JPH059502B2 - - Google Patents

Description

[Detailed description of the invention]

[Technical Field of the Invention] The present invention relates to a method for producing a copper alloy having both electrical conductivity and strength. [Technical background of the invention and its problems] Precipitation hardening copper alloys are metal materials with high electrical conductivity and high strength, and are used in various products. The strength of this type of alloy increases as the solution temperature increases. However, when the solution temperature exceeds 980℃, the crystal grains of the alloy become coarser.
Roughness occurs during processing, resulting in poor appearance. There was a need for a material with even higher strength that would not cause such defects. Attempts have been made to add various substances to these copper alloys, but since the strength and electrical conductivity of the material are contradictory properties, it has been difficult to find metallic materials with high electrical conductivity and even higher strength. I couldn't get it. In addition, if the additive element is active, there is a problem that it is difficult to produce a good product with a high yield. [Object of the Invention] In consideration of the above points, the object of the present invention is to provide a method for producing a copper alloy that has high electrical conductivity and even higher strength, and has a good yield. be. [Summary of the Invention] As a result of research on precipitation hardening copper alloys, the present inventors found that chromium 0.01 to 2.0wt% and zirconium 0.005%
Select either or both of ~1.0wt% oxygen
60 ppm or less, the balance being substantially copper. In the method for producing a copper alloy, the ingot is selected, melted, and cast at a casting rate of 5°C/sec or more in the casting process, and the obtained ingot is heated at a final temperature of 600 to 850°C. When performing a solution treatment process after hard working, solution treatment is performed at a solution temperature of 600 to 850℃, followed by cold working, and then aging treatment is performed at an aging temperature of 300 to 500℃ to prevent precipitation. (0.5-50μm) is 100-
It has been found that the above object can be easily achieved by providing a manufacturing method for obtaining a copper alloy with a density of 100,000 pieces/mm ² . Furthermore, it has been found that the purpose of the method for producing a copper alloy can be more easily achieved by adding appropriate amounts of various additive elements to the alloy. Each will be explained below. First, the method for producing the copper alloy of the present invention will be described. FIG. 1 is a process diagram of the manufacturing method. This process has features in the casting process, solution treatment process, and cold working process, and various improvements have been made to the other processes for the purpose of the present invention. First, in the dissolution step, it is preferable that the oxygen content be low, specifically 60 ppm or less. This is because the copper alloy of the present invention contains Cr and Zr, which have a strong affinity for oxygen, and therefore tends to generate nonmetallic inclusions such as oxides. These nonmetallic inclusions are caused by surface defects (peeling, scratches, blisters, cracks, etc.), plating properties (e.g.
Plating of Ag, Ni, Sn, solder, etc.) has a negative effect on repeated bendability, electrical conductivity, and strength. Therefore, reducing oxygen can solve these problems. There are the following six methods for reducing oxygen. (1) When melting is performed using a carbon crucible or a stamp crucible such as magnesia, it is preferable to include carbon in the melting material or molten metal. (2) The carbon used in (1) is preferably of high purity (90% or higher purity), and ultra-high purity carbon (95% or higher) is preferable.
% or more purity) is more preferable. (3) It is preferable to easily add the return material in order to actively utilize the component elements with strong oxygen affinity contained in the return material for deoxidation. (4) In order to avoid contamination with gases and impurities contained in the master alloy, it is preferable to add the master alloy after melting the melted material (copper metal) and then add Zr. (5) It is preferable to add Zr in multiple parts for addition for deoxidation and addition as a component element. (6) After melting the melted material (copper metal), it is preferable to cover the surface of the molten metal with an inert gas. By lowering the oxygen content using the above-described means, the yield of additional elements can also be improved. On the other hand, as oxygen decreases, hydrogen increases, but it is preferable to keep this hydrogen low as well, specifically 10ppm or less, further 5ppm or less, and even less.
