KR100773789B1 - 에폭시 변성 방향족 비닐 공액 디엔 블록 공중합체를 포함하는 전자 회로 장치 - Google Patents

에폭시 변성 방향족 비닐 공액 디엔 블록 공중합체를 포함하는 전자 회로 장치 Download PDF

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Publication number
KR100773789B1
KR100773789B1 KR1020017008087A KR20017008087A KR100773789B1 KR 100773789 B1 KR100773789 B1 KR 100773789B1 KR 1020017008087 A KR1020017008087 A KR 1020017008087A KR 20017008087 A KR20017008087 A KR 20017008087A KR 100773789 B1 KR100773789 B1 KR 100773789B1
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KR
South Korea
Prior art keywords
epoxy
weight
epon
resin composition
aromatic vinyl
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Expired - Fee Related
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KR1020017008087A
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English (en)
Korean (ko)
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KR20010099936A (ko
Inventor
클라우로버트에스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20010099936A publication Critical patent/KR20010099936A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/34—Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
KR1020017008087A 1998-12-23 1999-09-16 에폭시 변성 방향족 비닐 공액 디엔 블록 공중합체를 포함하는 전자 회로 장치 Expired - Fee Related KR100773789B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/219,265 US6294270B1 (en) 1998-12-23 1998-12-23 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US09/219,265 1998-12-23

Publications (2)

Publication Number Publication Date
KR20010099936A KR20010099936A (ko) 2001-11-09
KR100773789B1 true KR100773789B1 (ko) 2007-11-07

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Application Number Title Priority Date Filing Date
KR1020017008087A Expired - Fee Related KR100773789B1 (ko) 1998-12-23 1999-09-16 에폭시 변성 방향족 비닐 공액 디엔 블록 공중합체를 포함하는 전자 회로 장치

Country Status (9)

Country Link
US (2) US6294270B1 (enExample)
EP (1) EP1141073A1 (enExample)
JP (1) JP2003504425A (enExample)
KR (1) KR100773789B1 (enExample)
CN (1) CN1144831C (enExample)
AU (1) AU6254199A (enExample)
HK (1) HK1043137A1 (enExample)
MY (1) MY121445A (enExample)
WO (1) WO2000039189A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190103870A (ko) * 2018-02-28 2019-09-05 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6489042B2 (en) * 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
GB2358325B (en) * 1999-12-20 2003-01-22 Nicholas Kennedy Mobile live information system
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
US6670017B2 (en) 2000-12-14 2003-12-30 3M Innovative Properties Company Photocurable form-in-place gasket for electronic applications
US20040094264A1 (en) * 2001-01-30 2004-05-20 Hiroaki Yamaguchi Method for adhering substrates using light activatable adhesive film
US20040131844A1 (en) * 2001-05-08 2004-07-08 Kotaro Shinozaki Sealant composition, sealant and laminated structure containing same
US7053133B2 (en) * 2001-05-29 2006-05-30 Hiroaki Yamaguchi Ultraviolet activatable adhesive film
US6955739B2 (en) * 2001-06-19 2005-10-18 3M Innovative Properties Company Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
US6624213B2 (en) 2001-11-08 2003-09-23 3M Innovative Properties Company High temperature epoxy adhesive films
US6749887B1 (en) * 2001-11-28 2004-06-15 Lifescan, Inc. Solution drying system
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6720195B2 (en) * 2002-05-15 2004-04-13 Micron Technology, Inc. Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture
US6936644B2 (en) * 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
WO2004047166A2 (en) * 2002-11-15 2004-06-03 E.I. Du Pont De Nemours And Company Process for using protective layers in the fabrication of electronic devices
US20040170925A1 (en) * 2002-12-06 2004-09-02 Roach David Herbert Positive imageable thick film compositions
US7132678B2 (en) * 2003-03-21 2006-11-07 International Business Machines Corporation Electronic device including a self-assembled monolayer, and a method of fabricating the same
US20040197571A1 (en) * 2003-04-03 2004-10-07 Yuji Hiroshige Thermosetting composition, and sealing article and sealing structure using the same
US7402373B2 (en) 2004-02-05 2008-07-22 E.I. Du Pont De Nemours And Company UV radiation blocking protective layers compatible with thick film pastes
US7238732B2 (en) 2004-02-18 2007-07-03 Eastman Chemical Company Radiation-curable adhesive compositions
US7332540B2 (en) 2004-02-18 2008-02-19 Eastman Chemical Company Aromatic-acrylate tackifier resins
US7262242B2 (en) 2004-02-18 2007-08-28 Eastman Chemical Company Aromatic/acrylate tackifier resin and acrylic polymer blends
DE102004031190A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102004031189A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
US20070165075A1 (en) * 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
JP2007335836A (ja) * 2006-05-19 2007-12-27 Hitachi Chem Co Ltd ダイボンディング用樹脂ペーストの硬化方法及びダイボンディング方法
JP2008010821A (ja) * 2006-06-01 2008-01-17 Hitachi Chem Co Ltd ダイボンディング用樹脂フィルムの硬化方法及びダイボンディング方法
DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CN101781443B (zh) * 2009-01-20 2012-03-28 财团法人工业技术研究院 热硬化型防焊膜组合物
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
US8173745B2 (en) * 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
CN102516437B (zh) * 2011-12-14 2014-05-21 浙江大学宁波理工学院 一种聚苯乙烯系功能微球的制备方法
CN102516717B (zh) * 2011-12-22 2014-07-09 云南云岭高速公路养护绿化工程有限公司 热塑性弹性体增韧环氧树脂、制备及应用
US10568233B2 (en) 2012-06-28 2020-02-18 3M Innovative Properties Company Thermally conductive substrate article
EP2759514A1 (de) 2013-01-29 2014-07-30 tesa SE Haftklebemasse enthaltend ein verbundenes Nanopartikelnetzwerk, Verfahren zu ihrer Herstellung sowie die Verwendung derselben
KR20160088512A (ko) * 2015-01-15 2016-07-26 삼성디스플레이 주식회사 전자기기 및 전자기기의 본딩 방법
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
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DE102016220237A1 (de) 2016-10-17 2018-04-19 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
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CN111253702B (zh) * 2020-03-30 2023-06-06 广东生益科技股份有限公司 一种树脂组合物及使用其的预浸料和电路材料
DE102022113506A1 (de) 2022-05-30 2023-11-30 Tesa Se Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten
KR20250145043A (ko) * 2023-02-06 2025-10-13 시크파 홀딩 에스에이 에폭시 기반 uv-vis-경화성 봉지재 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726106A (ja) * 1993-07-06 1995-01-27 Daicel Chem Ind Ltd 熱硬化性樹脂組成物
WO1995016998A1 (en) * 1993-12-16 1995-06-22 Minnesota Mining And Manufacturing Company Anisotropic, electrically conductive adhesive film

