JP2003504425A5 - - Google Patents
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- Publication number
- JP2003504425A5 JP2003504425A5 JP2000591099A JP2000591099A JP2003504425A5 JP 2003504425 A5 JP2003504425 A5 JP 2003504425A5 JP 2000591099 A JP2000591099 A JP 2000591099A JP 2000591099 A JP2000591099 A JP 2000591099A JP 2003504425 A5 JP2003504425 A5 JP 2003504425A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- curing agent
- weight percent
- epoxy resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000012120 mounting media Substances 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
Description
【特許請求の範囲】
【請求項1】 硬化性エポキシ変性芳香族ビニル共役ジエンブロックコポリマー90〜100質量パーセント、エポキシ樹脂0〜10質量%まで、及びエポキシ硬化剤の有効量、を含有し、前記コポリマー及びエポキシ樹脂の質量パーセントが硬化剤を除くエポキシ含有材料の質量に対してである、樹脂組成物、を含む電子回路デバイス。
【請求項2】 前記エポキシ樹脂が脂肪族または脂環式エポキシを含む、請求項1に記載の電子回路デバイス。
【請求項3】 前記エポキシ樹脂が芳香族エポキシを含む、請求項1に記載の電子回路デバイス。
【請求項4】 エポキシ変性芳香族ビニル共役ジエンブロックコポリマー90〜100質量パーセント、任意にエポキシ樹脂、及びエポキシ硬化剤、を含有し、前記コポリマー及びエポキシ樹脂の質量パーセントが硬化剤を除くエポキシ含有材料の質量に対してである、硬化性樹脂組成物、を提供する工程、
前記樹脂組成物を接着剤、カバーコート、または封入剤として物品中に混入する工程、及び
前記硬化性樹脂組成物を熱及びUV放射硬化の一方または両方にかける工程
を含む、電子接着剤、カバーコート、または封入剤の使用方法。
【請求項1】 硬化性エポキシ変性芳香族ビニル共役ジエンブロックコポリマー90〜100質量パーセント、エポキシ樹脂0〜10質量%まで、及びエポキシ硬化剤の有効量、を含有し、前記コポリマー及びエポキシ樹脂の質量パーセントが硬化剤を除くエポキシ含有材料の質量に対してである、樹脂組成物、を含む電子回路デバイス。
【請求項2】 前記エポキシ樹脂が脂肪族または脂環式エポキシを含む、請求項1に記載の電子回路デバイス。
【請求項3】 前記エポキシ樹脂が芳香族エポキシを含む、請求項1に記載の電子回路デバイス。
【請求項4】 エポキシ変性芳香族ビニル共役ジエンブロックコポリマー90〜100質量パーセント、任意にエポキシ樹脂、及びエポキシ硬化剤、を含有し、前記コポリマー及びエポキシ樹脂の質量パーセントが硬化剤を除くエポキシ含有材料の質量に対してである、硬化性樹脂組成物、を提供する工程、
前記樹脂組成物を接着剤、カバーコート、または封入剤として物品中に混入する工程、及び
前記硬化性樹脂組成物を熱及びUV放射硬化の一方または両方にかける工程
を含む、電子接着剤、カバーコート、または封入剤の使用方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/219,265 | 1998-12-23 | ||
US09/219,265 US6294270B1 (en) | 1998-12-23 | 1998-12-23 | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
PCT/US1999/021592 WO2000039189A1 (en) | 1998-12-23 | 1999-09-16 | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003504425A JP2003504425A (ja) | 2003-02-04 |
JP2003504425A5 true JP2003504425A5 (ja) | 2006-11-02 |
Family
ID=22818572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000591099A Pending JP2003504425A (ja) | 1998-12-23 | 1999-09-16 | エポキシ変性芳香族ビニル共役ジエンブロックコポリマーを含む電子回路デバイス |
Country Status (9)
Country | Link |
---|---|
US (2) | US6294270B1 (ja) |
EP (1) | EP1141073A1 (ja) |
JP (1) | JP2003504425A (ja) |
KR (1) | KR100773789B1 (ja) |
CN (1) | CN1144831C (ja) |
AU (1) | AU6254199A (ja) |
HK (1) | HK1043137A1 (ja) |
MY (1) | MY121445A (ja) |
WO (1) | WO2000039189A1 (ja) |
Families Citing this family (42)
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GB2358325B (en) * | 1999-12-20 | 2003-01-22 | Nicholas Kennedy | Mobile live information system |
JP3711842B2 (ja) * | 2000-06-01 | 2005-11-02 | ソニーケミカル株式会社 | 異方性導電接続材料及び接続構造体 |
US6670017B2 (en) | 2000-12-14 | 2003-12-30 | 3M Innovative Properties Company | Photocurable form-in-place gasket for electronic applications |