It is preferably 3 ppm or less. This is because it causes blistering during heat treatment. As a method for reducing the amount of hydrogen, a method of adding wire copper to copper metal is preferable. As described above, by using a melting method that reduces the amount of oxygen and hydrogen, a copper alloy with few surface defects and good plating properties, repeated bending properties, electrical conductivity, and strength can be obtained. It is very effective for copper alloys. Next, we will discuss the casting process. Since the copper alloy of the present invention contains Zr and Cr, it is likely to cause inclusions on the ingot surface, hot water wrinkles, and cracks on the ingot surface. Therefore, it is preferable to seal the casting path (for example, the funnel, tundish, funnel, etc.) and the mold with an inert gas. Furthermore, by reducing the size of precipitates in the alloy, the repeatability of bending is improved. For this reason, the casting speed is preferably 5°C/second or more, more preferably 10°C/second or more, and even more preferably 15°C/second or more. Continuous casting is preferred as this method and is economically effective. or,
It is preferable to rapidly cool the molten metal in order to prevent coarse crystallization of Cr, Zr, and other additive elements. This method allows casting and solution heat treatment to be performed simultaneously, which not only improves workability but also shortens the process. Therefore, this casting method can easily prevent wrinkles, cracks, and entrainment of inclusions in the ingot, and can easily obtain a specific structure, making it easy to obtain the copper alloy that is the object of the present invention. Next, we will discuss the facing process. If surface cracks or wrinkles occur on the ingot after the casting process, it is preferable to remove them because this will improve the yield of the final product. However, this step may be omitted if there are no surface defects such as hot water wrinkles. Next, we will discuss hot working. This process brings the processed product to the desired dimensions, and the final temperature of hot working is 600°C to 850°C, preferably
By heating the temperature to 700° C. to 820° C., more preferably 750° C. to 800° C., and then rapidly cooling it, hot working and solution treatment can be performed simultaneously, and the process can be simplified. If the final temperature is too high, the conductivity of the copper alloy will be reduced, while if it is too low, the strength will be reduced. Therefore, when this step also serves as a solution treatment step, by setting the final temperature of this step within the above range, a high strength and highly conductive copper alloy can be obtained. Next, the solution treatment process will be described. As a result of experimental research, the inventors of this application found that the solution temperature was 600℃.
By using solution treatment at ~850°C, preferably 700°C ~ 820°C, more preferably 750°C ~ 800°C, a copper alloy with good strength, ductility, repeated bendability, and electrical conductivity can be obtained. I understood. It was also found that during solution treatment, the faster the cooling rate, the more effective the strength is, and specifically, air cooling and water cooling are preferable. This method is also advantageous in terms of energy since it does not require much increase in temperature. This solution treatment step can also be included in the casting step or hot working step, in which case the steps can be shortened. By controlling the solution temperature and cooling rate as described above, it is possible to obtain a copper alloy having a structure that is high in strength and highly conductive. Next, the cold working process will be described. By incorporating this step in the present invention, a copper alloy with even higher strength and good repeated bending properties can be obtained.
The higher the processing rate, the better, specifically 70%~
99%, more preferably 80% to 95%, and even more preferably 85% to 90%. This cold working can work harden the copper alloy and refine the precipitates, improving strength and repeated bending, but if the working rate is too high,
Ductility decreases; on the other hand, if it is too low, strength is lost. Next, talking about the aging treatment process, this process is combined with the previous cold working process at temperatures of 300℃ to 500℃.
Preferably 350°C to 500°C, more preferably 400°C
Aging at temperatures of ~450°C can impart strength, conductivity, and toughness to copper alloys.
