JPH11116045A5 - - Google Patents

Info

Publication number
JPH11116045A5
JPH11116045A5 JP1997285290A JP28529097A JPH11116045A5 JP H11116045 A5 JPH11116045 A5 JP H11116045A5 JP 1997285290 A JP1997285290 A JP 1997285290A JP 28529097 A JP28529097 A JP 28529097A JP H11116045 A5 JPH11116045 A5 JP H11116045A5
Authority
JP
Japan
Prior art keywords
wafer
cassette
detecting
sensor
transport device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997285290A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11116045A (ja
JP4253365B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP28529097A external-priority patent/JP4253365B2/ja
Priority to JP28529097A priority Critical patent/JP4253365B2/ja
Priority to PCT/JP1998/004617 priority patent/WO1999020552A1/ja
Priority to KR1019997005304A priority patent/KR100322921B1/ko
Priority to US09/319,615 priority patent/US6208909B1/en
Priority to CNB988015455A priority patent/CN1150119C/zh
Publication of JPH11116045A publication Critical patent/JPH11116045A/ja
Publication of JPH11116045A5 publication Critical patent/JPH11116045A5/ja
Publication of JP4253365B2 publication Critical patent/JP4253365B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP28529097A 1997-10-17 1997-10-17 ウェハ搬送装置 Expired - Lifetime JP4253365B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP28529097A JP4253365B2 (ja) 1997-10-17 1997-10-17 ウェハ搬送装置
CNB988015455A CN1150119C (zh) 1997-10-17 1998-10-13 晶片搬运装置
KR1019997005304A KR100322921B1 (ko) 1997-10-17 1998-10-13 웨이퍼 반송 장치
US09/319,615 US6208909B1 (en) 1997-10-17 1998-10-13 Wafer transport device
PCT/JP1998/004617 WO1999020552A1 (en) 1997-10-17 1998-10-13 Wafer transport device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28529097A JP4253365B2 (ja) 1997-10-17 1997-10-17 ウェハ搬送装置

Publications (3)

Publication Number Publication Date
JPH11116045A JPH11116045A (ja) 1999-04-27
JPH11116045A5 true JPH11116045A5 (enExample) 2005-06-30
JP4253365B2 JP4253365B2 (ja) 2009-04-08

Family

ID=17689614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28529097A Expired - Lifetime JP4253365B2 (ja) 1997-10-17 1997-10-17 ウェハ搬送装置

Country Status (5)

Country Link
US (1) US6208909B1 (enExample)
JP (1) JP4253365B2 (enExample)
KR (1) KR100322921B1 (enExample)
CN (1) CN1150119C (enExample)
WO (1) WO1999020552A1 (enExample)

Families Citing this family (34)

