrication
WO2023083472A1 (de) * 2021-11-15 2023-05-19 Lohmann Gmbh & Co. Kg Klebeband

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624724A (en) 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US5670251A (en) * 1990-02-14 1997-09-23 Particle Interconnect Corporation Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces
US5538771A (en) * 1991-06-28 1996-07-23 Furukawa Electric Co., Ltd. Semiconductor wafer-securing adhesive tape
US5523137A (en) * 1991-07-24 1996-06-04 Tomoegawa Paper Co., Ltd. Adhesive paper for tape automated bonding
US5707730A (en) * 1993-12-20 1998-01-13 Tomoegawa Paper Co. Ltd. Adhesive for semiconductor device and reinforcing material using the same
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
US5710097A (en) * 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays

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