At this time, if the temperature is too high, the material will soften, while if the temperature is too low, the strain will not be removed and the repeated bendability will decrease. Therefore, in this cold working step and aging treatment step, by controlling the working rate and aging temperature, it is possible to obtain a structure preferable for strength, repeated bending, ductility, and etching property. Therefore,
By applying the above method to the copper alloy of the present invention, it is possible to provide a copper alloy with even higher strength, high conductivity, and a good yield. Next, the size and distribution of the precipitates will be explained. The size of a precipitate in the present invention refers to the diameter of the smallest circle containing the precipitate when the precipitate is viewed under a microscope. In the present invention, the distribution of precipitates with a size of 0.5 to 50 μm is preferably 100 to 100,000 pieces/mm ² . This means that if the precipitates are too large, the bendability and etching properties will deteriorate, and the size of the precipitates that will substantially affect the mechanical properties is 0.5~
50 μm, and if there are too many precipitates of that size,
This is because the bendability decreases, and on the other hand, if it is too small, the strength and plating properties decrease. It should be noted that good bendability, etching and strength can be obtained if the precipitate satisfies either of the size and distribution ranges described above, but it is more preferable that the precipitate satisfies both. Therefore, by forming the structure of the copper alloy as described above, a copper alloy having good plating properties, etching properties, electrical conductivity, repeated bending properties, and strength can be provided. In order to obtain the size and distribution of the precipitates as described above, the following method is used to produce the precipitates. First, a Cu alloy containing Cr, Zr, etc. is cast by, for example, a continuous casting method as follows. That is, melting and casting is started at a molten metal temperature of 1000 to 1400°C, preferably 1100 to 1300°C, more preferably 1150 to 1250°C, and the cooling rate is 5%/second or more, preferably 10°C/second.
Solidification is performed at a rate of at least 15 seconds, more preferably at least 15° C./second. If the cooling rate is too slow, the precipitates will become large, which is not preferable. Next, after performing hot rolling and cold rolling, solution heat treatment is performed, and cold rolling etc. with a processing rate of 70% to 99%, preferably 80% to 95%, more preferably 85% to 90% are performed. It is finished to a predetermined size by cold working, and then subjected to age hardening treatment by heating at 300 to 550°C, preferably 350 to 500°C, more preferably 400 to 450°C for several hours. The copper alloy produced in this manner has extremely good bendability and hardness because the precipitates are finely and uniformly dispersed in the Cu alloy. Next, let's talk about the ingredients. Add Zr and Cr,
By dispersing it, strength can be improved without reducing conductivity; however, if the amount is too large, the conductivity and workability will be reduced, while if it is too small, the strength and heat resistance will be insufficient. Therefore, for these alloys, the Cr content should be 2% or less, e.g. 0.01~
2.1wt%, Zr is preferably 1.0% or less, for example, in the range of 0.005 to 1.0wt%. In addition, Cr and Zr are very active metals and have a large affinity for oxygen, so they can be selected and
In a method for producing a copper alloy containing 60 ppm or less, the balance being substantially copper, oxides are likely to be formed during melting, and the plating properties are also likely to be reduced. Therefore,
Especially when looking for yield and plating performance of manufacturing method,
The amount of Cr is preferably in the range of 0.01 to 0.4 wt%, and the amount of Zr is preferably in the range of 0.005 to 0.1 wt%. Furthermore, by reducing the amounts of Zr and Cr and adding other inert elements, it is possible to provide a copper alloy that maintains strength and conductivity and is easy to manufacture. Among Cu-Cr alloys, Cu-Zr alloys, and Cu-Cr-Zr alloys, high-temperature strength is highest in this order, and they are suitable for materials that require high-temperature strength such as lead pins and lead frames. Next, we will discuss copper alloys with added components.
By selectively adding the following elements to the Cu-Cr alloy, Cu-Zr alloy, or Cu-Cr-Zr alloy according to the required properties, it is possible to provide a copper alloy that more easily achieves the objects of the present invention. Note Ni, Sn, Fe, Co, Zn, Ti, Be, B, Mg,
P, Ag, Si, Mn, Cd, Al, rare earth elements, Ge,
Nb, V, Hf, Mo, W, Y, Ta, Ga, Sb Furthermore, by adding Ca in addition to the above-mentioned elements, it is possible to provide a copper alloy that easily achieves the object of the present invention. First, the present inventors developed a Cu-Zn alloy with the above components,
It has been found that by selecting one or more of the following elements for a Cu-Cr alloy or a Cu-Cr-Zr alloy, a copper alloy with improved strength can be provided as a combined effect. Note Ni, Sn, Fe, Co, Zn, Ti, Be, B, Mg,
P, Ag, Si, Mn, Cd, Al, rare earth elements, Ge,
Nb, V, Hf, Mo, W, Y, Ta, Ga, Sb A detailed explanation of the above elements is as follows. As for this component range, Ni is 0.005 to 10wt%,
More preferably, it is 0.05 to 5.0 wt%, and even more preferably 0.1 to 2.0 wt%. This is because adding Ni can improve the strength, but too much Ni lowers the conductivity, while too little Ni has no effect. Sn content is 0.005~10wt%, and even 0.05~
5.0 wt%, more preferably 0.1 to 2.0 wt%. Strength can be improved by adding Sn, but too much can reduce conductivity.
