JP2003504425A5 - - Google Patents

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Publication number
JP2003504425A5
JP2003504425A5 JP2000591099A JP2000591099A JP2003504425A5 JP 2003504425 A5 JP2003504425 A5 JP 2003504425A5 JP 2000591099 A JP2000591099 A JP 2000591099A JP 2000591099 A JP2000591099 A JP 2000591099A JP 2003504425 A5 JP2003504425 A5 JP 2003504425A5
Authority
JP
Japan
Prior art keywords
epoxy
curing agent
weight percent
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000591099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003504425A (ja
Filing date
Publication date
Priority claimed from US09/219,265 external-priority patent/US6294270B1/en
Application filed filed Critical
Publication of JP2003504425A publication Critical patent/JP2003504425A/ja
Publication of JP2003504425A5 publication Critical patent/JP2003504425A5/ja
Pending legal-status Critical Current

Links

JP2000591099A 1998-12-23 1999-09-16 エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス Pending JP2003504425A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/219,265 1998-12-23
US09/219,265 US6294270B1 (en) 1998-12-23 1998-12-23 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
PCT/US1999/021592 WO2000039189A1 (en) 1998-12-23 1999-09-16 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer

Publications (2)

Publication Number Publication Date
JP2003504425A JP2003504425A (ja) 2003-02-04
JP2003504425A5 true JP2003504425A5 (enExample) 2006-11-02

Family

ID=22818572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000591099A Pending JP2003504425A (ja) 1998-12-23 1999-09-16 エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス

Country Status (9)

Country Link
US (2) US6294270B1 (enExample)
EP (1) EP1141073A1 (enExample)
JP (1) JP2003504425A (enExample)
KR (1) KR100773789B1 (enExample)
CN (1) CN1144831C (enExample)
AU (1) AU6254199A (enExample)
HK (1) HK1043137A1 (enExample)
MY (1) MY121445A (enExample)
WO (1) WO2000039189A1 (enExample)

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US20070165075A1 (en) * 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
JP2007335836A (ja) * 2006-05-19 2007-12-27 Hitachi Chem Co Ltd ダイボンディング用樹脂ペーストの硬化方法及びダイボンディング方法
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DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CN101781443B (zh) * 2009-01-20 2012-03-28 财团法人工业技术研究院 热硬化型防焊膜组合物
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
US8173745B2 (en) * 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
CN102516437B (zh) * 2011-12-14 2014-05-21 浙江大学宁波理工学院 一种聚苯乙烯系功能微球的制备方法
CN102516717B (zh) * 2011-12-22 2014-07-09 云南云岭高速公路养护绿化工程有限公司 热塑性弹性体增韧环氧树脂、制备及应用
KR20150036178A (ko) 2012-06-28 2015-04-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전도성 기재 물품
EP2759514A1 (de) 2013-01-29 2014-07-30 tesa SE Haftklebemasse enthaltend ein verbundenes Nanopartikelnetzwerk, Verfahren zu ihrer Herstellung sowie die Verwendung derselben
KR20160088512A (ko) * 2015-01-15 2016-07-26 삼성디스플레이 주식회사 전자기기 및 전자기기의 본딩 방법
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
EP3091059B1 (de) 2015-05-05 2020-09-09 tesa SE Klebeband mit klebemasse mit kontinuierlicher polymerphase
DE102016220237A1 (de) 2016-10-17 2018-04-19 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
KR102213775B1 (ko) * 2018-02-28 2021-02-05 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지
DE102018213824A1 (de) 2018-08-16 2020-02-20 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
CN111253702B (zh) * 2020-03-30 2023-06-06 广东生益科技股份有限公司 一种树脂组合物及使用其的预浸料和电路材料
DE102022113506A1 (de) 2022-05-30 2023-11-30 Tesa Se Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten
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