JPH10294288A5 - - Google Patents

Info

Publication number
JPH10294288A5
JPH10294288A5 JP1997115275A JP11527597A JPH10294288A5 JP H10294288 A5 JPH10294288 A5 JP H10294288A5 JP 1997115275 A JP1997115275 A JP 1997115275A JP 11527597 A JP11527597 A JP 11527597A JP H10294288 A5 JPH10294288 A5 JP H10294288A5
Authority
JP
Japan
Prior art keywords
parallelogram
cylindrical lens
laser beam
laser
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997115275A
Other languages
English (en)
Japanese (ja)
Other versions
JP4086932B2 (ja
JPH10294288A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11527597A priority Critical patent/JP4086932B2/ja
Priority claimed from JP11527597A external-priority patent/JP4086932B2/ja
Priority to US09/061,488 priority patent/US6176926B1/en
Publication of JPH10294288A publication Critical patent/JPH10294288A/ja
Priority to US09/680,552 priority patent/US6471772B1/en
Publication of JPH10294288A5 publication Critical patent/JPH10294288A5/ja
Application granted granted Critical
Publication of JP4086932B2 publication Critical patent/JP4086932B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP11527597A 1997-04-17 1997-04-17 レーザー照射装置及びレーザー処理方法 Expired - Fee Related JP4086932B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11527597A JP4086932B2 (ja) 1997-04-17 1997-04-17 レーザー照射装置及びレーザー処理方法
US09/061,488 US6176926B1 (en) 1997-04-17 1998-04-16 Laser processing method
US09/680,552 US6471772B1 (en) 1997-04-17 2000-10-05 Laser processing apparatus and laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11527597A JP4086932B2 (ja) 1997-04-17 1997-04-17 レーザー照射装置及びレーザー処理方法

Publications (3)

Publication Number Publication Date
JPH10294288A JPH10294288A (ja) 1998-11-04
JPH10294288A5 true JPH10294288A5 (enExample) 2005-03-10
JP4086932B2 JP4086932B2 (ja) 2008-05-14

Family

ID=14658635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11527597A Expired - Fee Related JP4086932B2 (ja) 1997-04-17 1997-04-17 レーザー照射装置及びレーザー処理方法

Country Status (2)