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054553A (en) 1975-06-02 1977-10-18 General Electric Company Polyphenylene oxide process
US4256828A (en) 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4092294A (en) 1976-08-30 1978-05-30 General Electric Company Method for preparing polyphenylene ethers
US4250053A (en) 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
US4517341A (en) 1982-07-27 1985-05-14 General Electric Company Process for preparing polyphenylene oxide-rubber graft copolymers and products obtained thereby
US5191101A (en) 1982-11-22 1993-03-02 Minnesota Mining And Manufacturing Company Energy polymerizable compositions containing organometallic initiators
US4477649A (en) 1983-03-25 1984-10-16 General Electric Company Two-stage continuous process for preparation of polyphenylene oxides
US4477651A (en) 1983-06-06 1984-10-16 General Electric Company Process for preparing polyphenylene oxides
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
JP2833111B2 (ja) 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
US5059701A (en) 1990-09-20 1991-10-22 Minnesota Mining And Manufacturing Company Methods for preparation of cyclopentadienyliron (II) arenes
KR100227998B1 (ko) 1991-04-29 1999-11-01 오노 알버어스 가교-결합 에폭시 관능화 폴리디엔 블럭 중합체, 그들의 제조 방법, 그들을 포함하는 조성물 및 출발 블럭 공중합체
US5229464A (en) 1991-04-29 1993-07-20 Shell Oil Company Epoxidized viscous conjugated diene block copolymers
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
EP0877056A3 (en) 1993-12-13 2001-07-04 Daicel Chemical Industries, Ltd. A compatible blend containing an epoxy-modified block copolymer, a process, a thermoplastic resin composition, resin compositions and an asphalt composition containing an epoxy-modified block copolymer
US5478885A (en) 1994-04-15 1995-12-26 Shell Oil Company Composition of epoxy resin, epoxidized block polydiene and curing agent
CA2187763A1 (en) 1994-04-15 1995-10-26 Michael Alan Masse Epoxidized low viscosity rubber toughening modifiers for epoxy resins
US5554664A (en) 1995-03-06 1996-09-10 Minnesota Mining And Manufacturing Company Energy-activatable salts with fluorocarbon anions
JPH08245939A (ja) 1995-03-13 1996-09-24 Daicel Chem Ind Ltd ホットメルト接着剤
JPH08291278A (ja) 1995-04-21 1996-11-05 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物及び接着性フィルム
JPH0929915A (ja) 1995-07-24 1997-02-04 Daicel Chem Ind Ltd 積層構造体
US5741856A (en) 1996-02-14 1998-04-21 Shell Oil Company Chemical curing of expoxidized diene polymers using aromatic anhydride curing agents
JP2000516983A (ja) 1996-08-26 2000-12-19 ミネソタ マイニング アンド マニュファクチャリング カンパニー フルオロポリマー―エポキシ樹脂半相互貫入網目構造組成物
WO1998022531A1 (en) 1996-11-22 1998-05-28 Daicel Chemical Industries, Ltd. Heat-fusible compositions and multi-layer moldings comprising layers made therefrom
EP1005509B1 (en) 1997-08-19 2002-01-16 Minnesota Mining And Manufacturing Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
JP3893422B2 (ja) 1997-09-29 2007-03-14 新日本石油株式会社 電気電子素子封止用樹脂組成物
JPH11148064A (ja) 1997-11-17 1999-06-02 Sekisui Chem Co Ltd 反応性ホットメルト接着剤組成物及び接着方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726106A (ja) * 1993-07-06 1995-01-27 Daicel Chem Ind Ltd 熱硬化性樹脂組成物
WO1995016998A1 (en) * 1993-12-16 1995-06-22 Minnesota Mining And Manufacturing Company Anisotropic, electrically conductive adhesive film

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP A 07-026106

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190103870A (ko) * 2018-02-28 2019-09-05 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지
KR102213775B1 (ko) 2018-02-28 2021-02-05 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지

Also Published As

Publication number Publication date
HK1043137A1 (zh) 2002-09-06
US6294270B1 (en) 2001-09-25
AU6254199A (en) 2000-07-31
WO2000039189A1 (en) 2000-07-06
CN1337975A (zh) 2002-02-27
JP2003504425A (ja) 2003-02-04
US6423367B2 (en) 2002-07-23
MY121445A (en) 2006-01-28
EP1141073A1 (en) 2001-10-10
CN1144831C (zh) 2004-04-07
US20020001720A1 (en) 2002-01-03
KR20010099936A (ko) 2001-11-09

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