JPH059502B2 - - Google Patents
Info
- Publication number
- JPH059502B2 JPH059502B2 JP58065265A JP6526583A JPH059502B2 JP H059502 B2 JPH059502 B2 JP H059502B2 JP 58065265 A JP58065265 A JP 58065265A JP 6526583 A JP6526583 A JP 6526583A JP H059502 B2 JPH059502 B2 JP H059502B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- strength
- amount
- casting
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 239000002244 precipitate Substances 0.000 claims description 23
- 238000005266 casting Methods 0.000 claims description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000011651 chromium Substances 0.000 claims description 16
- 230000032683 aging Effects 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052726 zirconium Inorganic materials 0.000 claims description 14
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 238000005482 strain hardening Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 238000010309 melting process Methods 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 description 26
- 229910045601 alloy Inorganic materials 0.000 description 23
- 239000000956 alloy Substances 0.000 description 23
- 230000007423 decrease Effects 0.000 description 18
- 238000007747 plating Methods 0.000 description 14
- 238000005452 bending Methods 0.000 description 13
- 239000013078 crystal Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 4
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 229910017813 Cu—Cr Inorganic materials 0.000 description 3
- 238000009749 continuous casting Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910017985 Cu—Zr Inorganic materials 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910019580 Cr Zr Inorganic materials 0.000 description 1
- 229910019817 Cr—Zr Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6526583A JPS59193233A (ja) | 1983-04-15 | 1983-04-15 | 銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6526583A JPS59193233A (ja) | 1983-04-15 | 1983-04-15 | 銅合金 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4262734A Division JP2501275B2 (ja) | 1992-09-07 | 1992-09-07 | 導電性および強度を兼備した銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59193233A JPS59193233A (ja) | 1984-11-01 |
| JPH059502B2 true JPH059502B2 (ru) | 1993-02-05 |
Family
ID=13281911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6526583A Granted JPS59193233A (ja) | 1983-04-15 | 1983-04-15 | 銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59193233A (ru) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680181B2 (ja) * | 1985-04-15 | 1994-10-12 | 古河電気工業株式会社 | リ−ドフレ−ム用銅合金材の製造方法 |
| JPS61242052A (ja) * | 1985-04-19 | 1986-10-28 | Mitsubishi Shindo Kk | 半導体装置用銅合金リ−ド材 |
| DE3527341C1 (de) * | 1985-07-31 | 1986-10-23 | Wieland-Werke Ag, 7900 Ulm | Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung |
| JPS6250428A (ja) * | 1985-08-29 | 1987-03-05 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
| JPS6270540A (ja) * | 1985-09-20 | 1987-04-01 | Mitsubishi Metal Corp | 半導体装置用Ｃｕ合金リ−ド素材 |
| JPS6263632A (ja) * | 1985-09-13 | 1987-03-20 | Mitsubishi Metal Corp | 半導体装置用Ｃｕ合金リ−ド素材 |
| US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
| JPS62130247A (ja) * | 1985-11-29 | 1987-06-12 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