Country Link
US (2) US6176926B1 (enExample)
JP (1) JP4086932B2 (enExample)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09234579A (ja) * 1996-02-28 1997-09-09 Semiconductor Energy Lab Co Ltd レーザー照射装置
US6555449B1 (en) 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
JP3462053B2 (ja) * 1997-09-30 2003-11-05 株式会社半導体エネルギー研究所 ビームホモジェナイザーおよびレーザー照射装置およびレーザー照射方法および半導体デバイス
JPH11186189A (ja) * 1997-12-17 1999-07-09 Semiconductor Energy Lab Co Ltd レーザー照射装置
JP4663047B2 (ja) 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
US6246524B1 (en) 1998-07-13 2001-06-12 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
US6535535B1 (en) * 1999-02-12 2003-03-18 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and semiconductor device
US6393042B1 (en) 1999-03-08 2002-05-21 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus
JP2001023918A (ja) * 1999-07-08 2001-01-26 Nec Corp 半導体薄膜形成装置
US6573162B2 (en) 1999-12-24 2003-06-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method of fabricating a semiconductor device
US6830993B1 (en) 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
TW523791B (en) 2000-09-01 2003-03-11 Semiconductor Energy Lab Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device
MXPA02005590A (es) 2000-10-10 2002-09-30 Univ Columbia Metodo y aparato para procesar capas de metal delgadas.
US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
TW558861B (en) * 2001-06-15 2003-10-21 Semiconductor Energy Lab Laser irradiation stage, laser irradiation optical system, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
JP3977038B2 (ja) 2001-08-27 2007-09-19 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
TWI378307B (en) 2002-08-19 2012-12-01 Univ Columbia Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
AU2003258289A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
EP1400832B1 (en) * 2002-09-19 2014-10-22 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device
JP5164378B2 (ja) 2003-02-19 2013-03-21 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 逐次的横方向結晶化技術を用いて結晶化させた複数の半導体薄膜フィルムを処理するシステム及びプロセス
US7327916B2 (en) * 2003-03-11 2008-02-05 Semiconductor Energy Laboratory Co., Ltd. Beam Homogenizer, laser irradiation apparatus, and method of manufacturing a semiconductor device
SG137674A1 (en) * 2003-04-24 2007-12-28 Semiconductor Energy Lab Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
JP4152806B2 (ja) * 2003-05-28 2008-09-17 株式会社半導体エネルギー研究所 レーザ光照射装置
US7245802B2 (en) * 2003-08-04 2007-07-17 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
US7318866B2 (en) 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
US7164152B2 (en) 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
WO2005029547A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
WO2005034193A2 (en) 2003-09-19 2005-04-14 The Trustees Of Columbia University In The City Ofnew York Single scan irradiation for crystallization of thin films
US7169630B2 (en) 2003-09-30 2007-01-30 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
US7374985B2 (en) * 2003-11-20 2008-05-20 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device
JP4838982B2 (ja) * 2004-01-30 2011-12-14 株式会社 日立ディスプレイズ レーザアニール方法およびレーザアニール装置
JP4579575B2 (ja) * 2004-05-14 2010-11-10 株式会社半導体エネルギー研究所 レーザ照射方法及びレーザ照射装置
WO2006046495A1 (en) * 2004-10-27 2006-05-04 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, and laser irradiation method, laser irradiation apparatus, and laser annealing method of non-single crystalline semiconductor film using the same
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
EP1708008B1 (en) * 2005-04-01 2011-08-17 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradition apparatus
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
WO2007049525A1 (en) 2005-10-26 2007-05-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and manufacturing method of semiconductor device
WO2007067541A2 (en) 2005-12-05 2007-06-14 The Trustees Of Columbia University In The City Of New York Systems and methods for processing a film, and thin films
US7563661B2 (en) * 2006-02-02 2009-07-21 Semiconductor Energy Laboratory Co., Ltd. Crystallization method for semiconductor film, manufacturing method for semiconductor device, and laser irradiation apparatus
TW200942935A (en) 2007-09-21 2009-10-16 Univ Columbia Collections of laterally crystallized semiconductor islands for use in thin film transistors and systems and methods for making same
WO2009042784A1 (en) 2007-09-25 2009-04-02 The Trustees Of Columbia University In The City Of New York Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
EP2212913A4 (en) 2007-11-21 2013-10-30 Univ Columbia SYSTEMS AND METHOD FOR PRODUCING EPITACTIC STRUCTURED THICK FILMS
KR101162575B1 (ko) 2008-01-07 2012-07-05 가부시키가이샤 아이에이치아이 레이저 어닐링 방법 및 장치
WO2009111340A2 (en) 2008-02-29 2009-09-11 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
US8115137B2 (en) 2008-06-12 2012-02-14 Ihi Corporation Laser annealing method and laser annealing apparatus
DE102008029622B4 (de) * 2008-06-23 2018-05-09 Ihi Corporation Laserglühverfahren und Laserglühvorrichtung
KR20110094022A (ko) 2008-11-14 2011-08-19 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 박막 결정화를 위한 시스템 및 방법
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
WO2021181700A1 (ja) * 2020-03-13 2021-09-16 堺ディスプレイプロダクト株式会社 レーザアニール装置およびレーザアニール方法
CN114769846A (zh) * 2022-05-20 2022-07-22 卡门哈斯激光科技(苏州)有限公司 太阳能光伏电池片无损裂片加热装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365875A (en) * 1991-03-25 1994-11-22 Fuji Xerox Co., Ltd. Semiconductor element manufacturing method
US5372836A (en) * 1992-03-27 1994-12-13 Tokyo Electron Limited Method of forming polycrystalling silicon film in process of manufacturing LCD
JP3562588B2 (ja) 1993-02-15 2004-09-08 株式会社半導体エネルギー研究所 半導体装置の製造方法
JPH0761781A (ja) 1993-08-31 1995-03-07 Press Kogyo Kk フォークリフト
EP1335419A3 (en) 1994-06-15 2003-08-27 Seiko Epson Corporation Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device
US6165876A (en) 1995-01-30 2000-12-26 Yamazaki; Shunpei Method of doping crystalline silicon film
JPH0961781A (ja) 1995-08-29 1997-03-07 Asahi Optical Co Ltd 液晶投影装置
US5837568A (en) 1995-12-12 1998-11-17 Sanyo Electric Co., Ltd. Manufacturing method of semiconductor devices
JP3917231B2 (ja) * 1996-02-06 2007-05-23 株式会社半導体エネルギー研究所 レーザー照射装置およびレーザー照射方法
JP3301054B2 (ja) * 1996-02-13 2002-07-15 株式会社半導体エネルギー研究所 レーザー照射装置及びレーザー照射方法
US5760405A (en) 1996-02-16 1998-06-02 Eaton Corporation Plasma chamber for controlling ion dosage in ion implantation
JP4056577B2 (ja) 1997-02-28 2008-03-05 株式会社半導体エネルギー研究所 レーザー照射方法
JPH10244392A (ja) 1997-03-04 1998-09-14 Semiconductor Energy Lab Co Ltd レーザー照射装置
JPH10253916A (ja) 1997-03-10 1998-09-25 Semiconductor Energy Lab Co Ltd レーザー光学装置
JP4059952B2 (ja) 1997-03-27 2008-03-12 株式会社半導体エネルギー研究所 レーザー光照射方法
JP3770999B2 (ja) * 1997-04-21 2006-04-26 株式会社半導体エネルギー研究所 レーザー照射装置及びレーザー照射方法

Similar Documents

Publication Publication Date Title
JPH10294288A5 (enExample)
JPH10270379A5 (enExample)
US4484334A (en) Optical beam concentrator
EP0080597B1 (en) Optical beam homogenizer
CN100385285C (zh) 多光束多面镜扫描系统
JPH10242073A5 (enExample)
JPH10293267A5 (enExample)
TWI520454B (zh) 用於雷射退火之線成像系統與方法
US20130153553A1 (en) Apparatus and method for the interference patterning of planar samples
WO1987006865A2 (en) Intense laser irradiation using reflective optics
JP2002141301A5 (enExample)
JPH0434723B2 (enExample)
KR101582632B1 (ko) 프레넬 영역 소자를 이용한 기판 절단 방법
WO2020050148A1 (ja) レーザ光走査装置及びレーザ加工装置
JP4413528B2 (ja) レーザ照射装置
JP4073592B2 (ja) レーザ光ビームの整形方法および整形装置ならびにレーザ光薄膜結晶化装置
CA2226825A1 (en) Cross direction web processor
JP2004146823A5 (enExample)
KR100900466B1 (ko) 빔단면 변형과 폴리곤미러를 이용한 레이저 표면처리장치및 그 표면처리방법
JP2001068430A5 (ja) レーザー処理方法
JPS5852754B2 (ja) レ−ザ照射装置
JPS6229152B2 (enExample)
JPS6121193Y2 (enExample)
JPS6368288A (ja) 線状ビ−ム取出装置
JPS58190918A (ja) レ−ザ走査装置