JPH10307388A - 感放射線性樹脂組成物 - Google Patents

感放射線性樹脂組成物

Info

Publication number
JPH10307388A
JPH10307388A JP11584697A JP11584697A JPH10307388A JP H10307388 A JPH10307388 A JP H10307388A JP 11584697 A JP11584697 A JP 11584697A JP 11584697 A JP11584697 A JP 11584697A JP H10307388 A JPH10307388 A JP H10307388A
Authority
JP
Japan
Prior art keywords
radiation
naphthoquinonediazide
sulfonic acid
resin composition
acid ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11584697A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10307388A5 (enrdf_load_stackoverflow
Inventor
Shoji Ogasawara
昭二 小笠原
Masamutsu Suzuki
正睦 鈴木
Isao Nishimura
功 西村
Masayuki Endo
昌之 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP11584697A priority Critical patent/JPH10307388A/ja
Publication of JPH10307388A publication Critical patent/JPH10307388A/ja
Publication of JPH10307388A5 publication Critical patent/JPH10307388A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Polymerisation Methods In General (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP11584697A 1997-05-06 1997-05-06 感放射線性樹脂組成物 Pending JPH10307388A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11584697A JPH10307388A (ja) 1997-05-06 1997-05-06 感放射線性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11584697A JPH10307388A (ja) 1997-05-06 1997-05-06 感放射線性樹脂組成物

Publications (2)

Publication Number Publication Date
JPH10307388A true JPH10307388A (ja) 1998-11-17
JPH10307388A5 JPH10307388A5 (enrdf_load_stackoverflow) 2004-10-07

Family

ID=14672592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11584697A Pending JPH10307388A (ja) 1997-05-06 1997-05-06 感放射線性樹脂組成物

Country Status (1)

Country Link
JP (1) JPH10307388A (enrdf_load_stackoverflow)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000039639A1 (fr) * 1998-12-25 2000-07-06 Clariant International Ltd. Composition de resine photosensible
WO2001004213A1 (fr) * 1999-06-30 2001-01-18 Nippon Zeon Co., Ltd. Composition durcissable, article associe et produit stratifie
JP2002040644A (ja) * 2000-07-27 2002-02-06 Jsr Corp 感放射線性樹脂組成物および有機ｅｌ素子の絶縁膜
JP2002169277A (ja) * 2000-12-05 2002-06-14 Jsr Corp 有機ｅｌ表示素子の絶縁膜形成用感放射線性樹脂組成物、それから形成された絶縁膜、および有機ｅｌ表示素子
WO2003056391A1 (fr) * 2001-12-27 2003-07-10 Zeon Corporation Composition de resine radiosensible et procede de formation de motifs
WO2003100524A1 (fr) * 2002-05-27 2003-12-04 Zeon Corporation Composition de resine sensible au rayonnement, procede de production d'un substrat comprenant couche de resine a motifs, et utilisation de la composition de resine
WO2004029720A1 (ja) * 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用
JP2005089651A (ja) * 2003-09-18 2005-04-07 Jsr Corp 硬化性組成物、その硬化物及び積層体
WO2005096100A1 (ja) * 2004-03-31 2005-10-13 Zeon Corporation 感放射線組成物、積層体及びその製造方法並びに電子部品
JP2005292276A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
WO2005098539A1 (ja) * 2004-03-31 2005-10-20 Zeon Corporation 感放射線組成物、積層体及びその製造方法並びに電子部品
JP2006098984A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
JP2006098807A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP2006106214A (ja) * 2004-10-01 2006-04-20 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
WO2006129875A1 (ja) * 2005-06-01 2006-12-07 Zeon Corporation 感放射線性樹脂組成物、積層体及びその製造方法
JP2007264616A (ja) * 2006-03-01 2007-10-11 Nippon Zeon Co Ltd 感放射線性樹脂組成物、積層体及びその製造方法
JP2008257263A (ja) * 2008-05-19 2008-10-23 Hitachi Chem Co Ltd 感光性重合体組成物、パターンの製造法及び電子部品
US7575846B2 (en) 2003-01-31 2009-08-18 Mitsubishi Rayon Co., Ltd. Resist polymer and resist composition
US7820355B2 (en) 2002-11-29 2010-10-26 Zeon Corporation Radiation sensitive resin composition
KR101359201B1 (ko) * 2006-03-01 2014-02-05 니폰 제온 가부시키가이샤 감방사선성 수지 조성물, 적층체 및 그의 제조방법

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000039639A1 (fr) * 1998-12-25 2000-07-06 Clariant International Ltd. Composition de resine photosensible
WO2001004213A1 (fr) * 1999-06-30 2001-01-18 Nippon Zeon Co., Ltd. Composition durcissable, article associe et produit stratifie
JP2002040644A (ja) * 2000-07-27 2002-02-06 Jsr Corp 感放射線性樹脂組成物および有機ｅｌ素子の絶縁膜
JP2002169277A (ja) * 2000-12-05 2002-06-14 Jsr Corp 有機ｅｌ表示素子の絶縁膜形成用感放射線性樹脂組成物、それから形成された絶縁膜、および有機ｅｌ表示素子
WO2003056391A1 (fr) * 2001-12-27 2003-07-10 Zeon Corporation Composition de resine radiosensible et procede de formation de motifs
KR100907820B1 (ko) 2001-12-27 2009-07-14 니폰 제온 가부시키가이샤 방사선-감수성 수지 조성물 및 패턴 형성 방법
WO2003100524A1 (fr) * 2002-05-27 2003-12-04 Zeon Corporation Composition de resine sensible au rayonnement, procede de production d'un substrat comprenant couche de resine a motifs, et utilisation de la composition de resine
WO2004029720A1 (ja) * 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用
KR101003211B1 (ko) 2002-09-30 2010-12-21 니폰 제온 가부시키가이샤 감방사선성 수지 조성물, 및 수지 패턴막과 그것의 형성 방법
CN100346229C (zh) * 2002-09-30 2007-10-31 日本瑞翁株式会社 放射线敏感性树脂组合物、树脂图案膜及其形成方法以及树脂图案膜的应用
US7820355B2 (en) 2002-11-29 2010-10-26 Zeon Corporation Radiation sensitive resin composition
US7575846B2 (en) 2003-01-31 2009-08-18 Mitsubishi Rayon Co., Ltd. Resist polymer and resist composition
JP2005089651A (ja) * 2003-09-18 2005-04-07 Jsr Corp 硬化性組成物、その硬化物及び積層体
WO2005098539A1 (ja) * 2004-03-31 2005-10-20 Zeon Corporation 感放射線組成物、積層体及びその製造方法並びに電子部品
JP2005292276A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
WO2005096100A1 (ja) * 2004-03-31 2005-10-13 Zeon Corporation 感放射線組成物、積層体及びその製造方法並びに電子部品
JP2006098807A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP2006098984A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
JP2006106214A (ja) * 2004-10-01 2006-04-20 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
WO2006129875A1 (ja) * 2005-06-01 2006-12-07 Zeon Corporation 感放射線性樹脂組成物、積層体及びその製造方法
JP2007264616A (ja) * 2006-03-01 2007-10-11 Nippon Zeon Co Ltd 感放射線性樹脂組成物、積層体及びその製造方法
KR101359201B1 (ko) * 2006-03-01 2014-02-05 니폰 제온 가부시키가이샤 감방사선성 수지 조성물, 적층체 및 그의 제조방법
JP2008257263A (ja) * 2008-05-19 2008-10-23 Hitachi Chem Co Ltd 感光性重合体組成物、パターンの製造法及び電子部品

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