JP2003504425A - エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス - Google Patents

エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス

Info

Publication number
JP2003504425A
JP2003504425A JP2000591099A JP2000591099A JP2003504425A JP 2003504425 A JP2003504425 A JP 2003504425A JP 2000591099 A JP2000591099 A JP 2000591099A JP 2000591099 A JP2000591099 A JP 2000591099A JP 2003504425 A JP2003504425 A JP 2003504425A
Authority
JP
Japan
Prior art keywords
epoxy
electronic circuit
circuit device
block copolymer
conjugated diene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000591099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003504425A5 (enExample
Inventor
エス． クラーフ，ロバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2003504425A publication Critical patent/JP2003504425A/ja
Publication of JP2003504425A5 publication Critical patent/JP2003504425A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/34—Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2000591099A 1998-12-23 1999-09-16 エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス Pending JP2003504425A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/219,265 US6294270B1 (en) 1998-12-23 1998-12-23 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US09/219,265 1998-12-23
PCT/US1999/021592 WO2000039189A1 (en) 1998-12-23 1999-09-16 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer

Publications (2)

Publication Number Publication Date
JP2003504425A true JP2003504425A (ja) 2003-02-04
JP2003504425A5 JP2003504425A5 (enExample) 2006-11-02

Family

ID=22818572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000591099A Pending JP2003504425A (ja) 1998-12-23 1999-09-16 エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス

Country Status (9)

Country Link
US (2) US6294270B1 (enExample)
EP (1) EP1141073A1 (enExample)
JP (1) JP2003504425A (enExample)
KR (1) KR100773789B1 (enExample)
CN (1) CN1144831C (enExample)
AU (1) AU6254199A (enExample)
HK (1) HK1043137A1 (enExample)
MY (1) MY121445A (enExample)
WO (1) WO2000039189A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006009014A (ja) * 2004-06-28 2006-01-12 Tesa Ag 電子部品とコンダクタ・トラックを接合するための熱活性化し得る接着テープ
JP2007335836A (ja) * 2006-05-19 2007-12-27 Hitachi Chem Co Ltd ダイボンディング用樹脂ペーストの硬化方法及びダイボンディング方法
JP2008010821A (ja) * 2006-06-01 2008-01-17 Hitachi Chem Co Ltd ダイボンディング用樹脂フィルムの硬化方法及びダイボンディング方法

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US6670017B2 (en) 2000-12-14 2003-12-30 3M Innovative Properties Company Photocurable form-in-place gasket for electronic applications
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US20040131844A1 (en) * 2001-05-08 2004-07-08 Kotaro Shinozaki Sealant composition, sealant and laminated structure containing same
US7053133B2 (en) * 2001-05-29 2006-05-30 Hiroaki Yamaguchi Ultraviolet activatable adhesive film
US6955739B2 (en) * 2001-06-19 2005-10-18 3M Innovative Properties Company Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
US6624213B2 (en) 2001-11-08 2003-09-23 3M Innovative Properties Company High temperature epoxy adhesive films
US6749887B1 (en) * 2001-11-28 2004-06-15 Lifescan, Inc. Solution drying system
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US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6720195B2 (en) * 2002-05-15 2004-04-13 Micron Technology, Inc. Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture
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US7132678B2 (en) * 2003-03-21 2006-11-07 International Business Machines Corporation Electronic device including a self-assembled monolayer, and a method of fabricating the same
US20040197571A1 (en) * 2003-04-03 2004-10-07 Yuji Hiroshige Thermosetting composition, and sealing article and sealing structure using the same
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DE102004031189A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
US20070165075A1 (en) * 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CN101781443B (zh) * 2009-01-20 2012-03-28 财团法人工业技术研究院 热硬化型防焊膜组合物
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
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CN102516437B (zh) * 2011-12-14 2014-05-21 浙江大学宁波理工学院 一种聚苯乙烯系功能微球的制备方法
CN102516717B (zh) * 2011-12-22 2014-07-09 云南云岭高速公路养护绿化工程有限公司 热塑性弹性体增韧环氧树脂、制备及应用
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KR20160088512A (ko) * 2015-01-15 2016-07-26 삼성디스플레이 주식회사 전자기기 및 전자기기의 본딩 방법
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
EP3091059B1 (de) 2015-05-05 2020-09-09 tesa SE Klebeband mit klebemasse mit kontinuierlicher polymerphase
DE102016220237A1 (de) 2016-10-17 2018-04-19 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
KR102213775B1 (ko) * 2018-02-28 2021-02-05 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지
DE102018213824A1 (de) 2018-08-16 2020-02-20 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
CN111253702B (zh) * 2020-03-30 2023-06-06 广东生益科技股份有限公司 一种树脂组合物及使用其的预浸料和电路材料
DE102022113506A1 (de) 2022-05-30 2023-11-30 Tesa Se Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006009014A (ja) * 2004-06-28 2006-01-12 Tesa Ag 電子部品とコンダクタ・トラックを接合するための熱活性化し得る接着テープ
JP2007335836A (ja) * 2006-05-19 2007-12-27 Hitachi Chem Co Ltd ダイボンディング用樹脂ペーストの硬化方法及びダイボンディング方法
JP2008010821A (ja) * 2006-06-01 2008-01-17 Hitachi Chem Co Ltd ダイボンディング用樹脂フィルムの硬化方法及びダイボンディング方法

Also Published As

Publication number Publication date
HK1043137A1 (zh) 2002-09-06
US6294270B1 (en) 2001-09-25
AU6254199A (en) 2000-07-31
WO2000039189A1 (en) 2000-07-06
CN1337975A (zh) 2002-02-27
US6423367B2 (en) 2002-07-23
KR100773789B1 (ko) 2007-11-07
MY121445A (en) 2006-01-28
EP1141073A1 (en) 2001-10-10
CN1144831C (zh) 2004-04-07
US20020001720A1 (en) 2002-01-03
KR20010099936A (ko) 2001-11-09

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