US20040094264A1 (en) * | 2001-01-30 | 2004-05-20 | Hiroaki Yamaguchi | Method for adhering substrates using light activatable adhesive film |
US20040131844A1 (en) * | 2001-05-08 | 2004-07-08 | Kotaro Shinozaki | Sealant composition, sealant and laminated structure containing same |
US7053133B2 (en) * | 2001-05-29 | 2006-05-30 | Hiroaki Yamaguchi | Ultraviolet activatable adhesive film |
US6955739B2 (en) * | 2001-06-19 | 2005-10-18 | 3M Innovative Properties Company | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
US6624213B2 (en) * | 2001-11-08 | 2003-09-23 | 3M Innovative Properties Company | High temperature epoxy adhesive films |
US6749887B1 (en) * | 2001-11-28 | 2004-06-15 | Lifescan, Inc. | Solution drying system |
JP2003238925A (ja) * | 2002-02-19 | 2003-08-27 | Hitachi Chem Co Ltd | 接着剤組成物、接着フィルム |
US20050256230A1 (en) * | 2002-04-01 | 2005-11-17 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
US6720195B2 (en) * | 2002-05-15 | 2004-04-13 | Micron Technology, Inc. | Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture |
US6936644B2 (en) * | 2002-10-16 | 2005-08-30 | Cookson Electronics, Inc. | Releasable microcapsule and adhesive curing system using the same |
JP4644492B2 (ja) | 2002-11-15 | 2011-03-02 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 電子デバイスの二次加工に保護層を用いる方法 |
US20040170925A1 (en) * | 2002-12-06 | 2004-09-02 | Roach David Herbert | Positive imageable thick film compositions |
US20040197571A1 (en) * | 2003-04-03 | 2004-10-07 | Yuji Hiroshige | Thermosetting composition, and sealing article and sealing structure using the same |
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US7332540B2 (en) | 2004-02-18 | 2008-02-19 | Eastman Chemical Company | Aromatic-acrylate tackifier resins |
DE102004031189A1 (de) * | 2004-06-28 | 2006-01-19 | Tesa Ag | Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
DE102004031190A1 (de) * | 2004-06-28 | 2006-01-19 | Tesa Ag | Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
US20070165075A1 (en) * | 2006-01-19 | 2007-07-19 | 3M Innovative Properties Company | Flexible circuits having ink-resistant covercoats |
JP2007335836A (ja) * | 2006-05-19 | 2007-12-27 | Hitachi Chem Co Ltd | ダイボンディング用樹脂ペーストの硬化方法及びダイボンディング方法 |
JP2008010821A (ja) * | 2006-06-01 | 2008-01-17 | Hitachi Chem Co Ltd | ダイボンディング用樹脂フィルムの硬化方法及びダイボンディング方法 |
DE102008047964A1 (de) * | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
CN101781443B (zh) * | 2009-01-20 | 2012-03-28 | 财团法人工业技术研究院 | 热硬化型防焊膜组合物 |
DE102009036968A1 (de) * | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
US8173745B2 (en) * | 2009-12-16 | 2012-05-08 | Momentive Specialty Chemicals Inc. | Compositions useful for preparing composites and composites produced therewith |
CN102516437B (zh) * | 2011-12-14 | 2014-05-21 | 浙江大学宁波理工学院 | 一种聚苯乙烯系功能微球的制备方法 |
CN102516717B (zh) * | 2011-12-22 | 2014-07-09 | 云南云岭高速公路养护绿化工程有限公司 | 热塑性弹性体增韧环氧树脂、制备及应用 |