On the other hand, if it is too small, it will not be effective. Fe content is 0.005~5.0wt%, even 0.01~
1.0 wt%, more preferably 0.05 to 0.5 wt%. This is because, although adding Fe can improve strength, too much Fe reduces conductivity and solder weather resistance, while too little Fe has no effect. Co content is 0.005~5.0wt%, and even 0.01~
1.0 wt%, more preferably 0.05 to 0.5 wt%. This is because although adding Co can improve the strength, too much Co reduces the conductivity, while too little makes it ineffective. Zn content is 0.005~1.0wt%, even 0.01~
2.0wt%, more preferably 0.05 to 0.5wt%. The strength is improved by adding Zn, but
This is because if the amount is too large, the weather resistance of the solder will decrease, while if the amount is too small, there will be no effect. Ti content is 0.005~5.0wt%, even 0.05~
1.0 wt%, more preferably 0.05 to 0.5 wt%. By adding Ti, it is possible to improve strength and prevent grain coarsening, but if the amount is too large,
This is because the conductivity decreases, and on the other hand, if it is too small, there is no effect. The amount of Be is 0.001 to 2.0wt%, furthermore 0.01 to 1.0wt%,
Furthermore, 0.05 to 0.5 is preferable. This is because the addition of Be improves the strength, but if the amount is too large, the price increases, while if the amount is too small, there is no effect. The amount of B is 0.001 to 1.0wt%, furthermore 0.01 to 0.5wt%,
Furthermore, 0.05 to 0.5 wt% is preferable. This is because adding B makes it possible to improve strength and prevent coarsening of crystal grains, but if the amount is too large, workability decreases, while if it is too small, there is no effect. The amount of Mg is 0.001 to 2.0wt%, furthermore 0.01 to 0.5wt%,
Furthermore, 0.01 to 0.1 wt% is preferable. This is because adding Mg improves strength and deoxidation, but
This is because if the amount is too large, the conductivity and processability will decrease, while if the amount is too small, there will be no effect. The amount of P is 0.001-1.0wt%, furthermore 0.005-0.2wt%,
Furthermore, 0.01 to 0.05 wt% is preferable. By adding P, the strength and deoxidizing ability are improved, but if the amount is too large, the conductivity and solder weather resistance are reduced, while if the amount is too small, there is no effect. Ag amount is 0.001~3.0wt%, and even 0.005~0.5wt
%, more preferably 0.01 to 0.05 wt%. this is,
Adding Ag improves strength, but
This is because if the amount is too large, the price will increase, while if the amount is too small, there will be no effect. The amount of Si is 0.001 to 5.0wt%, furthermore 0.01 to 0.5wt%,
Furthermore, 0.02 to 0.1 wt% is preferable. This is because by adding Si, it is possible to improve strength, improve deoxidizing ability, and prevent crystal grain coarsening, but if the amount is too large, the conductivity will decrease, while if the amount is too small, there will be no effect. The amount of Mn is 0.001 to 10wt%, furthermore 0.01 to 1.0wt%,
Furthermore, 0.02 to 0.1 wt% is preferable. This is because adding Mn improves the strength and deoxidizing ability, but if the amount is too large, the conductivity decreases, while if the amount is too small, there is no effect. The amount of Cd is 0.001 to 5.0wt%, furthermore 0.01 to 0.2wt%,
Furthermore, 0.02 to 0.1 wt% is preferable. This is because adding Cd improves strength, but too much Cd increases the price and reduces workability, while too little Cd has no effect. Al amount is 0.001~10wt%, furthermore 0.005~1.0wt%,
Furthermore, 0.05 to 0.5 wt% is preferable. This is because adding Al improves strength and deoxidizing ability, but if the amount is too large, conductivity and workability decrease.
