JP7192682B2 - 検査システム - Google Patents
検査システム Download PDFInfo
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- JP7192682B2 JP7192682B2 JP2019124590A JP2019124590A JP7192682B2 JP 7192682 B2 JP7192682 B2 JP 7192682B2 JP 2019124590 A JP2019124590 A JP 2019124590A JP 2019124590 A JP2019124590 A JP 2019124590A JP 7192682 B2 JP7192682 B2 JP 7192682B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0457—Storage devices mechanical with suspended load carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/04—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack
- B66C13/08—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack for depositing loads in desired attitudes or positions
- B66C13/085—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack for depositing loads in desired attitudes or positions electrical
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C1/00—Measuring angles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Warehouses Or Storage Devices (AREA)
Description
前記昇降部は、基準面を有し、前記検出部は、第1撮像装置と第2撮像装置とを備え、前記昇降部が規定の設定昇降位置にある状態における前記基準面の位置を設定基準面位置として、前記第1撮像装置の光軸である第1光軸と前記第2撮像装置の光軸である第2光軸とが交差する交点が、前記設定基準面位置に対応する位置となり、且つ、前記第1光軸及び前記第2光軸が前記基準面に沿う方向となるように、前記第1撮像装置及び前記第2撮像装置が設置され、前記検出部は、前記第1撮像装置及び前記第2撮像装置によって撮像された前記基準面の画像に基づいて、前記昇降部の傾斜方向及び傾斜角度を検出する点にある。
検査システムを備えた物品搬送設備の実施形態について図面に基づいて説明する。図1に示すように、物品搬送設備には、天井近くを走行経路Lに沿って走行して物品としての容器Wを搬送する物品搬送車1と、容器Wに収容されている基板に対して処理を行う処理装置2と、その処理装置2に隣接する状態で床面上に設置された搬送対象箇所としての支持台3と、検査システム4と、が設けられている。尚、本実施形態では、半導体基板を収容するFOUP(Front Opening Unified Pod)を容器W(物品)としている。
次に、この検査システム4のその他の実施形態について説明する。
以下、上記において説明した検査システムの概要について説明する。
前記昇降部は、基準面を有し、前記検出部は、第1撮像装置と第2撮像装置とを備え、前記昇降部が規定の設定昇降位置にある状態における前記基準面の位置を設定基準面位置として、前記第1撮像装置の光軸である第1光軸と前記第2撮像装置の光軸である第2光軸とが交差する交点が、前記設定基準面位置に対応する位置となり、且つ、前記第1光軸及び前記第2光軸が前記基準面に沿う方向となるように、前記第1撮像装置及び前記第2撮像装置が設置され、前記検出部は、前記第1撮像装置及び前記第2撮像装置によって撮像された前記基準面の画像に基づいて、前記昇降部の傾斜方向及び傾斜角度を検出する。
4:検査システム
7:昇降部
22:検出部
23:第1撮像装置
24:第2撮像装置
25:第1投光装置
26:第2投光装置
28:第3投光装置
E:エッジ
F:基準面
L1:第1光軸
L2:第2光軸
P:交点
V:設定基準面位置
X:延在方向(第1方向)
Y:幅方向(第2方向)
Claims (5)
- 物品搬送車が昇降自在に備える昇降部の傾斜状態を検出する検出部を備えた検査システムであって、
前記昇降部は、基準面を有し、
前記検出部は、第1撮像装置と第2撮像装置とを備え、
前記昇降部が規定の設定昇降位置にある状態における前記基準面の位置を設定基準面位置として、
前記第1撮像装置の光軸である第1光軸と前記第2撮像装置の光軸である第2光軸とが交差する交点が、前記設定基準面位置に対応する位置となり、且つ、前記第1光軸及び前記第2光軸が前記基準面に沿う方向となるように、前記第1撮像装置及び前記第2撮像装置が設置され、
前記検出部は、前記第1撮像装置及び前記第2撮像装置によって撮像された前記基準面の画像に基づいて、前記昇降部の傾斜方向及び傾斜角度を検出する、検査システム。 - 前記検出部は、前記第1撮像装置によって撮像された第1画像に含まれる前記基準面のエッジの傾きに基づいて、前記第1光軸に直交する方向である第1方向における前記昇降部の傾斜角度を検出し、前記第2撮像装置によって撮像された第2画像に含まれる前記基準面のエッジの傾きに基づいて、前記第2光軸に直交する方向である第2方向における前記昇降部の傾斜角度を検出する、請求項1に記載の検査システム。
- 前記第1撮像装置に対向する側から前記交点に向けて投光する第1投光装置と、前記第2撮像装置に対向する側から前記交点に向けて投光する第2投光装置と、を更に備える、請求項1又は2に記載の検査システム。
- 前記基準面に対向する側から投光する第3投光装置を更に備える、請求項1又は2に記載の検査システム。