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Publication number Priority date Publication date Assignee Title
US6483102B1 (en) * 2000-07-18 2002-11-19 Advanced Micro Devices, Inc. Method and apparatus for inspection of misplaced integrated circuits in a tray stack
US6591162B1 (en) * 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
US6905300B1 (en) * 2004-01-16 2005-06-14 Dmetrix, Inc. Slide feeder with air bearing conveyor
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
JP2006074004A (ja) * 2004-08-02 2006-03-16 Disco Abrasive Syst Ltd ワーク搬送収納装置，およびそのワーク搬送収納装置を備えた切削装置
CN101044074B (zh) * 2004-08-19 2014-04-02 布鲁克斯自动化公司 容量减小的运载器和使用方法
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
US20070029227A1 (en) 2005-07-08 2007-02-08 Bonora Anthony C Workpiece support structures and apparatus for accessing same
DE502006003294D1 (de) * 2005-11-17 2009-05-07 Oc Oerlikon Balzers Ag Transportvorrichtung für scheibenförmige werkstücke
DE102007042138A1 (de) 2007-09-05 2009-03-12 Carl Zeiss Microimaging Gmbh Verfahren und Einrichtung zur automatischen Probenzuführung
CN101431040B (zh) * 2007-11-07 2011-11-09 沈阳芯源微电子设备有限公司 提升器结构
US20090175707A1 (en) * 2008-01-03 2009-07-09 Bonora Anthony C Controlled deflection of large area semiconductor substrates for shipping and manufacturing containers
DE102010018465B4 (de) 2010-04-27 2020-02-06 Centrotherm Photovoltaics Ag Vorrichtung und Verfahren zum Ermitteln der räumlichen Lage von Plattenelementen eines Waferbootes sowie Beladevorrichtung und Verfahren zum Be- und/oder Entladen eines solchen Waferbootes
JP5447431B2 (ja) * 2011-05-09 2014-03-19 株式会社安川電機 ロボットシステム
JP6033009B2 (ja) * 2012-09-04 2016-11-30 株式会社ミマキエンジニアリング 格納制御装置、印刷装置、プログラム及び記録媒体
JP5935676B2 (ja) * 2012-12-07 2016-06-15 東京エレクトロン株式会社 基板処理装置、基板装置の運用方法及び記憶媒体
JP6098217B2 (ja) * 2013-02-20 2017-03-22 株式会社村田製作所 回路基板およびその製造方法
JP6360762B2 (ja) * 2014-09-26 2018-07-18 株式会社ディスコ 加工装置
KR101771391B1 (ko) * 2016-01-19 2017-08-25 로체 시스템즈(주) 이송로봇 티칭장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
KR101970780B1 (ko) * 2017-04-13 2019-04-22 삼성디스플레이 주식회사 기판 처리 시스템 및 기판 반송 방법
JP7126809B2 (ja) * 2017-04-13 2022-08-29 浜松ホトニクス株式会社 画像取得装置及び画像取得方法
US11031266B2 (en) * 2018-07-16 2021-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer handling equipment and method thereof
CN110265324A (zh) * 2019-06-03 2019-09-20 福建省福联集成电路有限公司 一种晶圆检测装置
CN110379735B (zh) * 2019-06-28 2021-10-26 福建省福联集成电路有限公司 一种晶圆斜插检测装置
JP7324667B2 (ja) * 2019-09-20 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN110767563B (zh) * 2019-10-25 2022-05-27 上海华力集成电路制造有限公司 检测晶圆完整性的方法、rtp机台
CN111180378B (zh) * 2019-12-31 2023-12-29 中芯集成电路（宁波）有限公司 一种检测晶舟内晶圆斜插的方法及装置
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
CN115101430B (zh) * 2021-12-22 2022-12-27 沈阳新松机器人自动化股份有限公司 一种多尺寸晶圆兼容开盒器的检测方法
CN115848775A (zh) * 2022-11-21 2023-03-28 魅杰光电科技(上海)有限公司 承载模块

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018288A (ja) * 1983-07-11 1985-01-30 Nippon Steel Corp レ−ザ加工装置のモニタ−リング方法
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
JPS6245036A (ja) * 1985-08-23 1987-02-27 Canon Inc ウエハ処理装置
JPH07115773B2 (ja) * 1986-01-29 1995-12-13 株式会社ニコン 基板搬送装置
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
JPH06244268A (ja) * 1993-02-16 1994-09-02 Tokyo Electron Tohoku Ltd 移載装置
US5642978A (en) * 1993-03-29 1997-07-01 Jenoptik Gmbh Device for handling disk-shaped objects in a handling plane of a local clean room
JPH07297264A (ja) * 1994-04-22 1995-11-10 Toshiba Corp ウェハ位置検出装置
JPH08213447A (ja) * 1995-02-06 1996-08-20 Tokyo Electron Ltd 被移載体の検出装置
KR100315007B1 (ko) * 1995-11-22 2002-02-28 이시다 아키라 카세트내의 기판 검출 및 반송장치와 그 방법
US6060721A (en) * 1998-05-06 2000-05-09 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for detecting correct positioning of a wafer cassette

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