On the other hand, if it is too small, it will not be effective. The amount of rare earth elements is 0.001 to 2.0wt%, and even 0.05
~0.5wt% is preferred. The addition of rare earth elements improves strength and deoxidizing ability, but
This is because if the amount is too large, the price will increase and the processability will be reduced, while if the amount is too small, there will be no effect. The amount of Ge is 0.001 to 5.0wt%, and even 0.01 to 0.1wt%
is preferred. This is achieved by adding Ge.
The strength is improved and coarsening of crystal grains can be easily prevented, but if the amount is too large, the conductivity will be reduced, while if the amount is too small, there will be no effect. Next, the second group elements will be explained. These elements are also preferable as additive elements for high-strength, high-conductivity copper alloys. These elements are effective when used alone or in combination with the elements of the first group. This is because adding Nb improves strength and makes it easier to prevent coarsening of crystal grains.
If the amount is too large, the conductivity and processability will decrease, while if the amount is too small, there will be no effect. Therefore, the amount of Nb is
0.005~5.0wt%, furthermore 0.01~0.5wt%, furthermore
0.1-0.5wt% is preferable. By adding V, it is possible to improve strength and prevent crystal grain coarsening, but if the amount is too large, the conductivity and workability will decrease, while if the amount is too small, there will be no effect. Therefore, the V amount is 0.005 to 5.0wt%, and even
0.01 to 0.5 wt%, more preferably 0.1 to 0.5 wt%. By adding Hf, it is possible to improve strength and prevent crystal grain coarsening, but if the amount is too large,
Conductivity and processability are reduced, while too little amount has no effect. Therefore, the amount of Hf is preferably 0.005 to 5.0 wt%, more preferably 0.1 to 0.5 wt%, and even more preferably 0.05 to 0.5 wt%. By adding Mo, it is possible to improve strength and prevent grain coarsening, but if the amount is too large,
It causes an increase in price and a decrease in processability, while too little amount is ineffective. Therefore, the amount of Mo is 0.001~
2.0wt%, more preferably 0.05 to 0.5wt%. By adding W, strength can be improved and grain coarsening can be prevented, but if the amount is too large, the price will increase and workability will be reduced, while if the amount is too small, there will be no effect. Therefore, the W content is preferably 0.001 to 2.0 wt%, more preferably 0.05 to 0.5 wt%. By adding Y, the strength and deoxidizing ability are improved, but if the amount is too large, the price will increase and the processability will be lowered, while if the amount is too small, there will be no effect. Therefore, the amount of Y is 0.001~2.0wt%, furthermore 0.05~
0.5wt% is preferred. By adding Ta, it is possible to improve strength and prevent coarsening of crystal grains, but if the amount is too large, the conductivity will decrease and the price will increase, while if the amount is too small, there will be no effect. Therefore, the amount of Ta is 0.001~2.0wt
%, more preferably 0.05 to 0.5 wt%. By adding Ga, it is possible to improve strength and prevent coarsening of crystal grains, but if the amount is too large, the conductivity will decrease, while if the amount is too small, there will be no effect. Therefore, the Ga amount is 0.001 to 5.0wt%, and even 0.01 to 5.0wt%.
0.1wt% is preferred. By adding Sb, it is possible to improve strength and prevent coarsening of crystal grains, but if the amount is too large, the conductivity and workability will decrease, while if the amount is too small, there will be no effect. Therefore, the amount of Sb is preferably 0.001 to 5.0 wt%, more preferably 0.01 to 0.1 wt%. Furthermore, by adding Ca, the deoxidizing ability and machinability are improved. However, if the amount is too large, the workability will deteriorate, while if it is too small, no effect will be produced, so the amount of Ca was set at 0.001 to 1.0 wt%. Furthermore, 0.01 to 0.1 wt% is preferable. Each additive element has been described above, but these may be appropriately selected depending on the desired characteristics of the copper alloy. Required properties include, for example, plating properties, electrical conductivity, bending properties, heat resistance, and mechanical strength. For example, when plating properties and strength are important, Mg, Mn, Y,
If bendability and strength are important, Nb, V, etc. can be selected as additive elements.