- 前記第1撮像装置及び前記第2撮像装置は、前記第1光軸と前記第2光軸とが直交するように設置されている、請求項1から4のいずれか一項に記載の検査システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019124590A JP7192682B2 (ja) | 2019-07-03 | 2019-07-03 | 検査システム |
TW109118685A TWI851732B (zh) | 2019-07-03 | 2020-06-03 | 檢查系統 |
KR1020200079247A KR20210004850A (ko) | 2019-07-03 | 2020-06-29 | 검사 시스템 |
CN202010631361.1A CN112179316A (zh) | 2019-07-03 | 2020-07-03 | 检查系统 |
Applications Claiming Priority (1)
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JP2019124590A JP7192682B2 (ja) | 2019-07-03 | 2019-07-03 | 検査システム |
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JP2021011326A JP2021011326A (ja) | 2021-02-04 |
JP7192682B2 true JP7192682B2 (ja) | 2022-12-20 |
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JP2019124590A Active JP7192682B2 (ja) | 2019-07-03 | 2019-07-03 | 検査システム |
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JP (1) | JP7192682B2 (ja) |
KR (1) | KR20210004850A (ja) |
CN (1) | CN112179316A (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010164335A (ja) | 2009-01-13 | 2010-07-29 | Mitsutoyo Corp | プローブのアライメント調整方法および形状測定機 |
US20160016763A1 (en) | 2014-07-16 | 2016-01-21 | Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C. | Control device using image tracking technology for controlling overhead crane system |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10337344A (ja) * | 1997-06-09 | 1998-12-22 | Fuitsuto:Kk | ゴルフクラブのライ角・ロフト角測定方法およびその装置ならびにその測定手順を実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体 |
JP4328333B2 (ja) * | 2006-03-13 | 2009-09-09 | 東洋ガラス株式会社 | ガラス瓶検査装置 |
JP5294427B2 (ja) * | 2010-09-27 | 2013-09-18 | 東洋ガラス株式会社 | ガラスびん検査装置 |
JP2014003312A (ja) * | 2013-08-05 | 2014-01-09 | Nikon Corp | 基板接合装置および基板接合方法 |
JP6206088B2 (ja) * | 2013-10-28 | 2017-10-04 | 村田機械株式会社 | 教示システム |
JP6119699B2 (ja) * | 2014-08-27 | 2017-04-26 | 村田機械株式会社 | 移載位置決定方法 |
JP6641926B2 (ja) * | 2015-11-26 | 2020-02-05 | 株式会社ダイフク | 物品搬送設備 |
-
2019
- 2019-07-03 JP JP2019124590A patent/JP7192682B2/ja active Active
-
2020
- 2020-06-29 KR KR1020200079247A patent/KR20210004850A/ko active Search and Examination
- 2020-07-03 CN CN202010631361.1A patent/CN112179316A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010164335A (ja) | 2009-01-13 | 2010-07-29 | Mitsutoyo Corp | プローブのアライメント調整方法および形状測定機 |
US20160016763A1 (en) | 2014-07-16 | 2016-01-21 | Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C. | Control device using image tracking technology for controlling overhead crane system |
Also Published As
Publication number | Publication date |
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TW202104840A (zh) | 2021-02-01 |
CN112179316A (zh) | 2021-01-05 |
KR20210004850A (ko) | 2021-01-13 |
JP2021011326A (ja) | 2021-02-04 |
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