JP2015528756A (ja) * | 2012-06-28 | 2015-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性基板物品 |
EP2759514A1 (de) | 2013-01-29 | 2014-07-30 | tesa SE | Haftklebemasse enthaltend ein verbundenes Nanopartikelnetzwerk, Verfahren zu ihrer Herstellung sowie die Verwendung derselben |
KR20160088512A (ko) * | 2015-01-15 | 2016-07-26 | 삼성디스플레이 주식회사 | 전자기기 및 전자기기의 본딩 방법 |
EP3091059B1 (de) | 2015-05-05 | 2020-09-09 | tesa SE | Klebeband mit klebemasse mit kontinuierlicher polymerphase |
DE102015217860A1 (de) | 2015-05-05 | 2016-11-10 | Tesa Se | Klebeband mit Klebemasse mit kontinuierlicher Polymerphase |
DE102016220237A1 (de) | 2016-10-17 | 2018-04-19 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
DE102017221072A1 (de) | 2017-11-24 | 2019-05-29 | Tesa Se | Verfahren zur Herstellung haftklebriger Reaktivklebebänder |
KR102213775B1 (ko) * | 2018-02-28 | 2021-02-05 | 주식회사 엘지화학 | 반도체 몰딩용 에폭시 수지 조성물, 몰딩 필름 및 반도체 패키지 |
DE102018213824A1 (de) | 2018-08-16 | 2020-02-20 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
CN111253702B (zh) | 2020-03-30 | 2023-06-06 | 广东生益科技股份有限公司 | 一种树脂组合物及使用其的预浸料和电路材料 |
DE102022113506A1 (de) | 2022-05-30 | 2023-11-30 | Tesa Se | Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten |
WO2024165398A1 (en) * | 2023-02-06 | 2024-08-15 | Sicpa Holding Sa | Epoxy-based uv-vis-curable encapsulant compositions |
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JPH08245939A (ja) | 1995-03-13 | 1996-09-24 | Daicel Chem Ind Ltd | ホットメルト接着剤 |
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KR100499992B1 (ko) | 1996-08-26 | 2005-07-12 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | 플루오로 중합체와 에폭시 수지를 포함하는 반 상호 침투성 네트워크 조성물 |
EP0878505A4 (en) | 1996-11-22 | 2000-05-03 | Daicel Chem | HOT MELT COMPOSITIONS AND MULTILAYERED OBJECTS CONTAINING LAYERS MADE THEREOF |
EP1005509B1 (en) | 1997-08-19 | 2002-01-16 | Minnesota Mining And Manufacturing Company | Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
JP3893422B2 (ja) | 1997-09-29 | 2007-03-14 | 新日本石油株式会社 | 電気電子素子封止用樹脂組成物 |
JPH11148064A (ja) | 1997-11-17 | 1999-06-02 | Sekisui Chem Co Ltd | 反応性ホットメルト接着剤組成物及び接着方法 |
-
1998
- 1998-12-23 US US09/219,265 patent/US6294270B1/en not_active Expired - Fee Related
-
1999
- 1999-09-16 KR KR1020017008087A patent/KR100773789B1/ko not_active IP Right Cessation
- 1999-09-16 EP EP99949723A patent/EP1141073A1/en not_active Withdrawn
- 1999-09-16 WO PCT/US1999/021592 patent/WO2000039189A1/en not_active Application Discontinuation
- 1999-09-16 AU AU62541/99A patent/AU6254199A/en not_active Withdrawn
- 1999-09-16 JP JP2000591099A patent/JP2003504425A/ja active Pending
- 1999-09-16 CN CNB998148989A patent/CN1144831C/zh not_active Expired - Fee Related
- 1999-12-08 MY MYPI99005341A patent/MY121445A/en unknown
-
2001
- 2001-07-27 US US09/917,543 patent/US6423367B2/en not_active Expired - Fee Related
-
2002
- 2002-03-18 HK HK02102071.6A patent/HK1043137A1/zh unknown
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