You can choose Hf, Al, Ge, Ga, Sb, etc. Examples of products that require these characteristics include lead frames, lead pins, high-strength conductive wires, casting molds, continuous casting molds, rolls for manufacturing amorphous alloys, electrodes for resistance welding, and parts for heat exchangers ( fins, pipes, bulkheads, etc.), battery cans, decorative materials,
There are bimetals, glass forming parts, vacuum containers, welding torches, lead wires, etc. Representative examples of the preferred components, manufacturing methods, structures, and uses described above are shown in Table 1. ◎ in the characteristics and organization column in Table 1
The definition of 〇△ is as follows. Conductivity: ◎Electrical conductivity 85% or more 〇Electrical conductivity 75% or more but less than 85% △Electrical conductivity 65% or more and less than 75% Strength: ◎Hardness 150Hv or more 〇Hardness 140Hv or more but less than 150Hv △Hardness 120Hv or more but less than 140Hv Heat resistance; ◎500℃ or more 〇400℃ or more but less than 500℃ △300℃ or more and less than 400℃Repetition; ◎Bending property 5 times or more 〇4 times △3 times plating solderability; Ag, Au plating and Pb-Sn
Soldering can be done with just a simple pre-treatment (pickling) ◎ Easy 〇 Possible △ Difficult structure: Average particle size of precipitates ◎ 0.5 μm or more and less than 5 μm 〇 5 μm or more and less than 10 μm △ 10 μm or more and less than 50 μm Repeated bending is measured here As shown in Fig. 2, a sample 1 (thickness 0.25 mm, width 0.5 mm, length 20 mm) is supported by a fixing jig 2 such as a chuck.
With a load of 3 (1/2 lb) applied, bend it 90 degrees using a fixing jig as shown by the dotted line. This bending is repeated and the number of times until breakage is defined as the number of repeated bending times (characteristic). In addition, Cu with Cr of 0.3 to 0.7wt% and Zr of less than 0.1
-Cr-Zr alloy, Cr less than 0.3 and Zr 0.1~
Similarly favorable properties and structure were obtained for the 0.5wt% Cu-Cr-Zr alloy.

【table】

[Table] Ingots of alloys with the composition shown in Table 2 were prepared, and these ingots were solution-treated at about 750℃, then cold-worked at a working rate of about 85%, and then heated at about 450℃. Samples 1 to 22 were obtained by aging treatment. The characteristics of five samples of each sample were examined and the results are shown in Table 2. For comparison, Samples 23 to 33 having different composition ranges or manufacturing methods from those of the present application were investigated in the same manner as in the Examples, and the results are also listed in Table 2. Here, the distribution of precipitates in the structure is 0.5 to
It is the average number of precipitates of 50μm, and its unit is pieces/
^mm2 . In addition, the definition of 〇△× in the characteristics column is as follows. Strength:〇Hardness 140Hv or more △Hardness 120Hv or more but less than 140Hv ×Hardness less than 120Hv Electrical conductivity: 〇75% or more △65% or more and less than 75% × Less than 65% Repeated bending: 〇4 times or more △3 times or more × Less than 3 times Plating property: A sample with 10 μm Ag plating was approx.
Blistering caused by heating at 450℃ for 1 minute: 〇 0 △ Bulging of plating less than 0.5 × Blistering of 0.5 mm or more Overall evaluation: 〇 Usable items × Unusable items It is clear from this table Thus, it can be seen that the Cu alloy using the components, structure, and manufacturing method of the present invention is effective. Similar effects can be obtained with combinations other than those shown in 1 to 21.

【table】

〔Effect of the invention〕

As is clear from Table 2 above, the copper alloy (No. 1) obtained by the alloy composition and manufacturing method of the present invention
-22) have excellent properties, with all properties being rated △ or higher, and the overall evaluation being 0. On the other hand, comparative example alloys (Nos. 23 to 33) with different alloy compositions or different manufacturing methods have × in any of the characteristics, and therefore have × in the overall evaluation, and do not meet the objectives of the present invention. Not suitable as a copper alloy. The present invention selects either or both of 0.01 to 2.0 wt% chromium and 0.005 to 1.0 wt% zirconium,
In a manufacturing method for obtaining a copper alloy containing oxygen of 60 ppm or less and the balance substantially consisting of copper, or a copper alloy in which an appropriate amount of various additive elements is added to the copper alloy, casting is performed at a pouring rate of 5°C/sec or more in the melting and casting process. The resulting ingot is heated to a final temperature of 600 to 850℃.
