JPH0773102B2 - 半導体ウエーハにチタンケイ化物を蒸着させるための化学蒸着技術 - Google Patents
半導体ウエーハにチタンケイ化物を蒸着させるための化学蒸着技術Info
- Publication number
- JPH0773102B2 JPH0773102B2 JP4298848A JP29884892A JPH0773102B2 JP H0773102 B2 JPH0773102 B2 JP H0773102B2 JP 4298848 A JP4298848 A JP 4298848A JP 29884892 A JP29884892 A JP 29884892A JP H0773102 B2 JPH0773102 B2 JP H0773102B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- chemical vapor
- deposition method
- silane
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W20/047—
-
- H10D64/0112—
-
- H10D64/01125—
-
- H10P14/42—
-
- H10W20/033—
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- H10W20/056—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/147—Silicides
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US789585 | 1991-11-08 | ||
| US07/789,585 US5278100A (en) | 1991-11-08 | 1991-11-08 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05226269A JPH05226269A (ja) | 1993-09-03 |
| JPH0773102B2 true JPH0773102B2 (ja) | 1995-08-02 |
Family
ID=25148080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4298848A Expired - Fee Related JPH0773102B2 (ja) | 1991-11-08 | 1992-11-09 | 半導体ウエーハにチタンケイ化物を蒸着させるための化学蒸着技術 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5278100A (OSRAM) |
| JP (1) | JPH0773102B2 (OSRAM) |
| DE (1) | DE4237587C2 (OSRAM) |
Families Citing this family (576)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4804636A (en) * | 1985-05-01 | 1989-02-14 | Texas Instruments Incorporated | Process for making integrated circuits having titanium nitride triple interconnect |
| US4668530A (en) * | 1985-07-23 | 1987-05-26 | Massachusetts Institute Of Technology | Low pressure chemical vapor deposition of refractory metal silicides |
| US5084417A (en) * | 1989-01-06 | 1992-01-28 | International Business Machines Corporation | Method for selective deposition of refractory metals on silicon substrates and device formed thereby |
| JPH0364473A (ja) * | 1989-04-25 | 1991-03-19 | Varian Assoc Inc | コールドウォールcvd反応器における窒化チタンの蒸着 |
| EP0450106A1 (de) * | 1990-03-30 | 1991-10-09 | Siemens Aktiengesellschaft | Verfahren und Vorrichtung zur Herstellung einer Titannitrid-Schicht für höchstintegrierte Schaltungen mittels chemischer Dampfphasenabscheidung |
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1991
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- 1992-11-09 JP JP4298848A patent/JPH0773102B2/ja not_active Expired - Fee Related
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|---|---|
| DE4237587A1 (OSRAM) | 1993-05-13 |
| DE4237587C2 (de) | 1997-04-03 |
| JPH05226269A (ja) | 1993-09-03 |
| US5278100A (en) | 1994-01-11 |
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