| JPH0717977B2 (ja) * | 1986-04-10 | 1995-03-01 | 古河電気工業株式会社 | 電子機器用銅合金 |
| JPS62158840A (ja) * | 1986-01-07 | 1987-07-14 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
| JP2514926B2 (ja) * | 1986-02-04 | 1996-07-10 | 古河電気工業株式会社 | はんだ接合強度に優れた電子機器用銅合金とその製造法 |
| JP2614210B2 (ja) * | 1986-02-06 | 1997-05-28 | 三菱マテリアル株式会社 | 連続鋳造鋳型用Ｃｕ合金 |
| JPS62218533A (ja) * | 1986-03-18 | 1987-09-25 | Sumitomo Metal Mining Co Ltd | 高導電性銅合金 |
| JPH0788549B2 (ja) * | 1986-06-26 | 1995-09-27 | 古河電気工業株式会社 | 半導体機器用銅合金とその製造法 |
| JPH0784631B2 (ja) * | 1986-10-23 | 1995-09-13 | 古河電気工業株式会社 | 電子機器用銅合金 |
| JP2670670B2 (ja) * | 1986-12-12 | 1997-10-29 | 日鉱金属 株式会社 | 高力高導電性銅合金 |
| JPS63235441A (ja) * | 1987-03-25 | 1988-09-30 | Toshiba Corp | リ−ドフレ−ム材 |
| JPH0768594B2 (ja) * | 1987-04-03 | 1995-07-26 | 株式会社神戸製鋼所 | 熱間加工性に優れた耐マイグレ−シヨン性電気・電子部品用銅合金 |
| JPS63312934A (ja) * | 1987-06-16 | 1988-12-21 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム材 |
| JP2683903B2 (ja) * | 1987-12-16 | 1997-12-03 | 日鉱金属 株式会社 | 半田耐熱剥離性に優れた高力高導電銅合金 |
| JPS63171841A (ja) * | 1988-01-11 | 1988-07-15 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
| JPH01180931A (ja) * | 1988-01-12 | 1989-07-18 | Fujikura Ltd | 銅合金線材 |
| JPS63317635A (ja) * | 1988-05-19 | 1988-12-26 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
| JPH01306534A (ja) * | 1988-05-31 | 1989-12-11 | Yazaki Corp | 細線用銅合金導体 |
| JPH01312047A (ja) * | 1988-06-13 | 1989-12-15 | Yazaki Corp | 高力高導電性銅合金の製造方法 |
| JPH02145737A (ja) * | 1988-11-24 | 1990-06-05 | Dowa Mining Co Ltd | 高強度高導電性銅基合金 |
| JPH02243733A (ja) * | 1989-03-15 | 1990-09-27 | Fujikura Ltd | 銅合金線材 |
| WO1991019320A1 (en) * | 1990-05-31 | 1991-12-12 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor package using it |
| EP0492987B1 (en) * | 1990-12-20 | 1995-06-14 | Kabushiki Kaisha Toshiba | Copper alloys and lead frames made therefrom |
| US5705125A (en) * | 1992-05-08 | 1998-01-06 | Mitsubishi Materials Corporation | Wire for electric railways |
| EP0569036B1 (en) * | 1992-05-08 | 1998-03-11 | Mitsubishi Materials Corporation | Wire for electric railways and method of producing the same |
| JPH05255777A (ja) * | 1992-10-16 | 1993-10-05 | Hitachi Cable Ltd | 半導体用リードフレーム材 |
| US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
| US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| US6053994A (en) * | 1997-09-12 | 2000-04-25 | Fisk Alloy Wire, Inc. | Copper alloy wire and cable and method for preparing same |
| JP3853100B2 (ja) * | 1998-02-26 | 2006-12-06 | 三井金属鉱業株式会社 | 耐摩耗性に優れた銅合金 |
| DE10117447B4 (de) | 2000-04-10 | 2016-10-27 | The Furukawa Electric Co., Ltd. | Ein stanzbares Kupferlegierungsblech und ein Verfahren zur Herstellung desselben |
| JP4329967B2 (ja) | 2000-04-28 | 2009-09-09 | 古河電気工業株式会社 | プラスチック基板に設けられるピングリッドアレイ用ｉｃリードピンに適した銅合金線材 |
| JP3520034B2 (ja) | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
| US6749699B2 (en) * | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
| US7090732B2 (en) | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
| JP3520046B2 (ja) | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
| JP2005113259A (ja) * | 2003-02-05 | 2005-04-28 | Sumitomo Metal Ind Ltd | Ｃｕ合金およびその製造方法 |
