CN1150119C - 晶片搬运装置 - Google Patents

晶片搬运装置 Download PDF

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Publication number
CN1150119C
CN1150119C CNB988015455A CN98801545A CN1150119C CN 1150119 C CN1150119 C CN 1150119C CN B988015455 A CNB988015455 A CN B988015455A CN 98801545 A CN98801545 A CN 98801545A CN 1150119 C CN1150119 C CN 1150119C
Authority
CN
China
Prior art keywords
wafer
mentioned
deflection
arm
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB988015455A
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English (en)
Chinese (zh)
Other versions
CN1242753A (zh
Inventor
加藤智生
木村桂司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Publication of CN1242753A publication Critical patent/CN1242753A/zh
Application granted granted Critical
Publication of CN1150119C publication Critical patent/CN1150119C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB988015455A 1997-10-17 1998-10-13 晶片搬运装置 Expired - Fee Related CN1150119C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28529097A JP4253365B2 (ja) 1997-10-17 1997-10-17 ウェハ搬送装置
JP285290/1997 1997-10-17
PCT/JP1998/004617 WO1999020552A1 (en) 1997-10-17 1998-10-13 Wafer transport device

Publications (2)

Publication Number Publication Date
CN1242753A CN1242753A (zh) 2000-01-26
CN1150119C true CN1150119C (zh) 2004-05-19

Family

ID=17689614

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988015455A Expired - Fee Related CN1150119C (zh) 1997-10-17 1998-10-13 晶片搬运装置

Country Status (5)

Country Link
US (1) US6208909B1 (enExample)
JP (1) JP4253365B2 (enExample)
KR (1) KR100322921B1 (enExample)
CN (1) CN1150119C (enExample)
WO (1) WO1999020552A1 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483102B1 (en) * 2000-07-18 2002-11-19 Advanced Micro Devices, Inc. Method and apparatus for inspection of misplaced integrated circuits in a tray stack
US6591162B1 (en) 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
US6905300B1 (en) * 2004-01-16 2005-06-14 Dmetrix, Inc. Slide feeder with air bearing conveyor
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
JP2006074004A (ja) * 2004-08-02 2006-03-16 Disco Abrasive Syst Ltd ワーク搬送収納装置，およびそのワーク搬送収納装置を備えた切削装置
WO2006023838A2 (en) * 2004-08-19 2006-03-02 Brooks Automation, Inc. Reduced capacity carrier and method of use
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
JP5155517B2 (ja) 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
EP1902465A2 (en) 2005-07-08 2008-03-26 Asyst Technologies, Inc. Workpiece support structures and apparatus for accessing same
CN101310377B (zh) * 2005-11-17 2010-11-17 Oc欧瑞康巴尔斯公司 用于盘形的工件的输送装置
DE102007042138A1 (de) 2007-09-05 2009-03-12 Carl Zeiss Microimaging Gmbh Verfahren und Einrichtung zur automatischen Probenzuführung
CN101431040B (zh) * 2007-11-07 2011-11-09 沈阳芯源微电子设备有限公司 提升器结构
US20090175707A1 (en) * 2008-01-03 2009-07-09 Bonora Anthony C Controlled deflection of large area semiconductor substrates for shipping and manufacturing containers
DE102010018465B4 (de) * 2010-04-27 2020-02-06 Centrotherm Photovoltaics Ag Vorrichtung und Verfahren zum Ermitteln der räumlichen Lage von Plattenelementen eines Waferbootes sowie Beladevorrichtung und Verfahren zum Be- und/oder Entladen eines solchen Waferbootes
JP5447431B2 (ja) * 2011-05-09 2014-03-19 株式会社安川電機 ロボットシステム
JP6033009B2 (ja) * 2012-09-04 2016-11-30 株式会社ミマキエンジニアリング 格納制御装置、印刷装置、プログラム及び記録媒体
JP5935676B2 (ja) * 2012-12-07 2016-06-15 東京エレクトロン株式会社 基板処理装置、基板装置の運用方法及び記憶媒体
JP6098217B2 (ja) * 2013-02-20 2017-03-22 株式会社村田製作所 回路基板およびその製造方法
JP6360762B2 (ja) * 2014-09-26 2018-07-18 株式会社ディスコ 加工装置
KR101771391B1 (ko) * 2016-01-19 2017-08-25 로체 시스템즈(주) 이송로봇 티칭장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
KR101970780B1 (ko) * 2017-04-13 2019-04-22 삼성디스플레이 주식회사 기판 처리 시스템 및 기판 반송 방법
JP7126809B2 (ja) * 2017-04-13 2022-08-29 浜松ホトニクス株式会社 画像取得装置及び画像取得方法
US11031266B2 (en) * 2018-07-16 2021-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer handling equipment and method thereof
CN110265324A (zh) * 2019-06-03 2019-09-20 福建省福联集成电路有限公司 一种晶圆检测装置
CN110379735B (zh) * 2019-06-28 2021-10-26 福建省福联集成电路有限公司 一种晶圆斜插检测装置
JP7324667B2 (ja) * 2019-09-20 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN110767563B (zh) * 2019-10-25 2022-05-27 上海华力集成电路制造有限公司 检测晶圆完整性的方法、rtp机台
CN111180378B (zh) * 2019-12-31 2023-12-29 中芯集成电路（宁波）有限公司 一种检测晶舟内晶圆斜插的方法及装置
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
CN115101430B (zh) * 2021-12-22 2022-12-27 沈阳新松机器人自动化股份有限公司 一种多尺寸晶圆兼容开盒器的检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245036B2 (enExample) * 1983-07-11 1987-09-24 Nippon Steel Corp

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
JPS6245036A (ja) 1985-08-23 1987-02-27 Canon Inc ウエハ処理装置
JPH07115773B2 (ja) * 1986-01-29 1995-12-13 株式会社ニコン 基板搬送装置
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
JP2868645B2 (ja) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 ウエハ搬送装置、ウエハの傾き検出方法、およびウエハの検出方法
JPH06244268A (ja) * 1993-02-16 1994-09-02 Tokyo Electron Tohoku Ltd 移載装置
US5642978A (en) * 1993-03-29 1997-07-01 Jenoptik Gmbh Device for handling disk-shaped objects in a handling plane of a local clean room
JPH07297264A (ja) 1994-04-22 1995-11-10 Toshiba Corp ウェハ位置検出装置
JPH08213447A (ja) * 1995-02-06 1996-08-20 Tokyo Electron Ltd 被移載体の検出装置
KR100315007B1 (ko) * 1995-11-22 2002-02-28 이시다 아키라 카세트내의 기판 검출 및 반송장치와 그 방법
US6060721A (en) * 1998-05-06 2000-05-09 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for detecting correct positioning of a wafer cassette

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245036B2 (enExample) * 1983-07-11 1987-09-24 Nippon Steel Corp

Also Published As

Publication number Publication date
WO1999020552A8 (en) 1999-07-01
US6208909B1 (en) 2001-03-27
JP4253365B2 (ja) 2009-04-08
KR20000069466A (ko) 2000-11-25
CN1242753A (zh) 2000-01-26
KR100322921B1 (ko) 2002-02-09
JPH11116045A (ja) 1999-04-27
WO1999020552A1 (en) 1999-04-29

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: OLYMPUS CO., LTD.

Free format text: FORMER NAME OR ADDRESS: OLYMPUS OPTICAL CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: OLYMPUS Corp.

Address before: Tokyo, Japan

Patentee before: Olympus Optical Co.,Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040519

Termination date: 20121013