After hot working, when performing further solution treatment process, after solution treatment at a solution temperature of 600 to 850℃,
By performing cold working and then aging treatment at an aging temperature of 300 to 500℃, precipitates (0.5 to 50 μm)
By obtaining a copper alloy containing 100 to 100,000 pieces/mm ² , it is possible to provide a copper alloy that has high electrical conductivity and even higher strength, and has a good yield.

[Brief explanation of the drawing]

FIG. 1 is a manufacturing process diagram of the copper alloy of the present invention, and FIG. 2 is a block diagram showing a method for measuring repeated bending. 1...sample, 2...fixing jig, 3...load.

Claims (1)

[Claims] 1. Chromium 0.01-2.0wt%, zirconium 0.005-2.0wt%
Select either or both of 1.0wt% oxygen
60 ppm or less, the remainder being substantially copper, in a method for producing a copper alloy, in which casting is performed at a pouring rate of 5°C/sec or more in the melting and casting steps, and the resulting ingot is hot worked at a final temperature of 600 to 850°C. After that, when performing further solution treatment process, the solution temperature is 600~
After solution treatment at 850℃, cold working is performed, and then aging treatment is performed at an aging temperature of 300 to 500℃, resulting in 100 to 100,000 precipitates (0.5 to 50μm)/
A method for producing a copper alloy having both electrical conductivity and strength, which is characterized by obtaining a copper alloy having a copper alloy of ² mm2. 2 Chromium 0.01~2.0wt%, zirconium 0.005~
1.0wt% of either or both of the following elements, further selectively containing one or more of the following elements, containing 60ppm or less of oxygen, and the remainder consisting essentially of copper, melting, casting, etc. After casting at a casting speed of 5°C/sec or more in the process and hot working the obtained ingot at a final temperature of 600 to 850°C, further solution treatment is performed at a solution temperature of 600 to 850°C. After the chemical treatment, cold working is performed, and then aging treatment is performed at an aging temperature of 300 to 500°C, so that the precipitates (0.5 to 50 μm) are reduced to 100 to 100 μm.
A method for producing a copper alloy having both electrical conductivity and strength, characterized by obtaining a copper alloy containing 100,000 pieces/ ^mm2 . (wt%) Ni 0.005-10%, Sn 0.005-10% Fe 0.005-5%, Co 0.005-5% Zn 0.005-10%, Ti 0.005-5% Be 0.001-2%, B 0.001-1% Mg 0.001-2%, P 0.001-1% Ag 0.001-3%, Si 0.001-5% Mn 0.001-10%, Cd 0.001-5% Al 0.001-10%, Rare earth elements 0.001-2% Ge 0.001-5%, Nb 0.005~5% V 0.001~5%, Hf 0.005~5% Mo 0.001~0.2%, W 0.001~2% Y 0.001~2%, Ta 0.001~2% Ga 0.001~5%, Sb 0.001~5% 3 Chromium 0.01~2.0wt%, zirconium 0.005~
Select either or both of 1.0wt%, and also Ca
In a method for producing a copper alloy containing 0.001 to 1.0 wt% of oxygen, 60 ppm or less of oxygen, and the remainder substantially consisting of copper,
Casting is performed at a pouring rate of 5°C/sec or higher during the melting and casting process, and the resulting ingot is heated to a final temperature of
After hot working at 600 to 850℃, when performing a further solution treatment process, perform solution treatment at a solution temperature of 600 to 850℃, cold working, and then apply an aging temperature of 300℃.
A method for producing a copper alloy having both electrical conductivity and strength, characterized by obtaining a copper alloy containing 100 to 100,000 precipitates (0.5 to 50 μm)/mm ² by aging at ~500°C.