| JP3731600B2 (ja) | 2003-09-19 | 2006-01-05 | 住友金属工業株式会社 | 銅合金およびその製造方法 |
| JP4901199B2 (ja) * | 2005-11-29 | 2012-03-21 | 新光機器株式会社 | 抵抗溶接用電極チップ |
| JP5397683B2 (ja) * | 2008-09-26 | 2014-01-22 | 三菱マテリアル株式会社 | 高強度および耐屈曲断線性に優れた銅合金線 |
| JP5834528B2 (ja) * | 2011-06-22 | 2015-12-24 | 三菱マテリアル株式会社 | 電気・電子機器用銅合金 |
| JP5306557B1 (ja) * | 2012-03-29 | 2013-10-02 | 三菱電機株式会社 | 曲率可変ミラー、曲率可変ユニットおよび曲率可変ミラーの作製方法 |
| CN103572090B (zh) * | 2013-07-01 | 2015-06-17 | 浙江省东阳市诚基电机有限公司 | 一种弹片式微电机导电簧片用复合金属材料 |
| CN103920878B (zh) * | 2014-02-25 | 2015-10-28 | 山东科技大学 | 反应熔滴沉积装置及用其制备弥散强化铜的方法 |
| JP6488951B2 (ja) * | 2014-09-25 | 2019-03-27 | 三菱マテリアル株式会社 | 鋳造用モールド材及びＣｕ−Ｃｒ−Ｚｒ合金素材 |
| WO2016047484A1 (ja) * | 2014-09-25 | 2016-03-31 | 三菱マテリアル株式会社 | 鋳造用モールド材及びＣｕ－Ｃｒ－Ｚｒ合金素材 |
| CN105132734A (zh) * | 2015-07-13 | 2015-12-09 | 南通长江电器实业有限公司 | 一种高强度高导电的铜合金材料 |
| JP6693092B2 (ja) * | 2015-11-09 | 2020-05-13 | 三菱マテリアル株式会社 | 銅合金素材 |
| CN105632620A (zh) * | 2016-02-03 | 2016-06-01 | 安徽华联电缆集团有限公司 | 一种计算机用耐高温抗拖拽电缆 |
| CN105702316A (zh) * | 2016-02-03 | 2016-06-22 | 安徽南洋电缆有限公司 | 一种钛合金高性能电缆 |
| CN105609157A (zh) * | 2016-02-03 | 2016-05-25 | 安徽南洋电缆有限公司 | 一种硅合金高性能电缆 |
| CN105609158A (zh) * | 2016-02-17 | 2016-05-25 | 安徽华天电缆有限公司 | 一种铈合金高性能电缆 |
| JP6063592B1 (ja) * | 2016-05-13 | 2017-01-18 | 三芳合金工業株式会社 | 高温ロウ付け性に優れた銅合金管及びその製造方法 |
| CN107805732A (zh) * | 2017-10-23 | 2018-03-16 | 江苏都盛科技发展有限公司 | 一种用于电加热器的新型合金材料 |
| CN107805731A (zh) * | 2017-10-23 | 2018-03-16 | 江苏都盛科技发展有限公司 | 一种用于电加热器的新型合金材料 |
| CN107723502A (zh) * | 2017-11-28 | 2018-02-23 | 徐高杰 | 一种电磁推射装置用高精度v型铜型材 |
| FR3076751B1 (fr) * | 2018-01-18 | 2020-10-23 | Lebronze Alloys | Electrode de soudage pour toles en aluminium ou acier et procede d'obtention de l'electrode |
| CN108866367A (zh) * | 2018-07-24 | 2018-11-23 | 深圳市中科睿金贵材科技有限公司 | 一种铜银合金导线及其制备方法 |
| CN110747365B (zh) * | 2019-11-14 | 2021-01-15 | 中南大学 | 一种高塑性高强度高导电CuCrZr系铜合金及其制备方法 |
| CN111850341A (zh) * | 2020-07-31 | 2020-10-30 | 苏州天兼新材料科技有限公司 | 一种石油工程设备用高强度铜合金材料及其制备方法 |
| CN114752807A (zh) * | 2022-02-28 | 2022-07-15 | 昆明冶金研究院有限公司北京分公司 | 一种Cu-Cr-Nb-Zr系合金及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50145317A (ru) * | 1974-05-15 | 1975-11-21 | ||
| JPS52150327A (en) * | 1976-06-10 | 1977-12-14 | Toshiba Corp | Lead wire and its production method |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS54119328A (en) * | 1978-03-10 | 1979-09-17 | Nippon Mining Co Ltd | Copper alloy for lead frames |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56102537A (en) * | 1980-01-16 | 1981-08-17 | Toshiba Corp | Copper alloy member |
-
1983
- 1983-04-15 JP JP6526583A patent/JPS59193233A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50145317A (ru) * | 1974-05-15 | 1975-11-21 | ||
| JPS52150327A (en) * | 1976-06-10 | 1977-12-14 | Toshiba Corp | Lead wire and its production method |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS54119328A (en) * | 1978-03-10 | 1979-09-17 | Nippon Mining Co Ltd | Copper alloy for lead frames |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56102537A (en) * | 1980-01-16 | 1981-08-17 | Toshiba Corp | Copper alloy member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59193233A (ja) | 1984-11-01 |
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